OMPAC Search Results

6GE5

Abstract: tube 6GE5 E12-74 RS-739 rs tube
Contextual Info: 6GE5 TUNO-SOL BEAM PENTODE C OMPACTRON COATED U N I P O T E N T I A L FOR C ATHODE H O R I Z O N T A L - D E F L E C T I ON AMPLIFIER APPLICATIONS T.V. IN RECEIVERS A NY M O U N T I N G P O S I T I O N BASING if E D E C 12 PIN DI AGRAM 1 2 BJ BUT TON BASE E12-74

Contextual Info: RJ45 RJ Industrial HARTING RJ Industrial HARTING RJ Industrial® RJ45 jacks with transformer Advantages Technical characteristics  ompact design C l  Integrated optical fibres l  Excellent EMC behaviour due to integrated transformers and filters for 10/100 Mbit or 1 Gbit

JAHL-1504

Contextual Info: 66S9£0fs 'ON ON IMVüQ £#fflKI ±0.2 ± 0 . 2 ( 5 w CM -H m C OMPACT FLASH ASSOCIATION. 02 ? 2 . P L E A S E R E F E R TO T H I S PRODUCT. 1 . ii ^ JAHL-1504-8 V - A 0^7 h Z ?Z 7y ^ ^ 7 V ^ X — ^ 3 USI NG I) „ s lX ^ ^ * ( J A H L - 1 5 0 4 - 8 ) ^ # a s T $ t '

Contextual Info: ADVANCE 4MB-15MB M IC R O N I C ompact F lash TECHNOLOGY, INC. C o m p a c t F la s h MTCF004A, MTCF008A, MTCF010A, MTCF015A C o m p a c t F lash ATA/ATA IDE FEATURES • Implem ents highly integrated m em ory controller: Fully compatible with ompactFlash™ specification

ufnd110

Abstract: ufnd112
Contextual Info: POWER MOSFET TRANSISTORS 100 Volt, 0.6 Ohm N-Channel FEATURES • For A utom atic Insertion • C ompact, End Stackable • Fast Sw itching • Low Drive Current • Easily Paralleled • No Second Breakdown • Excellent Tem perature S tability DESCRIPTION

Contextual Info: SERIES 881 Threaded Coupling SuperFly Connectors C ompact, ultralightweight SuperFly® Threaded connectors feature positive lock coupling, EMI shielding and IP67 ingress protection . Available in a variety of layouts and sizes for audio, video, power and data applications, Series 881

MT9T111

Abstract: 5 MP camera module AXT624124 5 MP camera module 2 MP camera module
Contextual Info: 3 3M MC CA AM ME ER RA AM MO OD DU UL LE EL LII-3 3M M0 02 2C CM M Product Introduction: L eop ard Imag ing p ro vid es c ompac t size ca mer a modu les fro m VGA res olu tion to 5 Me ga- pixe l reso lu tions . 3M Camera Module Main Features: • • •

MS-034

Contextual Info: BOTTOM F R E E S C A L E SEMICONDUCTOR, ALL R I G H T S RESERVED. TITLE: INC. 62 0 I/O TEPBGA, 31 X 31 PKG, 1 MM PITCH OMPAC MECHANICAL OUTLINE PRINT VERSION NOT TO SCALE DOCUMENT NO: 98ASA10757D REV: A CASE NUMBER: 1889 20 JUL 2007 STANDARD: JEDEC M S-034 AAN-1

MS-034

Contextual Info: F R E E S C A L E SEMICONDUCTOR, ALL R I G H T S RESERVED. INC. MECHANICAL OUTLINE TITLE: 62 0 I/O TEPBGA, HEAT SPREADER, 29 X 29 PKG, 1 MM PITCH OMPAC PRINT VERSION NOT TO SCALE DOCUMENT NO: 98ARE10568D REV: B CASE NUMBER: 1588-02 26 NOV 2008 STANDARD: JEDEC M S-034 AAM-1

Contextual Info: ADVANCE M IC R O N . 4MB-15MB i C o m p a c t F lash MQCF004A, MQCF008A, MQCF010A, MQCF015A C o m p a c t F la sh C ompactF lash ATA/ATA IDE FEATURES • Im plem ents highly integrated m em ory controller: Fully com patible w ith ompactFlash™ specification

MS-034

Abstract: 520X MS 034
Contextual Info: 520X £^|0.2|A //\0.25\Ä SEATING PLANE A //10.351A ! 15 17 19 21 23 25 8 10 12 14 16 18 20 22 24 26 BOTTOM VIEW FREESCALE SEMICONDUCTOR, INC. ALL RIGHTS RESERVED. TITLE: MECHANICAL OUTLINE 5 2 0 I/O PBGA, 35 X 35 PKG, 1.27 MM PITCH OMPAC °-9 A 520X 00.6 ZIA

MPC821

Contextual Info: MPC821 Rev A.x and later OMPAC TOP VIEW 19 x 19 ARRAY 1.27mm PITCH 357 pin PBGA W pd[10] pd[8] pd[3] irq7 d[0] d[4] d[1] d[2] d[3] d[5] vddl d[6] d[7] d[29] dp2 clkout ipa3 d[13] d[27] d[10] d[14] d[18] d[20] d[24] d[28] dp1 dp3 dp0 N/C vsssyn1 irq1 d[8]

test generator

Contextual Info: PROFESSIONAL RANGE ompactLink Functional IC Test Generating Software for ompact Professional Range • • • • • • Library development manager for IC configuration PLIP language for full generation of new IC functional tests Compiler, debugger and active help integrated

MT9D112

Abstract: 5 MP camera module leopard
Contextual Info: 2 2M MC CA AM ME ER RA AM MO OD DU UL LE EL LII-2 2M M0 01 1C CM M Product Introduction: L eop ard Imag ing p ro vid es c ompac t size ca mer a modu les fro m VGA res olu tion to 5 Me ga- pixe l reso lu tions . 2M Camera Module Main Features: • • •

JXO Series

Contextual Info: Clock Oscillators Leaded Type KCJXO Series JXO Series CMOS/ 5.0V Features •C  ompact oscillator with a CMOS IC built in that is the same shape (height 3.5mm) as a crystal device • It is a hermetic sealed type with a metal case •T  he case comes with a grounding terminal

MS-034 AAL-1

Abstract: MS-034
Contextual Info: TOP VIEW 25X 1 1 2 3 4 5 6 7 8 9 10 11 1213 H 1 5 1617 1819 20 2122 232425 26 416X 0°;? rh 0 0 .2 5 A B C 0 0.1® A SIDE VIEW BOTTOM VIEW FREESCALE SEMICONDUCTOR, INC. ALL RIGHTS RESERVED. TITLE: 416 I/O, PBGA 27 X 27 PKG, 1 MM PITCH OMPAC MECHANICAL OUTLINE

transistor tip 30c

Abstract: TIP 152 transistor
Contextual Info: MOTOROLA Order this document by TIP29B/D SEMICONDUCTOR TECHNICAL DATA NPN TIP 29B Com plem entary Silicon Plastic Power Transistors TIP 29C PNP TIP 30B . . . designed for use in general purpose a m p lifie r and sw itch in g a pplications. C ompact T O -22 0 AB package.

FS22A

Abstract: FS15LF FS22 FS15A
Contextual Info: FS 3SERIES flow switches HIGHVOLTAGEREEDRELAYS K6 7 TM Maximum Operating Pressure 10 bar. 140 PSI #OMPACT&OOTPRINT Low flow version available $ESIGNED3PECIFICALLYFOR(IGH6OLTAGE WRAS approval 2HODIUM#ONTACTSFOR,OW2ESISTANCE Temperature rated to 85°C (185°F)

Contextual Info: Clock Oscillators Leaded Type KCJXO Series JXO Series CMOS/ 5.0V This product is NOT recommended for new designs. Features •C  ompact oscillator with a CMOS IC built in that is the same shape (height 3.5mm) as a crystal device • It is a hermetic sealed type with a metal case

MS-034

Contextual Info: TOP VIEW BOTTOM FREESCALE SEMICONDUCTOR, INC. ALL RIGHTS RESERVED. TITLE: SIDE VIEW 0 0 .2 5 A B C 0 0 .1 0 ® A VIEW MECHANICAL OUTLINE PBGA, THERMALLY ENHANCED, 82 0 I/O, 35 X 35 PKG, 1 MM PITCH OMPAC PRINT VERSION NOT TO SCALE DOCUMENT NO: 98ARE10659D

MS-034

Abstract: JEDEC MS-034 JEDEC bga case outline OMPAC MS034 MS 034
Contextual Info: TOP VIEW 8 91 ' ‘n i213141516171819 rh 0 0 .3 A 1B 1C 1 0 0 .1 5 ® A SIDE VIEW BOTTOM VIEW FREESCALE SEMICONDUCTOR, INC. ALL RIGHTS RESERVED. PBG A, T IT L E : 241 1.27 I/O , MECHANICAL OUTLINE STD PROFILE, 25 MM PITCH X 25 PKG, OMPAC BGA PR IN T VERSION NOT TO SCALE

Tyco MCON 1.2

Abstract: tyco Mcon UL 508C csac Heavy Duty Connector
Contextual Info: FOR MORE INFORMATION te.com/products/motorman For email, phone or live chat, go to: te.com/help Part numbers in this brochure are RoHS Compliant*, unless marked otherwise. *as defined te.com/leadfree Product Information Centers Austria: +43 1 90560 1228 Baltic Regions:

Contextual Info: 80960RP 1.0 1.2 ABOUT THIS DOCUMENT Terminology In this document, the following terms are used: This data sheet contains ADVANCE INFORMATION about Intel’s i960 RP processor, including a func­ tional overview, mechanical data package signal locations and simulated thermal characteristics ,

Contextual Info: My Account C hange Tyco Electronics Se a rch by Ke yword or Pa rt # Products Documentation Resources My Account Customer Support Home > Products > By Type > Relays > Product Feature Selector > Product Details CUB-51-70060 Product Details Time Delay Relays