PCN0119
Abstract: Nitto-HC100 HC100 shin-etsu nitto hc100 Nitto HC 672-BALL Compound Nitto EP20K200E
Contextual Info: PROCESS CHANGE NOTICE PCN0119 FineLine BGA Package Molding Compound Change Change Description: ASAT Hong Kong will change the FineLine BGA package molding compound from Shin Etsu to Nitto HC-100. This change will not affect the package thickness specification, overall
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pcn0119hc-100epf10k100e484-ball+10epf10k130eep20k200enitto-hc100hc100shin-etsunitto hc100nitto hc672-ballcompoundnitto
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