PACKAGES Search Results

IC-524

Abstract: 74as
Contextual Info: SN 54AS881A, S N 74AS 8 8 1A ARITH M ETIC LOGIC UNITS/FUNCTION G ENERATORS D 2 6 6 1 , DECEMBER 1 9 8 2 - • Package Options Include Plastic "Small Outline" Packages, Both Plastic and Ceramic Chip Carriers, and Standard Plastic and Ceramic 300-mil DIPs •

Contextual Info: SN54ALS05A, SN74ALS05A HEX INVERTERS WITH OPEN-COLLECTOR OUTPUTS S D A S 1 9 0 A - APRIL 1982 - R EVISED DECEMBER 1994 Package Options Include Plastic Small-Outllne D Packages, Ceramic Chip Carriers (FK), and Standard Plastic (N) and Ceramic (J) 300-mll DIPs

sn 74 ls 11 020 n

Abstract: LS1020A LS102
Contextual Info: SN 54A LS1020A , S N 74 A LS 1 020 A DUAL 4-INPUT POSITIVE-NAND BUFFERS D2661, APRIL 1982-REVISED MAY 1986 • Buffer Version of 'A LS20B • Package Options Include Plastic "Sm all Outline" Packages, Ceramic Chip Carriers, and Standard Plastic and Ceramic 300-m il

IC SN74HC

Abstract: SN74HCTOO SN74HC
Contextual Info: SN54HCT00, SN74HCT00 QUADRUPLE 2-INPUT POSITIVE NANO GATES D 3 2 4 3 , NOVEMBER 1968 Inputs are TTL-Voftage Compatible S N 54H C T00 S N 74H C T00 Package Options Include Plastic "Small Outline" Packages, Ceramic Chip Carriers, and Standard Plastic and Ceramic 300-mil

transistor 2SK1603

Abstract: 2SK1603 2SK1723 2SK1118 transistor 2sk1723 MOSFET 2SK1358 Transistor Guide 2sk16 packages TYPES FOR MOSFET toshiba transistor smd code 2sk1358
Contextual Info: H it'll Voltage M SFKTs MOSFET Features Toshiba power MOSFET lineup ranges from 60V to 1000V and from 0.5A to 60A. All devices are enhancement types, which means the transistor is normally off. Our wide variety of different packages offers choices for all

Contextual Info: TMS28C64 65,536-BIT ELECTRICALLY ERASABLE PROGRAMMABLE READ-ONLY MEMORY • Organization 8K x 8 • Single 5-V Power Supply ± 10% N AND J PACKAGES (TOP VIEW } Q 1 U A 12C 2 A7C 3 Compatible with Existing 64K M O S EPRO M s. PRO M s. R O M s, and EEPR O M s

Contextual Info: SN 54A LS1640A , S N 7 4 A L S 1640A, SN 54 A LS1 645 A , S N 74 A LS 1 645 A OCTAL BUS TRANSCEIVERS WITH 3-STATE OUTPUTS D 2 6 6 1 , D E C E M B E R 1 9 8 2 - R E V IS E D M A Y 1 9 8 6 Bidirectinal Bus Transceivers in High-Density 20-Pin Packages SN 54A LS' . . . J PACKAGE

Contextual Info: SN54ALS1034, SN54AS1034A, SN74ALS1034, SN74AS1034A HEX DRIVERS SDAS063B - APRIL 19S2 - REVISED JANUARY 1995 'AS1034A Offer High Capacltlve-Dri ve Capability Noninverting Drivers Package Options Include Plastic Small-Outllne D Packages, Ceramic Chip Carriers (FK), and Standard Plastic (N) and

logic diagram of 7432

Abstract: Texas Instruments TTL 7432
Contextual Info: SN5432, SN 54LS32, SN54S32. SN7432, SN74LS32, SN74S32 QUADRUPLE 2-INPUT POSITIVE-OR GATES DECEMBER 1983-REVISED MARCH 1988 Package Options Include Plastic "Small Outline" Packages, Ceramic Chip Carriers and Flat Packages, and Plastic and Ceramic DIPs • SN 5432. SN 54LS32, SN 54S 32 . . . J OR W PACKAGE

types of scr packages

Contextual Info: 1. General Information Toshiba's photocouplers incorporate into w hite mold packages a com bination of either GaAs infrared LEDs or GaAIAs infrared LEDs and silicon photo-detectors GaAIAs LEDs are adopted in the high-speed photo-IC types by utilizing their features of high speed and high light pow er

Contextual Info: SN54LS15, SN54S15, SN74LS15, SN74S15 TRIPLE 3 INPUT POSITIVE AND GATES WITH OPEN-COLLECTOR OUTPUTS A P R IL 1 9 8 5 — R E V IS E D M A R C H Package Options Include Plastic "Sm all Outline" Packages, Ceramic Chip Carriers and Flat Packages, and Plastic and Ceramic

Contextual Info: SN54F20, SN74F20 DUAL 4-INPUT POSITIVE-NAND GATES D2932, MARCH 1987-REVISED JANUARY 1989 • Package Options Include Plastic "Small Outline" Packages, Ceramic Chip Carriers, and Standard Plastic and Ceramic 300-mil DIPs S N 5 4 F 2 0 . . . J PACKAGE S N 7 4 F 2 0 . . . 0 OR N PACKAGE

Contextual Info: SN54ALS11A, SN54AS11, SN74ALS11A, SN74AS11 TRIPLE 3-INPUT POSITIVE-AND GATES SDAS009C - MARCH 1984 - REVISED DECEMBER 1994 • Package Options Include Plastic Small-Outline D Packages, Ceramic Chip Carriers (FK), and Standard Plastic (N) and Ceramic (J) 300-mil DIPs

1sv 134

Contextual Info: 54ACT11640, 74ACT11640 OCTAL BUS TRANSCEIVERS WITH 3-STATE OUTPUTS SCAS027A - D2957, JULY 1987 - REVISED APRIL 1993 54ACT11640. . . JT PACKAGE 74ACT11640 . . . DW OR NT PACKAGE TOP VIEW B idirectional Bus Transceivers In H ig h-D ensity 24-P in Packages

74as32

Contextual Info: SN54ALS32, SN54AS32, SN74ALS32, SN74AS32 QUADRUPLE 2-INPUT POSITIVE-OR GATES D 2 6 6 1 , A P R IL 1 9 8 2 - R E V I S E D M A Y 1 9 8 6 • Package Options Include Plastic "Sm all Outline" Packages, Ceramic Chip Carriers, and Standard Plastic and Ceramic 300-m il

101ON

Contextual Info: TOSHIBA _ [ 7 ] 7. Handling Devices Handling Devices 7.1 Transport Handle devices and packaging materials with care. To avoid damage to the devices, do not toss or drop packages. During transport, ensure that devices are not subjected to

64LS11

Abstract: 74LS11M
Contextual Info: SN54LS11, SN54S11, SN74LS11, SN74S11 TRIPLE 3 INPUT POSITIVE AND GATES APRIL 1 9 8 5 - R E V I S E D M A R C H 1 9B 8 • • Package Options Include Plastic "Sm all O utline" Packages, Ceramic Chip Carriers and Flat Packages, and Plastic and Ceramic DIPs

Contextual Info: SN74F2244 25Q OCTAL BUFFERS/DRIVERS WITH 3-STATE OUTPUTS _ SDFS095 - NOVEMBER 1993 • 3-State Outputs Drive Bus Lines or Buffer Memory Address Registers * Package Options Include Plastic Small-Outline Packages, Ceramic Chip Carriers, and Standard Plastic and Ceramic

IC 7422

Abstract: 7422 74LS22D as 5422 T3228
Contextual Info: SN5422, SN 54LS22, SN54S22, S N 7422 , S N 74 LS 2 2 , SN 74S22 D U A L 4-INPUT POSITIVE N A N D G A TES W ITH O P EN C O LLEC TO R O U TPU TS DECEMBER 1983 - REVISED MARCH 19B8 Package Options Include Plastic "Small Outline” Packages, Ceramic Chip Carriers

27C510

Abstract: pc51020 SMJ27C510 pc510-20
Contextual Info: TMS27C510 524 288-BIT ERASABLE PROGRAMMABLE READ-ONLY MEMORY TMS27PC510 524 288-BIT PROGRAMMABLE READ-ONLY MEMORY SMLS51OA-AUGUST 1990-REVISED JANUARY 1993 J AND N PACKAGESÎ TOP VIEW Organization . . . 64K x 8 Single 5-V Power Supply V pp [ Pin Compatible With Existing 1 Meg MOS

Contextual Info: SN54HC03, SN74HC03 QUADRUPLE 2-INPUT POSITIVE-NAMD GATES WITH OPEN-DRAIN OUTPUTS _ Package Options Include Plastic Small-Outllne D and Ceramic Flat (W) Packages, Ceramic Chip Carriers (FK), and Standard Plastic (N) and Ceramic (J) 300-mll DIPs

Contextual Info: SN54F30, SN74F30 8-INPUT POSITIVE-NANO GATES D2932, MARCH 1987-R E V ISE D JANUARY 1989 SN 54F30 . . . J PACKAG E SN 74F30 D OR N P A C K A G E Package Options Includa Plastic "Sm all Outline" Packages, Ceramic Chip Carriers, and Standard Plastic and Ceramic 300-mII

74ALS233

Contextual Info: S N 5 4 A LS 2 3 3 A , S N 7 4 A LS 2 3 3 A 1 6 x 5 ASYNCHRONOUS FIRST-IN FIRST-OUT MEMORIES D 2 8 7 6 . JA N U A R Y 1 9 8 6 - Package Options Include Plastic "Small Outline" Packages. Ceramic Chip Carriers, and Standard Plastic and Ceramic 300-mil DIPs S N 54A LS 233A . . . J PACKAGE

54HC86

Abstract: 74HC86
Contextual Info: SN54HC86, SN74HC86 QUADRUPLE 2 INPUT EXCLUSIVE-OR GATES D 2684, DECEM BER 1 9 8 2 -R E V IS E D SEPTEM BER 1987 • Package Options Include Plastic "Sm all O utline" Packages, Ceram ic Chip Carriers, and Standard Plastic and Ceram ic 300-mil DIPs SN 54H C 86