NITTO HC Search Results

PCN0119

Abstract: Nitto-HC100 HC100 shin-etsu nitto hc100 Nitto HC 672-BALL Compound Nitto EP20K200E
Contextual Info: PROCESS CHANGE NOTICE PCN0119 FineLine BGA Package Molding Compound Change Change Description: ASAT Hong Kong will change the FineLine BGA package molding compound from Shin Etsu to Nitto HC-100. This change will not affect the package thickness specification, overall

PCN0415

Abstract: HC100-XJ Nitto Denko HC100-XJ Denko trace code altera HC100 HC100XJAA altera top marking nitto hc100 altera marking
Contextual Info: PROCESS CHANGE NOTIFICATION PCN0415 ADDITIONAL MOLD COMPOUND FOR FBGA PACKAGES FROM ASE MALAYSIA Change Description: The Nitto Denko HC100-XJ series mold compound is being added as an additional mold compound choice for Altera FineLine BGA® packages assembled at ASE Malaysia. This change does not affect form, fit or function.

nitto SWT 10

Abstract: nitto SWT-20 W07 sot 23 w04 transistor sot 23 UE-111AJ W04 sot 23 transistor w07 transistor marking w08 marking W07 transistor marking w04
Contextual Info: PRODUCT CODING SYSTEM QSP0005_WEB.028 1 2.4.2007 Page 1 of 6 GENERAL AND DEFINITIONS This procedure defines the identification system for MAS products. The following abbreviations are used in this document. ESD EWS ID MAS MBB T&R 2 Electrostatic Sensitive Device

PCN0515

Abstract: sumitomo G770 G770* sumitomo G770 mold compound G770 sumitomo Unbiased HAST 130, 85 RH, 100 Hrs G770 G770* G770 mold compound Sumitomo 1000 thermal conductivity of sumitomo g770 G770 HC
Contextual Info: PROCESS CHANGE NOTIFICATION PCN0515 MOLD COMPOUND CHANGE FOR FBGA PACKAGES Change Description: Altera is adopting the Sumitomo G770 series mold compound as the standard mold material on Altera FineLine BGA® FBGA device packages. Devices in FBGA packages currently

UE-111AJ

Abstract: nitto SWT-20 transistor marking PB nitto UE111AJ ke marking transistor 2091J Nitto marking code transistor HK mas1025 UE111
Contextual Info: 1 PRODUCT CODING SYSTEM 9.12.2004 QSP0005_WEB.026 Page 1 of 6 GENERAL AND DEFINITIONS This procedure defines the identification system for MAS products. The following abbreviations are used in this document: ESD EWS ID MBB T&R 2 Electrostatic Sensitive Device

PCN0712

Abstract: GE100LFCS SUMITOMO EME G770 Hitachi CEL-9750ZHF10AKL nitto GE CEL-9750ZHF10AKL sumitomo g770 EME-G770 Nitto GE100LFCS Nitto GE 100
Contextual Info: Revision: 1.0.1 PROCESS CHANGE NOTIFICATION PCN0712 MOLD COMPOUND CHANGES FOR BGA, UBGA, MBGA AND FBGA PACKAGES Change Description: Altera is implementing mold compound material changes to the wire bonded Plastic Ball-Grid Array BGA , Ultra FineLine Ball-Grid Array (UBGA), Micro FineLine Ball-Grid Array

R7181-38

Abstract: ablebond HC100 HC100XJAA mold compound Compound HC100-XJAA
Contextual Info: August 12, 2009 CN 081209 Customer Notification R7181-38 Mold Compound Change Dear Valued Customer: This notification is for the purpose of informing you of a change to the mold compound material for the R7181-38. Purpose Amkor has notified Mindspeed that their supplier has discontinued the Cookson SMT-B1 and

ABLEBOND

Abstract: M28945-13 HC100 HC100XJAA M28945 Nitto mold compound 28237-12 M28950-13 Amkor mold compound
Contextual Info: August 7, 2009 CN 080709 Customer Notification Mold Compound Change Dear Valued Customer: This notification is for the purpose of informing you of a change to the mold compound material for the parts listed below. Purpose Amkor has notified Mindspeed that their supplier has discontinued the Cookson SMT-B1 and

japan servo co

Abstract: "japan servo" Air COnditioner toyama sagami transformer koganei Denko Japan Servo development trends in car manufacture hitachi-metals toner sagami transformer 5
Contextual Info: Data on Environmental Performance Fiscal 1999 í Contents b Environmental Management System GREEN 21 .1 • Hitachi Group Average Green Point Scores .1 • Green Points for Hitachi, Ltd. and Affiliated Firms .1

JEDEC JESD22-B117

Abstract: JESD22-B117 Nitto HC Maxim ic date code Nitto 17X17X1 HC100 underfill JESD22-B100
Contextual Info: 01/23/2004 RELIABILITY REPORT FOR DS21Q55, Rev B2, ASAT no underfill Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292

PCN0116

Abstract: nitto hc100 HC100 Nitto EPF10K100E EPF10K130E EPF10K200E EPF10K200S
Contextual Info: PROCESS CHANGE NOTICE PCN0116 FineLine BGA Assembly Plant Addition Change Description: Amkor, Korea will be added as a second source for FineLine BGAä packages currently assembled in ASAT, Hong Kong. This change will not affect moisture rating, nor will there

POWER TRANSFORMER E154515

Abstract: scheme e131175 sampo E159656 foxconn e253117 e131175 XEPEX E140166 sony bando power transformer power transformer e190246 tamradio transformer e199273
Contextual Info: 10129 LIST OF COMPANY IDENTIFICATIONS The List of Company Identifications contains the trade names, trademarks, or other designations authorized for use in lieu of these Company names. ‘‘ ’’ — 2CS SRL ’’ — ACT CO LTD ‘‘ ‘‘ ’’ — 3E HK LTD

nitto GE

Abstract: GE-100L SXVX-50BHG nitto GE-100L SXVX-210BHG SXVX-50 HL832NX SXVX-210 Nitto GE 100 HL832HS
Contextual Info: Integrated Device Technology, Inc. 6024 Silver Creek Valley Road, San Jose, CA - 95138 PRODUCT/PROCESS CHANGE NOTICE PCN PCN #: A1008-07 Product Affected: DATE: September 17, 2010 MEANS OF DISTINGUISHING CHANGED DEVICES: 17mm x 17mm TEBGA-580 (Green) Product Mark

Sn95Sb5

Abstract: QMI519 nitto hc100 QMI-519 epoxy qualification Qualification JESD22-C101-C CARSEM HC100 JESD22-A115
Contextual Info: Product Qualification Report Skyworks Part Number: SKY12145-315 Product Type: HIP3 Variable Attenuator for UMTS Base Stations Report No: 300374 Approved by: Product/Package Reliability: Tom Wood Prepared by Skyworks Solutions, Inc. Product / Package Reliability Group

TAIYO PSR 4000

Abstract: manual PACE PSR 800 HC-100-X2 Ablebond 8360 TAIYO PSR 4000 soldermask JEDEC Kostat FBGA PSR4000-AUS5 TAIYO PSR 2000 csp192 FBGA THICK TRAY
Contextual Info: National Semiconductor Application Note 1125 Shaw W. Lee and Wayne Lee June 2000 Introduction CHIP SCALE PACKAGES Laminate substrate based CSPs are an extension of National Semiconductor’s current Plastic Ball Grid Array PBGA technology and are the package of choice for portable applications. CSPs are available in two package designs: Laminate CSP and Fine Pitch Ball Grid Array (FBGA).

JESD22-B117

Abstract: JEDEC JESD22-B117 JESD22B117 dallas date code JESD22-B100
Contextual Info: 05/06/2003 RELIABILITY REPORT FOR Dallas, no underfill, 144 Chip Scale BGA Interposer Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy.

NITTO HC-100-XJAA-M

Abstract: CRM1525D HC100-XJ HC100 HC-100-XJAA-M HC100-XJAA JEDEC JESD22-B117
Contextual Info: 12/17/2003 RELIABILITY REPORT FOR DS31412, Rev A1 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : ken.wendel@dalsemi.com

S 0319

Abstract: CRM1525D
Contextual Info: 12/17/2003 RELIABILITY REPORT FOR DS3146, Rev A1 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : ken.wendel@dalsemi.com

NITTO HC-100-XJAA-M

Abstract: CRM1525D HC-100XJAA-M
Contextual Info: 12/17/2003 RELIABILITY REPORT FOR DS3148, Rev A1 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : ken.wendel@dalsemi.com

J-STD-020

Abstract: HC100-XJ JSTD-020 NITTO HC-100-XJAA-M 94V-0 0303
Contextual Info: 05/21/03 RELIABILITY REPORT FOR DS4000, Rev A2 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : ken.wendel@dalsemi.com

Ablebond 8390

Abstract: sil154 kyro PowerVR B1G5 HC100 PowerVR imagination technologies bitblt kyro 2 Bt868
Contextual Info: Integrated 2D/3D graphics accelerator – Product Overview PRELIMINARY DATA FEATURES • PowerVR Series 3 arcade performance 3D ● DirectX7 Flexible Vertex Format support ● 8 layer Multi-texturing ● Twin high performance texturing pipelines ● Full triangle setup hidden surface

Polarizer Nitto

Abstract: C175 ic chip hhb S1D15B nitto UV tape
Contextual Info: U N C O N T R O L L E D D O C U M E N PART NUMBER REV. LCM-H 12864CGWF/C2 A T REV. A E.C.N. NUMBER AND REVISION COMMENTS E.C.N. #11146. DATE 4.19.07 FRONT VIEW l.ö ö [a o 3 ^ ] 80,65±<l.20 [3.175±O.D081 - eso [O.iiO] MAX. 76.63 113,018] VA, 63.98 [2.519] LA, -

bf 002a

Abstract: C175 OMT software D1560 nitto UV tape
Contextual Info: U N C O N T R O L L E D D O C U M E N PART NUMBER REV. LCM-H 12864CGWF/C2 A T REV. A E.C.N. NUMBER AND REVISION COMMENTS E.C.N. #11 1 4 6 . DATE 4 .1 9 .0 7 FRONT VIEW l.ö ö [a o 3 ^ ] 80,65±<l.20 [3.175±O.D081 - eso [O.iiO] MAX. 76.63 113,018] VA, 63.98 [2.519] LA, -

Contextual Info: R&E 4555B 4556B INTERNATIONAL, INC. CMOS DUAL 2-T0-4 LINE DECODERS FEATURES ♦ Buffered Outputs ♦ Selected Output Active High 4555B or Active Low (45S6B) Expandable ♦ CONNECTION D IA G R A M (all packages) Vd d I 16 DESCRIPTION The 4555 B and 4556B are constructed