CC44 Search Results

CC44

Abstract: xilinx cc-44
Contextual Info: R PK064 v1.0 October 28, 2002 Ceramic Chip Carrier (CC44) Package 2002 Xilinx, Inc. All rights reserved. All Xilinx trademarks, registered trademarks, patents, and disclaimers are as listed at http://www.xilinx.com/legal.htm. All other trademarks and registered trademarks are the property of their respective owners. All specifications are subject to change without notice.

mcc4412i01b

Abstract: ixys mcc95 mcc56-12i08b MCC44-12I01B MDD95-16N1 MCC72-12I01 T0240AA MCC95-08I08B IXYS MCC44 IXYS MDD95
Contextual Info: MHTEPTEKC www.i-t.su info@i-t.su Ten: 495 739-09-95, 644-41-29 TupucTopHbie m .qMOflHbie MOflynM ^ m p m u IXYS Kofl: U r rm I t(r m s ) I t (a v ) M CC44-12I01B M CC56-12I08B M CC72-12I01B M CC95-08I01B M CC95-08I08B MCC162-08I01 M CD26-08I08B M CD56-08I08B

VQFP44 package

Abstract: isp Cable Version 3.0 VQ44 XQR18V04 XQVR1000 XQVR300 XQVR600 fpga radiation XQR2V1000 XQR18V04VQ44N
Contextual Info: QPro XQR18V04 Radiation Hardened 4Mbit QML ISP Configuration Flash PROM R DS082 v1.4 December 15, 2003 5 Features • Description Operating Temperature Range: –55° C to +100° C MeV/cm2/mg • Latch-Up Immune to LET >120 • Guaranteed TID of 30 kRad(Si) per spec 1019.5

18V04

Abstract: XQ18V04 600E VQ44 XQR18V04 XQV100 18V00
Contextual Info: QPRO XQ18V04 XQR18V04 QML In-System Programmable Configuration PROMs R DS082 (v1.1) July 27, 2001 5 Preliminary Product Specification Features Description • Xilinx introduces the QPro XQ18V04 and XQR18V04 series of in-system programmable and radiation hardenned

qfn 3x3 tray dimension

Abstract: XCDAISY BFG95 XC5VLX330T-1FF1738I pcb footprint FS48, and FSG48 WS609 jedec so8 Wire bond gap XC3S400AN-4FG400I FFG676 XC4VLX25 cmos 668 fcbga
Contextual Info: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.5 November 6, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the

xilinx pq-160

Abstract: xcs20 316 SO8 XC95 XC95144XL XC95144XL prom XC1700 XC4000XV XC40110XV XC40150XV
Contextual Info: Device Selection Guide 384 600 864 1,176 1,536 2,400 3,456 4,704 6,144 1,536 2,400 3,456 4,704 6,144 9,600 13,824 18,816 24,576 180 196 260 284 324 404 500 510 510 see note 2 Total CLBs Total CLBs Total Flip-Flops Max. I/O Package 196 400 576 1,024 1,024

XQR18V04

Abstract: XQVR1000 XQVR300 XQVR600 SelectMAP Out-14 CC-44 XQR2V1000
Contextual Info: R < B L QPro XQR18V04 Radiation-Tolerant 4-Mbit QML ISP Configuration Flash PROM DS082 v1.6 March 15, 2007 Product Specification Features • Operating temperature range: –55°C to +100°C • IEEE STD 1149.1 Boundary-Scan (JTAG) support • Program/erase temperature range: 0°C to +85°C

fpga radiation

Abstract: XAPP185 HW-130 XQR1704L XQR4013XL XQR4036XL XQ1701LCC44B 1704L XQR4000XL XQR4
Contextual Info: QPRO Series Configuration PROMs XQ including Radiation-Hardened Series (XQR) R DS062 (v2.0) June 1, 2000 2 Advance Product Specification Features Description • Configuration one-time programmable (OTP) read-only memory designed to store configuration bitstreams of

HN27C4096HG

Abstract: HN27C4096HG-85 HN27C4906HCC-85 cm218
Contextual Info: HN27C4096HG/HCC Series 262,144-word x 16-bit CMOS UV Erasable and Programmable ROM Description HN27C4096HG/HCC is a 4-Mbit ultraviolet erasable and electrically programmable ROM, featuring high speed and low power dissipation. Fabricated on advanced fine process and high speed circuitry technique, the

HN27C4096AG-12

Abstract: HN27C4096ACC-10 HN27C4096AG-10 HN27C4096A HN27C4096ACC-12 HN27C4096ACC-15 HN27C4096AG-15 CC44 Hitachi DSA00314
Contextual Info: HN27C4096AG/ACC Series 262144-word x 16-bit CMOS UV Erasable and Programmable ROM Description The Hitachi HN27C4096AG/ACC is a 4-Mbit ultraviolet erasable and electrically programmable ROM, featuring high speed and low power dissipation. Fabricated on advanced fine process and high speed circuitry

IC51-128

Abstract: transistor fpq 630 PC-68 TTP-48DF OF IC 7421 Enplas fpq Enplas PT740 AB am fm radio Hitachi DSAUTAZ005
Contextual Info: Hitachi Semiconductor Package Data Book Introduction Contents Section 1 Introduction of Packages 1.1 Types of Packages and Advantages 1.2 IC Package Name and Code Indication 1.3 Method of Indicating IC Package Dimensions 1.4 Lineups in Terms of Shapes and Materials

CC44

Abstract: packages
Contextual Info: Package Drawings February 2, 1999 Version 1.3 11 R Package Drawings Ceramic DIP Package - DD8 11-24 February 2, 1999 (Version 1.3) R Package Drawings Plastic DIP Package - PD8 11 February 2, 1999 (Version 1.3) 11-25 R Package Drawings SOIC and TSOP Packages - SO8, VO8

1156-BALL

Abstract: bga 896 411PI BF957 132-ball package
Contextual Info: DataSource CD-ROM Q1-02 Contents Package Drawings Products Guide Product Data Sheets Package Drawings Packaging and Thermal Characteristics Application Notes White Papers Software/Hardware Manuals Xcell Journal Online Xcell Journal Archives Inside Out Columns

XC2S200

Abstract: XCV1000E
Contextual Info: Reference QPRO QPRO QML-Certified FPGAs and PROMs The Xilinx QPRO family of Radiation Hardened FPGAs and PROMs are finding homes in many new satellite and space applications. Both the XQR4000XL and XQVR Virtex products are being designed into space systems that will utilize reconfigurable technology. Numerous communications and GPS satellites, space probe, and

XQR/XQ4062XL

Contextual Info: QPro Reference QML-Certified FPGAs and PROMs The Xilinx QPro family of radiation hardened FPGAs and PROMs are finding homes in many new satellite and space applications. Both the XQR4000XL and XQVR Virtex™ products are being designed into space systems that will utilize reconfigurable

Contextual Info: HN27C4096H Series 4M 256K x 16-bit UV EPROM • DESCRIPTION The Hitachi HN27C4096H is a 4-Megabit Ultraviolet Erasable and Electrically Programmable Read Only Memory organized as 262,144 x 16-bits. The HN27C4096H features high speed access times of 70 and

HM51W16405

Contextual Info: Package Information There are four types of package for the Hitachi IC Memories, Plastic Mold DIP, CERDIP, Flat Package and Chip Carrier. Please select a suitable package in consideration o f your circumstance. When you use the package that has the material variation, please write down the package name in a form in

HN27C4096

Abstract: HN27C4096HCC HN27C4096HG HN27C4096HG-85 HN27C4906HCC-85 Hitachi Scans-001
Contextual Info: blE D • 44^203 002214^ ^ 7 ■HIT2 HN27C4096HG/HCC Series-262,144-word x 16-Wl C M O S U V Era sa b le and Program m able ROM HITACHI/ LOGIC/ARRAYS/MEM HN27C4096HG/HCC is a 4-M bit u ltravio let erasable and electrically programmable RO M , featuring high speed and low power dissipation.

rca thyristor manual

Abstract: HN623258 101490
Contextual Info: Quick Reference Guide to Hitachi 1C Memories Package Information Reliability of Hitachi 1C Memories Applications MOS Static RAM MOS Pseudo Static RAM Application Specific Memory MOS Dynamic RAM MOS Dynamic RAM Module MOS Mask ROM MOS PROM ECL RAM P> Jc^< j

sony ps3 eye camera

Abstract: 6d40 engine diagram sgx530* vector graphics manual dsi CVBS BTA 16 6008 PowerVR SGX series 5 "cmos camera "mc 7258 wiring diagram ccd camera mc 7218 wiring diagram ET 439 power module fuji
Contextual Info: Public Version AR Y OMAP OMAP34xx Multimedia Device Silicon Revision 3.1, 3.1.1 Texas Instruments OMAP™ Family of Products EL IM IN Version R PR Technical Reference Manual Literature Number: SWPU114R July 2007 – Revised April 2009 Public Version www.ti.com

HT 1200-4

Abstract: YAMAICHI ic234 PT740 AB TSSOP YAMAICHI SOCKET FP-20-0.65-01 IC51-1444-1354-7 PT817 Enplas drawings IC51-2084-1052-11 IC 7418 IC51-0242-1341
Contextual Info: Hitachi Semiconductor Package Data Book ADE–410–001B 3rd Edition March/97 Semiconductor & Integrated Circuit Devision, Hitachi, Ltd. Introduction Thank you for using Hitachi’s semiconductor devices. The growing market for electronic equipment requires mounting semiconductor devices with higher functional

XAPP185

Abstract: XQR4000XL rad hard PROM Single Event Latchup FPGA X318
Contextual Info: XQR1700L QPRO Series Radiation Hardened Serial Configuration PROMs R DS062 v1.0 April 20, 2000 8* Advance Product Specification Features Description • The XQR1701L and XQR1704L are Xilinx 3.3v series high density, radiation hardened serial configuration PROMs

Contextual Info: 40303.06 FSWLD 3/11/02 3:45 PM Page 237 Cable to Cable CC4 Cat. No. B • Stranded Conductor • Solid Circular Conductor A 4 2 2 solid 1 1/0 2/0 3/0 4/0 250 300 350 350 500 2002 Thomas & Betts Corporation. Specifications are subject to change without notice.

1702L

Abstract: 17512L HW-130 XC1701 XC1701L XC1702L XC1704L XC17512L XC4020 1704L
Contextual Info: XC1700L Series High Density Serial Configuration PROMs Including XQ1701L QPROTM Series R January 27, 1999 Version 2.2 8* Product Specification Features Description • The XC1704L, XC1702L, XC1701L, and the XC17512L are Xilinxs 3.3V series of high density serial configuration