MULTICHIP PACKAGES Search Results

Contextual Info: Packaging technology PSGA – an innovative IC package for single and multichip designs More and more applications with multipin ICs or multichip systems require even smaller, flatter and more economical packages. The innovative PSGATM polymer stud grid array package for

cohesive

Contextual Info: Fujitsu offers the widest range of multichip module MCM and multichip package (MCP) technology available in the industry today. MCM is a completely custom solution that creates a specialized module. MCP offers multiple chips in a standard package and form factor.

AD834x

Abstract: AD77XX AD832x MCP market AD78xx AD92xx AD983x 8B2000 9433 ad9432
Contextual Info: Analog Devices, Inc. MultiChip Products Business Unit MCP High Performance Signal Processing Solutions MultiChip Products Business Unit ADI MCP’s MIXED SIGNAL INTEGRATED CHIP MODULES: Sub-System Solutions for Signal Processing System Integrators who can benefit from Higher Levels of Performance and Density

PSRAM

Abstract: M36L0R7060B1 M36L0R7060T1 M58LR128HB M58LR128HT M69KB096AM
Contextual Info: M36L0R7060T1 M36L0R7060B1 128 Mbit Multiple Bank, Multilevel, Burst Flash memory and 64 Mbit (Burst) PSRAM, 1.8 V supply, multichip package Features • ■ ■ ■ Multichip package – 1 die of 128 Mbit (8 Mb x16, Multiple Bank, Multilevel, Burst) Flash memory

P113 IR

Abstract: teseo 2 data output STA8058A 14095 STA8058ATR
Contextual Info: STA8058 TESEO high performance GPS multichip module MCM Data brief − production data Features • GPS multichip module: – STA2058 TESEO Baseband – STA5620 RF Front-end ■ Complete embedded memory system: – Flash 256 KB + 16 Kbytes – RAM 64 Kbytes.

PSRAM

Abstract: M36L0R7060B1 M36L0R7060T1 M58LR128HB M58LR128HT ubp 100
Contextual Info: M36L0R7060T1 M36L0R7060B1 128 Mbit Multiple Bank, Multilevel, Burst Flash memory and 64 Mbit (Burst) PSRAM, 1.8 V supply, multichip package Features • ■ ■ ■ Multichip package – 1 die of 128 Mbit (8 Mb x16, Multiple Bank, Multilevel, Burst) Flash memory

M36L0T7060B

Abstract: M36L0T7060 TFBGA88 M69KW096B DSA0042593 flash E2p M58LT128HB M58LT128HT M36L0T7
Contextual Info: M36L0T7060T2 M36L0T7060B2 128 Mbit Multiple Bank, Multilevel, Burst Flash memory and 64 Mbit (4 Mb x16) PSRAM, multichip package Preliminary Data Features • ■ ■ ■ Multichip package – 1 die of 128 Mbit (8 Mb x16, Multiple Bank, Multilevel, Burst) Flash Memory

Contextual Info: STA8058 TESEO high performance GPS multichip module MCM Data brief  production data Features • GPS multichip module: – STA2058 TESEO Baseband – STA5620 RF Front-end ■ Complete embedded memory system: – Flash 256 KB + 16 Kbytes – RAM 64 Kbytes.

M36L0T8060

Abstract: flash E2p M69KW096B
Contextual Info: M36L0T8060T1 M36L0T8060B1 256 Mbit 16 Mb x16, multiple bank, multilevel, burst Flash memory and 64 Mbit PSRAM, 1.8 V core, 3 V I/O supply, multichip package Features Multichip package • 1 die of 256 Mbit (16 Mb ×16, multiple bank, multilevel, burst) Flash memory

P113H

Abstract: teseo 2 data output ARM7 teseo teseo STA2058 STA8058A STA5620 P113 IR STA8058 5.5MB
Contextual Info: STA8058 TESEO high performance GPS multichip module MCM Data Brief Features • GPS multichip module: – STA2058 TESEO Baseband – STA5620 RF Front-end ■ Complete embedded memory system: – Flash 256 KB + 16 Kbytes – RAM 64 Kbytes. ■ 66-MHz ARM7TDMI 32 bit processor

Multi-Chip Modules motorola

Contextual Info: MOTOROLA SC •CNEI'IORY/ASI L^E D b3t.7ESl □Df iTbtn 053 M N0T3 MOTOROLA SEMICONDUCTOR Order by MCMLiD • TECHNICAL DATA Advance Information APPLICATION SPECIFIC MULTICHIP MODULES MCML SERIES MULTICHIP MODULES CMOS/BICMOS SEMICONDUCTORS This specification defines the product characteristics for the MCML Series of

Telesis

Abstract: intellitech teradyne victory 70T3539M corelis jtag AN-411 BC256 IDT70T3539M ontap JTAG Technologies
Contextual Info: JTAG Testing of IDT’s Multichip Modules Application Note AN-411 JTAG TESTING OF MULTICHIP MODULES APPLICATION NOTE AN-411 Introduction The intent of this application note is to provide instruction on how to perform JTAG test pattern generation TPG for IDT’s MCMs on a

l202

Abstract: L575
Contextual Info: Discrete LED Sizes and Packages O. « SOT23 SINGLE CHIP SML10 T1-3/4 SINGLE CHIP NARROW BEAM L200 T 1-3/4 6 MULTICHIP L206 SERIES T3/4 SINGLE CHIP L080 T1 -3/4 SINGLE CHIP WIDE BEAM L200 12 MULTICHIP L375 SERIES T1 SINGLE CHIP L120 T 1-3/4 SINGLE CHIP FLAT TOP

M39P0R1080E4

Abstract: M39P0R9080E4 M58PR001LE M58PR512LE M39P0R09080E4 BCAS SD
Contextual Info: M39P0R9080E4 M39P0R1080E4 512 Mb or 1 Gb x16, multiple bank, multilevel, burst Flash memory 256 Mbit low power SDRAM, 1.8 V supply, multichip package Features • ■ Multichip package – 1 die of 512 Mbit (32 Mb x16) or 1 Gbit (64 Mb ×16) multiple bank, multilevel, burst)

Contextual Info: M36P0R8070E0 256 Mbit x16, multiple bank, multilevel, burst Flash memory 128 Mbit (burst) PSRAM, 1.8 V supply, multichip package Features • ■ Multichip package – 1 die of 256 Mbit (16 Mb x 16, multiple bank, multilevel, burst) Flash memory – 1 die of 128 Mbit (8 Mb x16) PSRAM

M36P0R8070E0

Abstract: M58PR256J M69KB128AA strataflash 256 x 2 Mbits ECR15
Contextual Info: M36P0R8070E0 256 Mbit x16, multiple bank, multilevel, burst Flash memory 128 Mbit (burst) PSRAM, 1.8 V supply, multichip package Features • ■ Multichip package – 1 die of 256 Mbit (16 Mb x 16, multiple bank, multilevel, burst) Flash memory – 1 die of 128 Mbit (8 Mb x16) PSRAM

M36L0T7050T2

Abstract: M58LT128HB M58LT128HT M36L0t7050
Contextual Info: M36L0T7050T2 M36L0T7050B2 128 Mbit Multiple Bank, Multilevel, Burst Flash memory and 32 Mbit (2 Mb x16) PSRAM, multichip package Features • ■ ■ ■ Multichip package – 1 die of 128 Mbit (8 Mb x16, Multiple Bank, Multilevel, Burst) Flash Memory – 1 die of 32 Mbit (2 Mb x16) Pseudo SRAM

Contextual Info: PCB LED Sizes & Packages TRI-LEVEL N/A N/A N/A BI-LEVEL m N/A 1 SINGLES m H % li 1 AXIAL SINGLE CHIP SINGLE CHIP SINGLE CHIP DUAL CHIP 6 MULTICHIP

Contextual Info: BGA Technology f eatures ▲ JEDEC compliant standard PBGA packages ▲ Extensive experience in mass producing cost-effective & high-volume singlechip and multichip PBGA packages ▲ Tailored to higher I/Os and higher clock frequency designs ▲ Enhanced electrical, mechanical and

Spansion

Abstract: S71VS064R S29VS064 NLB056 NS032J S29VS064R VDE044 NSB056 S29NS032J Spansion MCP products, 56
Contextual Info: SPANSION LLC 915 DeGuigne Drive, P.O. Box 3453 Sunnyvale, California 94088-3453, USA September 23, 2009 Obsolescence Notification No: Subject: 2775 Obsolescence of the discrete 110nm CMOS 1.8V NS032J Products & the MultiChip Packages MCP containing 110nm CMOS 1.8V NS032J Products.

kyocera design guide

Abstract: dupont 951 Ferro ltcc dupont 943 dupont 951 green tape kyocera design guide ltcc kyocera ceramic package Kyocera Electronic Components
Contextual Info: Uncontrolled copy unless stamped in red. LTCC DIVISION OF KYOCERA AMERICA DESIGN GUIDE ♦HIGH RELIABILITY ♦HIGH INTERCONNECT DENSITY ♦HIGH I/O COUNT ♦EXCELLENT POWER HANDLING ♦LOW-FIRE MATERIAL ♦CUSTOM TRANSMISSION LINES ♦CUSTOM MULTICHIP MODULES

MAX6654MEE

Abstract: fenwal 110 samsung crt monitor circuit diagram 2N3904 2N3906 CMPT3904 KST3904-TF MAX6654 SMBT3904 SST3904
Contextual Info: 19-1836; Rev 0; 10/00 1°C Accurate Remote/Local Temperature Sensor with SMBus Serial Interface _Applications Desktop Computers Notebook Computers Servers Thin Clients Workstations Test and Measurement Multichip Modules SMBus is a trademark of Intel Corp.

Contextual Info: 19-1836; Rev 1; 9/01 1°C Accurate Remote/Local Temperature Sensor with SMBus Serial Interface _Applications Desktop Computers Notebook Computers Servers Thin Clients Workstations Test and Measurement Multichip Modules SMBus is a trademark of Intel Corp.

BCR141S

Abstract: BCR141 BCR141F BCR141L3 BCR141T bcr1 marking code wd
Contextual Info: BCR141. NPN Silicon Digital Transistor • Switching circuit, inverter, interface circuit, driver circuit • Built in bias resistor R1=22kΩ, R2 =22kΩ • BCR141S / U: Two internally isolated transistors with good matching in one multichip package