CSG484
Abstract: Lead Free reflow soldering profile BGA FFG676 XAPP427 BGA reflow guide PQG240 CPG196 ipc 610D pcb warpage in ipc standard IPC-A-610D
Contextual Info: Application Note: Packaging R XAPP427 v2.5 February 4, 2010 Summary Implementation and Solder Reflow Guidelines for Pb-Free Packages Author: Mj Lee Recent legislative directives and corporate driven initiatives around the world have called for the elimination of Pb and other hazardous substances in electronics used in many sectors of
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Lead Free reflow soldering profile BGA
Abstract: XAPP427 FFG668 BGA reflow guide BFG95 BGA PROFILING TQG144 VOG48 PQG100 PQG160
Contextual Info: Application Note: Packaging R XAPP427 v2.4 February 12, 2009 Summary Implementation and Solder Reflow Guidelines for Pb-Free Packages Author: Mj Lee Recent legislative directives and corporate driven initiatives around the world have called for the elimination of Pb and other hazardous substances in electronics used in many sectors of
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xapp427lead free reflow soldering profile bgaffg668bga reflow guide+6bfg95bga profilingtqg144vog48pqg100pqg160
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XAPP427
Abstract: BFG95 Lead Free reflow soldering profile BGA FSG48 FGG256 FFG1152 FFG896 reflow profile 245 SOG20 BGA PROFILING
Contextual Info: Application Note: Packaging R Implementation and Solder Reflow Guidelines for Pb-Free Packages XAPP427 v2.2 January 30, 2006 Summary Recent legislative directives and corporate driven initiatives around the world have called for the elimination of Pb and other hazardous substances in electronics used in many sectors of
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xapp427bfg95lead free reflow soldering profile bgafsg48+6fgg256ffg1152ffg896reflow profile 245sog20bga profiling
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XC3S700A
Abstract: xc3s200aft256 XC3S400AFT256 XC3S50A L01P L02P FG320 UG331 L05P xc3s400a ftg256
Contextual Info: Spartan-3A FPGA Family: Data Sheet R DS529 July 10, 2007 Product Specification Module 1: Introduction and Ordering Information - DS529-1 v1.4.1 July 10, 2007 • • • • • • • Introduction Features Architectural and Configuration Overview General I/O Capabilities
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XC95144XL-10TQ144I
Abstract: XC95144XL-10TQG100C XAPP114 XAPP427 XC9500XL XC95144 XC95144XL XC95144XL-5-CS144 XC95144XL-5TQ100 xc95144xl tq144
Contextual Info: XC95144XL High Performance CPLD R DS056 v1.8 July 15, 2005 5 Product Specification Features Power Estimation • • • • Power dissipation in CPLDs can vary substantially depending on the system frequency, design application and output loading. To help reduce power dissipation, each macrocell
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SPARTAN-3 XC3S400 PQ208
Abstract: SPARTAN-3 XC3S400 pq208 architecture SPARTAN-3 XC3S400 tq144 SPARTAN-3 XC3S400 Spartan-3 FPGA Family XC3S4000-FG676 SPARTAN-3 XC3S400 pin SPARTAN-3 XC3S400 architecture XC3S4000FG676 XILINX SPARTAN VQG100
Contextual Info: 06 Spartan-3 FPGA Family: Introduction and Ordering Information R DS099-1 v1.4 January 17, 2005 Preliminary Product Specification Introduction - The Spartan -3 family of Field-Programmable Gate Arrays is specifically designed to meet the needs of high volume,
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XCF00S
Abstract: automotive ecu automotive ecu circuit LVDSEXT-25 AEC-Q100 TS16949 VQG100 LVDSEXT25 BLVDS-25
Contextual Info: 06 Spartan-3 Automotive XA FPGA Family: Introduction and Ordering R DS314-1 v1.0 October 18, 2004 Advance Product Specification Introduction The Xilinx Automotive (XA) Spartan -3 family of Field-Programmable Gate Arrays is specifically designed to meet the
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COOLRUNNER-II examples
Abstract: XA CoolRunner-II XAPP393 VQG44 CoolRunner-II CPLD AEC-Q100 TS16949 XA2C128 XA2C256 XA2C32A
Contextual Info: CoolRunner-II CPLD XA Product Family R DS315-1 v1.0 October 18, 2004 Advance Product Specification Features • • • • • AEC-Q100 device qualification and full PPAP support available in both extended temperature Q-grade and I-grade. Optimized for 1.8V systems
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XC3S700AN FGG484
Abstract: XC3S400AN-FGG400 XC3S700A FGG484 xc3s200an XC3S400AN FGG400 FGG676 SPARTAN 3an XC3S50A XC3S700AN-FG484 XC3S700AN
Contextual Info: Spartan-3AN FPGA Family Data Sheet R DS557 June 2, 2008 Module 1: Introduction and Ordering Information - DS557-1 v3.1 June 2, 2008 • • • • • • • • Introduction Features Architectural Overview Configuration Overview In-system Flash Memory Overview
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XC9536XL
Abstract: XAPP114 XAPP427 XC9500XL XC9536 Pb-Free Marking Codes XC9536XL VQFP XC9536XL-10VQ64C VQG44 XC9536XL-10VQ44
Contextual Info: XC9536XL High Performance CPLD R DS058 v1.7 July 15, 2005 5 Product Specification Features Power Estimation • • • • Power dissipation in CPLDs can vary substantially depending on the system frequency, design application and output loading. To help reduce power dissipation, each macrocell
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qfn 3x3 tray dimension
Abstract: XCDAISY BFG95 XC5VLX330T-1FF1738I pcb footprint FS48, and FSG48 WS609 jedec so8 Wire bond gap XC3S400AN-4FG400I FFG676 XC4VLX25 cmos 668 fcbga
Contextual Info: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.5 November 6, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the
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XCF00S
Abstract: spartan 3a FGG900 DS099 XCN07010
Contextual Info: ds313.fm Page 1 Friday, April 18, 2008 10:26 AM Spartan-3L Low Power FPGA Family R DS313 v1.2 April 18, 2008 Product Specification This product is undergoing discontinuance. Please refer to XCN07010, Product Discontinuation Notice, for more information on last-time purchases and replacement products.
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xc3s500e fg320
Abstract: intel strataflash j3d SPARTAN 3E STARTER BOARD transistor tt 2222 pin configuration 500K variable resistor eeprom programmer schematic winbond AT45DB AT49 jtag cable Schematic XC3S500E spartan 3a
Contextual Info: Spartan-3E FPGA Family: Complete Data Sheet R DS312 April 18, 2008 Product Specification Module 1: Introduction and Ordering Information Module 3: DC and Switching Characteristics DS312-1 v3.7 April 18, 2008 DS312-3 (v3.7) April 18, 2008 • • • •
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qfg48 dimensions
Abstract: XC2C64A-7CPG56I XC2C64A-7QFG48I XC2C64A-7VQG100C XC2C64A-7VQG44C LVCMOS33 XAPP427 XC2C64A DS092 LVCMOS25
Contextual Info: R DS311 v1.3 November 8, 2004 XC2C64A CoolRunner-II CPLD Advance Product Specification Features Description • The CoolRunner-II 64-macrocell device is designed for both high performance and low power applications. This lends power savings to high-end communication equipment and
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Contextual Info: Spartan-3A DSP FPGA Family: Complete Data Sheet R DS610 April 2, 2007 Advance Product Specification Module 1: Introduction and Ordering Information • DS610-1 v1.0 April 2, 2007 • • • • • • • Introduction Features Architectural Overview Configuration Overview
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XC95288XL10TQG144I pinout
Abstract: XC95288XL PQG208 XC95288XL pinout XC95288XL-10TQG144C fgg256 XC95288XL XC95288XL-7CS280C XC95288XL-10FGG256I XC95288XL-7TQ144I pqg208
Contextual Info: XC95288XL High Performance CPLD R DS055 v2.1 April 3, 2007 5 Features • • • • • • • • • • • 6 ns pin-to-pin logic delays System frequency up to 208 MHz 288 macrocells with 6,400 usable gates Available in small footprint packages - 144-pin TQFP (117 user I/O pins
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TQG144
Abstract: AEC-Q100 DS555 LVCMOS15 LVCMOS25 LVCMOS33 XA2C256 XAPP427
Contextual Info: XA2C256 CoolRunner-II Automotive CPLD R DS555 v1.1 May 5, 2007 Product Specification Features - • AEC-Q100 device qualification and full PPAP support available in both I-grade and extended temperature Q-grade WARNING: Programming temperature range of TA = 0° C to +70° C.
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DS600
Abstract: XA95144XL AEC-Q100 XA9500XL XAPP114 XAPP427 XC9500XL Xa9500 2N6210
Contextual Info: XA95144XL Automotive CPLD DS600 v1.1 April 3, 2007 Features • • • • • • • • • • • • AEC-Q100 device qualification and full PPAP support available in I-grade. Guaranteed to meet full electrical specifications over TA = -40° C to +85° C (I-grade)
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LVCMOS15
Abstract: LVCMOS25 LVCMOS33 XAPP399 XAPP427 XC2C128 Xilinx XC2C128-7VQ100C
Contextual Info: R DS093 v2.9 June 28, 2005 XC2C128 CoolRunner-II CPLD Product Specification Features Description • The CoolRunner-II 128-macrocell device is designed for both high performance and low power applications. This lends power savings to high-end communication equipment
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SPARTAN-3
Abstract: DS099 XCF00S FGG900
Contextual Info: ds313.fm Page 1 Thursday, September 15, 2005 11:39 AM Spartan-3L Low Power FPGA Family R DS313 v1.1 September 15, 2005 Preliminary Product Specification Introduction Spartan -3L Field-Programmable Gate Arrays (FPGAs) consume less static current than corresponding members
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DS092
Abstract: LVCMOS15 LVCMOS25 LVCMOS33 XAPP427 XC2C64 XC2C64A VQ1001 5VQ10 G1142
Contextual Info: R DS092 v2.1 March 7, 2005 XC2C64 CoolRunner-II CPLD Note: This product is no longer recommended for new designs. It has been superseded by the XC2C64A, a device with I/O Banking and Pb-free package options. • • • Refer to the CoolRunner -II family data sheet for architecture description.
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Contextual Info: R DS095 v2.6 January 30, 2005 XC2C384 CoolRunner-II CPLD Preliminary Product Specification Features Description • The CoolRunner-II 384-macrocell device is designed for both high performance and low power applications. This lends power savings to high-end communication equipment
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Contextual Info: R < B L B XA Spartan-3A Automotive FPGA Family Data Sheet DS681 v1.0 April 30, 2008 Product Specification Summary The XA Spartan -3A family of Field-Programmable Gate Arrays (FPGAs) solves the design challenges in most high-volume, cost-sensitive, I/O-intensive automotive
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xc3s500e vq100
Contextual Info: 1 Spartan-3E FPGA Family Data Sheet DS312 July 19, 2013 Product Specification Module 1: Introduction and Ordering Information Module 3: DC and Switching Characteristics DS312 v4.1 July 19, 2013 DS312 (v4.1) July 19, 2013 • Introduction • • Features
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