PG68
Contextual Info: Package Drawings November 13, 1997 Version 1.2 10 Package Drawings Ceramic PGA Packages - PG68, PG84 10-36 November 13, 1997 (Version 1.2)
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PG68
Abstract: PK022
Contextual Info: R Ceramic PGA PG68, PG84 Package PK022 (v1.1) April 6, 2001 2001 Xilinx, Inc. All rights reserved. All Xilinx trademarks, registered trademarks, patents, and disclaimers are as listed at http://www.xilinx.com/legal.htm. All other trademarks and registered trademarks are the property of their respective owners. All specifications are subject to change without notice.
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XC2064
Abstract: XC3030A xc3142 PP175 Xilinx XC3090 xc2064 fpga xact xc3090 XC3190 Xilinx XC3090A X04008
Contextual Info: Component Availability Pins 44 Type Plastic PLCC Plastic DIP Plastic VQFP Plastic PLCC Ceramic PGA Plastic PLCC Ceramic PGA Plastic PQFP Plastic TQFP Code PC44 PD48 VQ64 PC 68 PG68 PC84 PG84 PQ100 TQ100 ✓ ✓ ✓ ✓ ✓ ✓ XC2064 48 64 68 XC2O10 ✓ ✓
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xc2064xc2o10xc2064lxc2o10l+15xc3020xc3030xc3042xc3064xc3090xc3020axc3030axc3142pp175xilinx xc3090xc2064 fpgaxact xc3090xc3190xilinx xc3090ax04008
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PG68
Contextual Info: R Ceramic PGA PG68, PG84 Packages PK022 (v1.0) June 1, 2000 2000 Xilinx, Inc. All rights reserved. All Xilinx trademarks, registered trademarks, patents, and disclaimers are as listed at http://www.xilinx.com/legal.htm. All other trademarks and registered trademarks are the property of their respective owners. All specifications are subject to change without notice.
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qfn 3x3 tray dimension
Abstract: XCDAISY BFG95 XC5VLX330T-1FF1738I pcb footprint FS48, and FSG48 WS609 jedec so8 Wire bond gap XC3S400AN-4FG400I FFG676 XC4VLX25 cmos 668 fcbga
Contextual Info: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.5 November 6, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the
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ug112ug072ug075xapp427+10qfn 3x3 tray dimensionxcdaisybfg95xc5vlx330t-1ff1738ipcb footprint fs48, and fsg48ws609jedec so8 wire bond gapxc3s400an-4fg400iffg676xc4vlx25 cmos 668 fcbga
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XC4010-5PG191M
Abstract: XC4005-5PG156M PA44-48U adapter datasheet pa44-48u SDP72 xilinx 1736a 5962-9230503MXC XC4010-5CB196B SDP-UNIV-44 XC4010-5CB196M
Contextual Info: XCELL THE QUARTERLY Issue 19 Fourth Quarter 1995 JOURNAL FOR XILINX PROGRAMMABLE LOGIC USERS GENERALFEATURES R The Programmable Logic CompanySM Inside This Issue: GENERAL Fawcett: 100,000+ Gates . 2 Guest Editorial . 3
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xc4010-5pg191mxc4005-5pg156mpa44-48u adapter datasheetpa44-48u+6sdp72xilinx 1736a5962-9230503mxcxc4010-5cb196bsdp-univ-44xc4010-5cb196m
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SDP-UNIV-44
Abstract: sdp72 PA44-48U adapter datasheet XC6200 ALL-07 guide pa44-48u allpro 88 PLCC44 pinout design book Micromaster
Contextual Info: XCELL THE QUARTERLY Issue 18 Third Quarter 1995 JOURNAL FOR XILINX PROGRAMMABLE LOGIC USERS GENERALFEATURES R The Programmable Logic CompanySM Inside This Issue: GENERAL Fawcett: PCI Compliance . 2 Guest Editorial: Chuck Fox on Developing New PLD Solutions . 3
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sdp-univ-44sdp72pa44-48u adapter datasheetxc6200+6all-07 guidepa44-48uallpro 88plcc44 pinoutdesign bookmicromaster
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RUB25
Abstract: IDT7133SA7LA
Contextual Info: INTEGRATED 3ÛE DEVICE D • 4Û25771 DGQbbS7 1 ■ IDT PRELIMINARY IDT7133SA7LA IDT7143SA/LA CMOS DUAL-PORT RAMS 3 2 K 2 Kx 16-BIT Integrated Device Technology, Inc. RAMs. The IDT7133 is designed to be used as a stand-alone 16-bit dual-port RAM or as a "MASTER" dual-port RAM
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16-bitidt7133sa7laidt7143sa/la35/45/55/70ns+725/35/45/55/70/nsidt7133/43saidt7133/43la500mwidt7133idt7143rub25
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MO-83-AF
Abstract: PQFP moisture sensitive handling and packaging footprint jedec MS-026 TQFP schematic impulse sealer BGA 11x11 junction to board thermal resistance EIA standards 481 JEDEC MS-026 footprint eftec 64 EFTEC-64 footprint jedec MS-026 TQFP 128
Contextual Info: Packages and Thermal Characteristics August 6, 1996 Version 1.2 Number of Available I/O Pins Max 44 64 68 84 100 120 132 144 156 160 164 175 176 191 196 208 223 225 228 240 299 304 352 411 432 499 I/O XC7236A 36 XC7272A 72 XC7318 38 36 56 72 38 XC7336
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xc7236axc7272axc7318xc7336+16xc7336qxc7354xc7372xc73108xc73144xc9536mo-83-afpqfp moisture sensitive handling and packagingfootprint jedec ms-026 tqfpschematic impulse sealerbga 11x11 junction to board thermal resistanceeia standards 481jedec ms-026 footprinteftec 64eftec-64footprint jedec ms-026 tqfp 128
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XC5200
Abstract: XC5202 XC5204 XC5206 XC5210 XC5215 XC3020A - PQ100
Contextual Info: 48 64 68 84 100 120 132 144 156 160 164 38 175 176 184 191 196 208 223 225 228 240 299 304 352 411 432 499 596 PLASTIC LCC PLASTIC QFP PLASTIC VQFP CERAMIC LCC PLASTIC DIP PLASTIC VQFP PLASTIC LCC CERAMIC LCC CERAMIC PGA PLASTIC LCC CERAMIC LCC CERAMIC PGA
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xc520016-bit24-bit16-to-1+8xc5210-5xc5210-3xc5202xc5204xc5206xc5210xc5215xc3020a - pq100
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LM7805
Abstract: elna 50v, 1uF LM7805 voltage regulator d 1879 TRANSISTOR BCP56 PTFA181001GL ELNA capacitor 100 uf 50v
Contextual Info: Preliminary PTFA181001GL PTFA181001HL Confidential, Limited Internal Distribution Thermally-Enhanced High Power RF LDMOS FETs 100 W, 1805 – 1880 MHz Description The PTFA181001GL and PTFA181001GL are 100-watt LDMOS FETs designed for EDGE and WCDMA power amplifier applications in the
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ptfa181001glptfa181001hl100-wattlm7805+5elna 50v, 1uflm7805 voltage regulatord 1879 transistorbcp56elna capacitor 100 uf 50v
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TPS5117
Abstract: SN0608098 EMC4002 MEC5035 SRN100KJ-6-GP BCM5761 WISTRON power sequence EPSON C691 MAIN THERMAL fuse M33 07F schematic lcd inverter dell
Contextual Info: 5 4 3 2 1 D D FOOSE 15" UMA Schematics Document uFCPGA Mobile Penryn www.kythuatvitinh.com 2008-06-04 Intel Cantiga-GM + ICH9M C C REV : -1 B B DY : Nopop Component 5761 : Use BCM5761E 5756 : Use BCM5756M B_TPM : Use LOM TPM C_TPM : Use China TPM A A Wistron Corporation
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bcm5761ebcm5756misl6260emc4002+14slg8lp554vscriptionpc100706pr8140pc9410pr81411tps5117sn0608098mec5035srn100kj-6-gpbcm5761wistron power sequenceepson c691 mainthermal fuse m33 07fschematic lcd inverter dell
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SN0608098-GP
Abstract: BQ24745RHDR-GP lcd 15.4 inverter EPSON C691 MAIN AMD RS780 tps51125 MEC5035 foxconn TPS51117PWR-GP BCM5761
Contextual Info: 5 4 3 2 1 FOOSE UMA Schematics Document AMD 15.4" D D AMD Giffin CPU S1G2 AMD RS780 +SB700 C C 2008-01-04 REV : SB B B DY : Nopop Component 5761 : Use BCM5761E 5756 : Use BCM5756M B_TPM : Use LOM TPM C_TPM : Use China TPM <Variant Name> A A Wistron Corporation
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rs780sb700bcm5761ebcm5756m+13ics9lprs474aklft4x80107237-sbbq24745rhdr-gpsn0608098-gplcd 15.4 inverterepson c691 mainamd rs780tps51125mec5035foxconntps51117pwr-gpbcm5761
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PG560
Contextual Info: PG SERIES The PG series fixed, chip inductor provides a rectangular shape which is easily handled by automatic equipment for assembly into thick or thin film circuitry. An edge plating is provided for forming a solder fillet. The special metallization on the contact
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CC44
Abstract: packages
Contextual Info: Package Drawings February 2, 1999 Version 1.3 11 R Package Drawings Ceramic DIP Package - DD8 11-24 February 2, 1999 (Version 1.3) R Package Drawings Plastic DIP Package - PD8 11 February 2, 1999 (Version 1.3) 11-25 R Package Drawings SOIC and TSOP Packages - SO8, VO8
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cb164xc3000cb100cb196+7xc4000cb228fg256fg456fg680cc44packages
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1156-BALL
Abstract: bga 896 411PI BF957 132-ball package
Contextual Info: DataSource CD-ROM Q1-02 Contents Package Drawings Products Guide Product Data Sheets Package Drawings Packaging and Thermal Characteristics Application Notes White Papers Software/Hardware Manuals Xcell Journal Online Xcell Journal Archives Inside Out Columns
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q1-02xapp415cg1156cb100+11cb164cb196cb228pg120pg132pg1561156-ballbga 896411pibf957132-ball package
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MS-034-AAn-1
Abstract: ak 957 MS-034 1152 BGA BGA 31 x 31 mm MO-047 MS026-ACD MO-113-AA-AD MS-034-AAU-1 MO-151 AAL-1 OPD0002
Contextual Info: DataSource CD-ROM Q1-02 Contents Packaging and Thermal Characteristics Package Drawings Thermal Application Note Package Information Package Electrical Characterization Component Mass by Package Type Thermally Enhanced Packaging Moisture Sensitivity Tape and Reel
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q1-02bf957bg225bg256+16bg352bg432bg492bg560bg575bg728ms-034-aan-1ak 957ms-034 1152 bgabga 31 x 31 mmmo-047ms026-acdmo-113-aa-adms-034-aau-1mo-151 aal-1opd0002
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j001 1003
Abstract: 74LS00 TTL Signetics 2650 VCU 2136 j001 1003 ic signetics hand book signetics 2650 8k ram ic j001 1003 strz 2026 pss 3056
Contextual Info: > l b l IC I I V » 2650 flllCROPROCEftOR CONTENTS I IN T R O D U C T IO N IN T R O D U C IN G T H E 26 50 F A M I L Y . 3 F E A T U R E S OF T H E 26 50 F A M IL Y 4 4 Microprocessor F e a tu re s .
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j001 100374ls00 ttlsignetics 2650vcu 2136+6j001 1003 icsignetics hand booksignetics 2650 8k ramic j001 1003strz 2026pss 3056
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40605
Abstract: 40605-004 1224
Contextual Info: Section 1_68: Miscellaneous Screws Combination Pan Head, Pilot Point, Mounting Screws The #12-24 Combination Pan Head, Pilot Point Mounting Screws attach equipment to racks and cabinets. A cutting notch in the thread removes paint in threaded holes to improve
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com/catalog/section1/pg684060540605-0041224 |
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OSC52
Abstract: XC3000 XC3100A XC4000A XC4000E XC4025 XC5200 vq100 xilinx xc3000 xact reference guide
Contextual Info: book : cover 1 Wed Jul 3 10:08:16 1996 R Release Document XACTstep Version 5.2/6.0 Synopsys October 1995 Read This Before Installation book : cover 2 Wed Jul 3 10:08:16 1996 Synopsys Xilinx Development System book : online i Wed Jul 3 10:08:16 1996 Installing Online Documentation
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osc52xc3000xc3100axc4000a+6xc4000exc4025xc5200vq100xilinx xc3000xact reference guide
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XC3030A
Abstract: XC3020A XC3020L XC3030L XC3042A XC3042L XC3064A XC3064L XC3090A XC3090L
Contextual Info: 44 12 48 64 68 84 100 120 132 144 156 160 164 175 176 184 191 196 208 223 225 228 240 299 304 352 411 432 499 596 PLASTIC LCC PLASTIC QFP PLASTIC VQFP CERAMIC LCC PLASTIC DIP PLASTIC VQFP PLASTIC LCC CERAMIC LCC CERAMIC PGA PLASTIC LCC CERAMIC LCC CERAMIC PGA
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pq100tq100vq100cb100+16pg120pp132pg132tq144pg144pg156xc3030axc3020axc3020lxc3030lxc3042axc3042lxc3064axc3064lxc3090axc3090l
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XC3020A
Abstract: XC3020L XC3030A XC3030L XC3042A XC3042L XC3064A XC3064L XC3090A XC3090L
Contextual Info: 44 48 64 68 84 100 120 132 144 156 160 164 24 175 176 184 191 196 208 223 225 228 240 299 304 352 411 432 475 560 PLASTIC LCC PLASTIC QFP PLASTIC VQFP CERAMIC LCC PLASTIC DIP PLASTIC VQFP PLASTIC LCC CERAMIC LCC CERAMIC PGA PLASTIC LCC CERAMIC LCC CERAMIC PGA
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tq144pg144pg156pq160+16cq164cb164pp175pg175tq176pg184xc3020axc3020lxc3030axc3030lxc3042axc3042lxc3064axc3064lxc3090axc3090l
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XC2064
Abstract: XC3030 XC2018 XC3020 XC3020A XC3030A XC3042 XC3064 XC3090 xc5204
Contextual Info: 10 44 48 64 68 84 100 120 132 144 156 160 164 175 176 184 191 196 208 223 225 228 240 299 304 PLASTIC LCC PLASTIC QFP PLASTIC VQFP CERAMIC LCC PLASTIC DIP PLASTIC VQFP PLASTIC LCC CERAMIC LCC CERAMIC PGA PLASTIC LCC CERAMIC LCC CERAMIC PGA CERAMIC QFP PLASTIC PQFP
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hp laptop inverter board schematic
Abstract: XC5000 Smart Tuner nu-horizons LEAP-U1 echo delay reverb ic xilinx 1736a ALPS tv tuner hp laptop battery pinout schematic diagram of laptop inverter working of ic 7493
Contextual Info: XCELL Issue 20 First Quarter 1996 THE QUARTERLY JOURNAL FOR XILINX PROGRAMMABLE LOGIC USERS R The Programmable Logic CompanySM Inside This Issue: GENERAL Fawcett: PLDs, Pins, PCBs . 2 Guest Editorial . 3
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hp laptop inverter board schematicxc5000 smart tunernu-horizonsleap-u1+6echo delay reverb icxilinx 1736aalps tv tunerhp laptop battery pinoutschematic diagram of laptop inverterworking of ic 7493
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