sdc 603
Abstract: SDC-602 plcc 52 SOCKET sdc603 MX-500P-21 sdc 606 sdc606 STTC-136 132 qfp extraction tool METCAL SP200
Contextual Info: soldering desoldering & rework systems contents and preface Contents 1 Introducing the QX2 2 QX2 system elements and functions 3 QX2 system elements and functions 4 Part numbers for the QX2 5 The power of SmartHeat 6 The power of SmartHeat 7 MX rework systems
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sdc 603sdc-602plcc 52 socketsdc603+6mx-500p-21sdc 606sdc606sttc-136132 qfp extraction toolmetcal sp200
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SMD MARKING CODE 071 A01
Abstract: smd code 38P LGA 1155 PIN diagram MARKING CODE SMD IC A08 L QUAD Aluminum nitride smd marking m05 LGA 1155 Socket PIN diagram pitch 0.4 QFP 256p marking code smd fujitsu Texas Instruments epoxy Sumitomo
Contextual Info: To Top Contents Safety Precautions 1 Introduction to Packages 1.1 Overview 1.2 Package Lineup 1.3 Package Forms 1.4 Package Structures 1.5 How Package Dimensions Are Indicated 1.6 Package Codes 1.7 Marking 1.8 Future Trends in Packages 2 Package Mounting Methods
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lcc-26p-m09lcc-28p-m04lcc-28p-m05lcc-28p-m06+15lcc-28p-m07lcc-28c-a04lcc-32p-m03lcc-40p-m01lcc-42p-m01smd marking code 071 a01smd code 38plga 1155 pin diagrammarking code smd ic a08l quad aluminum nitridesmd marking m05lga 1155 socket pin diagrampitch 0.4 qfp 256pmarking code smd fujitsutexas instruments epoxy sumitomo
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LGA 1156 PIN OUT diagram
Abstract: QSJ-44403 LGA 1150 Socket PIN diagram LGA 1155 Socket PIN diagram IC107-26035-20-G LGA 1151 PIN diagram REFLOW lga socket 1155 IC107-3204-G TB 2929 H alternative LGA 1155 pin diagram
Contextual Info: DIP8-P-300-2.54 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 0.46 TYP. 2/Dec. 11, 1996 DIP14-P-300-2.54 5 Package material Lead frame material Pin treatment Package weight (g)
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dip8-p-300-2dip14-p-300-2dip16-p-300-2dip18-p-300-2+12mil-m-38510mil-std-883lga 1156 pin out diagramqsj-44403lga 1150 socket pin diagramlga 1155 socket pin diagramic107-26035-20-glga 1151 pin diagramreflow lga socket 1155ic107-3204-gtb 2929 h alternativelga 1155 pin diagram
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HT 1200-4
Abstract: YAMAICHI ic234 PT740 AB TSSOP YAMAICHI SOCKET FP-20-0.65-01 IC51-1444-1354-7 PT817 Enplas drawings IC51-2084-1052-11 IC 7418 IC51-0242-1341
Contextual Info: Hitachi Semiconductor Package Data Book ADE–410–001B 3rd Edition March/97 Semiconductor & Integrated Circuit Devision, Hitachi, Ltd. Introduction Thank you for using Hitachi’s semiconductor devices. The growing market for electronic equipment requires mounting semiconductor devices with higher functional
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march/97ht 1200-4yamaichi ic234pt740 ab+7tssop yamaichi socket fp-20-0.65-01ic51-1444-1354-7pt817enplas drawingsic51-2084-1052-11ic 7418ic51-0242-1341
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BGA-169
Abstract: TQFP112 BGA169 PQFP144 BGA-421 BQFP-84 qfp132 BGA196 PLCC18 BGA-256
Contextual Info: НАКОНЕЧНИКИ Изображения наконечников Наименование/размер A/B/C/D Наконечники для монтажа (для паяльника PS90) PS, 0.4 мм, конический PS, 0.8 мм, конический
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soic-14soic-1605x10bga-100+1616x16bga-8625x17bga-121/196/6815x15bga-144bga-169tqfp112bga169pqfp144bga-421bqfp-84qfp132bga196plcc18bga-256
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HT 1200-4
Abstract: IC51-2084-1052-11 IC51-0242-1341 YAMAICHI ic234 transistor fpq 630 IC51-0404-1511 fpq-144-0.5-03 648-0482211-A01 IC189 Series Open Top SOP, SSOP, TSOP Type I a HLQFP 176 Package drawing
Contextual Info: Hitachi Semiconductor Package Data Book ADE–410–001C 4th Edition March/98 Semiconductor & Integrated Circuit Devision, Hitachi, Ltd. Introduction Thank you for using Hitachi’s semiconductor devices. The growing market for electronic equipment requires mounting semiconductor devices with higher
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march/98intern844-347360ht 1200-4ic51-2084-1052-11+8ic51-0242-1341yamaichi ic234transistor fpq 630ic51-0404-1511fpq-144-0.5-03648-0482211-a01ic189 series open top sop, ssop, tsop type i ahlqfp 176 package drawing
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IC51-2084-1052-36
Abstract: FPQ 208 0.5 10 18AB IC51-0484-806-7 IC107-3204-G IC162 FPQ-240-0 FPQ-64 IC235-0442 IC37NRB-1403-G4
Contextual Info: 作成： 前回作成： 2001 年 4 月 1998 年 7 月 パッケージインフォメーション 第 8 章 参考資料 本文書は全 8 章にて構成されるパッケージインフォメーションドキュメントの第 8 章部分とな ります。
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ic37f-0803-g4htic37nrb-1403-g4ic37nrb-1603-g4ic37nrb-1803-g4+15ic37nrb-2003-g4ic37nrb-2203-g4ic37nrb-2204-g4ic37nrb-2406-g4ic37nrb-2806-g4ic8620-3206-g4ic51-2084-1052-36fpq 208 0.5 1018abic51-0484-806-7ic107-3204-gic162fpq-240-0fpq-64ic235-0442
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IC354
Abstract: IC51-2084-1052-36 IC37F-3606-G4HT IC51-0484-806-7 OTS-24 IC107 FTQ-100-0 IC118 IC51-2084-1052-11 IC37NRB-2806-G4
Contextual Info: 8. 参考資料 8. 参考資料 8-1. 測定用ソケット 8-1-1. 測定用ソケットメーカー - 2 8-1-2. 測定用ソケット一覧表 - 3 8-2. パッケージ関連標準規格 - 8
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300mil400mil600mil750mil+14ic37f-0803-g4htic37nrb-1403-g4ic37nrb-1603-g4ic37nrb-1803-g4ic354ic51-2084-1052-36ic37f-3606-g4htic51-0484-806-7ots-24ic107ftq-100-0ic118ic51-2084-1052-11ic37nrb-2806-g4
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Sony CXA1191M
Abstract: philips ecg master replacement guide FZK101 YD 803 SGS FZK 101 Siemens CMC 707 am radio receiver philips ecg semiconductors master replacement guide CXA1191M ym2612 ecg semiconductors master replacement guide
Contextual Info: Untitled HAM RADIO FILE - Various pinouts saved from the Chipdir 2010 http://www.chipdir.org/ 0512d -0512d +-\/-+ 1 -|5V in gnd in|- 24 2 -|5V in gnd in|- 23 3 -|5V in gnd in|- 22
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0512d------------------------------------0512dz86e04sony cxa1191m+9philips ecg master replacement guidefzk101yd 803 sgsfzk 101 siemenscmc 707 am radio receiverphilips ecg semiconductors master replacement guidecxa1191mym2612ecg semiconductors master replacement guide
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SMD CODE 9Z
Abstract: 80C251 PLCC44 J-STD-20 SMD CODE 9T Smd parts identification 14x14x1.4mm PLCC18 Temic PART DATE CODE moisture sensitive handling and packaging temic ulc products
Contextual Info: Information about SMD Plastic Packages Prepared by: Elisabeth Lamarti Pierre Houzé Quality Department SMD Packaging Contents 1. INTRODUCTION -2 2. GENERALITIES -2
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300mmsmd code 9z80c251 plcc44j-std-20+7smd code 9tsmd parts identification14x14x1.4mmplcc18temic part date codemoisture sensitive handling and packagingtemic ulc products
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IC Package Names and Code Designations
Abstract: data sheet IC 7408 7404 not gate ic MSP 044 THERMISTOR enplas otq-100-0.5 IC 7404 7406 IC51-1004-809 ic 7404 datasheet HLP40R ic 7408
Contextual Info: Hitachi Semiconductor Package DATA BOOK ADE 410-001A Introduction Thank you for using Hitachi’s semiconductor devices. The growing market for electronic equipment requires mounting semiconductor devices with higher functional capacity and higher density and developing packages
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10-001aic package names and code designationsdata sheet ic 74087404 not gate ic+7msp 044 thermistorenplas otq-100-0.5ic 7404 7406ic51-1004-809ic 7404 datasheethlp40ric 7408
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SMD IC 2025 bl
Abstract: ssop64 D560 MK 50075 N QFP Package 128 lead .5mm DIP16-C-300-2 R400 S115 960f FPQ20
Contextual Info: J2T0011-38-60 ま え が き 平素は「沖半導体製品」を御愛用いただき厚く御礼 申し上げます。 エレクトロニクス分野におきましては 半導体製品 の応用はますます広がりをみせており、その性能 機
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j2t0011-38-60copyright1998okielectricindustrycoj2t0002-38-60bga-388+14bga-4202144-9028-01-x5x1mil-m-38510mil-std-883smd ic 2025 blssop64d560mk 50075 nqfp package 128 lead .5mmdip16-c-300-2r400s115960ffpq20
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PLCC18
Abstract: PLCC20 package PLCC20 PLCC-18
Contextual Info: BROTHANEK COMPONENTS GMBH Datenblatt - Artikelnr. BE 457 Suitable for development and experiments with different package types. All adapters could be connected with the pin-headers to a number of different prototyping boards with 2.54mm Hole spacing. The connection between the prototyping board and the
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Yamaichi ic354
Abstract: IC354 IC51-2084-1052-36 IC51-0484-806 Enplas OTS-32-0.5-01 sumitomo 3m Enplas fpq 352 IC235-0442 fpq-64-0.5-06 Enplas fpq 240
Contextual Info: This version: Apr. 2001 Previous version: Jun. 1997 PACKAGE INFORMATION 8. RELATED INFORMATION This document is Chapter 8 of the package information document consisting of 8 chapters in total. PACKAGE INFORMATION 8. RELATED INFORMATION 8. RELATED INFORMATION
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mil-m-38510mil-std-883yamaichi ic354ic354+8ic51-2084-1052-36ic51-0484-806enplas ots-32-0.5-01sumitomo 3menplas fpq 352ic235-0442fpq-64-0.5-06enplas fpq 240
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EC1204
Abstract: WHA300 smd led 5060 CQFP24 SMD 5060 LED WRS3000 PLCC18 KDS824A WRS7000 C881
Contextual Info: Weller Cooper Tools Rework Systems WHA300 Self-Contained Hot Air Station c c c c c c c c c Compact Size with Power A Low Cost Self-Contained Hot Air Station Temperature Control: 125¡F-1022¡F Dimensions: 8.5" ´ 5.13" Dia. Current 120 VAC, 50-60 Hz Air Flow: Adjustable from 10 Liters/Min. to 50 Liters/Min.
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wha300wrs5000c0-100kds808+11ec1204984q1404wrs4000smd led 5060cqfp24smd 5060 ledwrs3000plcc18kds824awrs7000c881
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st 0560
Abstract: LCC20B LCC-32A LCC68 LCC8 PLCC18 PLCC44A PLCC32A fpk6
Contextual Info: Ironwood Electronics Appendix E AP-E.1 APPENDIX E • Flat Pack Chip Package Specifications . . . . . . . . . . . . . . . .page AP-E.2 • LCC Chip Package Specifications . . . . . . . . . . . . . . . . . . . .page AP-E.2 • PLCC Chip Package Specifications . . . . . . . . . . . . . . . . . . .page AP-E.2
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fpk16afpk18afpk20aplcc18a+13plcc20aplcc28aplcc32aplcc44aplcc52aplcc68ast 0560lcc20blcc-32alcc68lcc8plcc18fpk6
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