17X19 Search Results

Contextual Info: PART NUMBER: 304DCN2R7SCBB HIGH PULSE POWER, EXTENDS BATTERY LIFE PARTS ARE ROHS COMPLIANT FEATURES APPLICATIONS Radial lead, high capacitance. High power density Battery backup. Battery alternative. LED displays. Mechanical actuators ELECTRICAL SPECIFICATIONS

Contextual Info: PART NUMBER: 335DCN2R7MGJG HIGH PULSE POWER, EXTENDS BATTERY LIFE PARTS ARE ROHS COMPLIANT FEATURES APPLICATIONS Radial lead, high capacitance. High power density Battery backup. Battery alternative. LED displays. Mechanical actuators ELECTRICAL SPECIFICATIONS

Contextual Info: FEATURES Very fast charge/discharge – High power density – IEC 62391 compliant – Circuit board mountable APPLICATIONS Battery backup/ alternative – Pulse power – Energy harvesting – LED Displays – Mechanical actuators – Audio systems Operating Temperature

Contextual Info: Digital DC/DC PMBus 33A Module ISL8271M Features The ISL8271M is a 33A step-down DC/DC power supply module with integrated digital PWM controller, synchronous power switches, an inductor and passives. Only bulk input and output capacitors are needed to finish the design. The 33A of

Contextual Info: DCN Super Capacitors APPLICATIONS •   Battery backup Battery alternative Audio systems    Pulse power DC-DC converters Mechanical actuators      Very fast charge/discharge cycling Circuit board mountable High power density Energy Harvesting

P113H

Abstract: teseo 2 data output ARM7 teseo teseo STA2058 STA8058A STA5620 P113 IR STA8058 5.5MB
Contextual Info: STA8058 TESEO high performance GPS multichip module MCM Data Brief Features • GPS multichip module: – STA2058 TESEO Baseband – STA5620 RF Front-end ■ Complete embedded memory system: – Flash 256 KB + 16 Kbytes – RAM 64 Kbytes. ■ 66-MHz ARM7TDMI 32 bit processor

SG-BGA-6225

Contextual Info: GHz BGA Socket - Direct mount, solderless Top View Features Directly mounts to target PCB needs tooling holes with hardware. High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly 26.225mm Ball guide prevents over compression of elastomer

Contextual Info: STA8058 TESEO high performance GPS multichip module MCM Data brief  production data Features • GPS multichip module: – STA2058 TESEO Baseband – STA5620 RF Front-end ■ Complete embedded memory system: – Flash 256 KB + 16 Kbytes – RAM 64 Kbytes.

Contextual Info: DATASHEET Digital DC/DC PMBus 25A Module ISL8270M Features The ISL8270M is a 25A step-down DC/DC power supply module with integrated digital PWM controller, synchronous power switches, an inductor and passives. Only bulk input and output capacitors are needed to finish the design. The 25A of

Contextual Info: PART NUMBER: 475DCN2R7SGJG HIGH PULSE POWER, EXTENDS BATTERY LIFE PARTS ARE ROHS COMPLIANT FEATURES APPLICATIONS Radial lead, high capacitance. High power density Battery backup. Battery alternative. LED displays. Mechanical actuators ELECTRICAL SPECIFICATIONS

Contextual Info: Very fast charge/discharge – High power density – IEC 62391 compliant – Circuit board mountable FEATURES APPLICATIONS Battery backup/ alternative – Pulse power – Energy harvesting – LED Displays – Mechanical actuators – Audio systems Operating Temperature

SG-BGA-6239

Abstract: MAX 6239
Contextual Info: GHz BGA Socket - Direct mount, solderless Top View Features Directly mounts to target PCB needs tooling holes with hardware. High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly 26.225mm Ball guide prevents over compression of elastomer

airborn nk-2e2

Contextual Info: AirBorn THE CO NNECTOR CO M PANY £ ROW Cable to Board Right Angle PTH . 025 " NM, NK 9 thru 85 Contacts M E TA L .3 7 5 M A X .0 8 0 # 0 - 8 0 CAPTIVE JACKSCREW ( 2 PLCS) —.0 1 2 5 .0 2 5 PITCH POSITION #1 - .2 2 5 - -A S REQUIRED- # 0 - 8 0 THREAD ( 2 PLCS)

Contextual Info: Digital DC/DC PMBus 33A Module ISL8271M Features The ISL8271M is a 33A step-down DC/DC power supply module with integrated digital PWM controller, synchronous power switches, an inductor and passives. Only bulk input and output capacitors are needed to finish the design. The 33A of

P113H

Abstract: teseo teseo data output ARM7 teseo teseo 2 data output STC tcxo STA5620 STA2058 STA8058 5.5MB
Contextual Info: STA8058 Teseo high performance GPS multi chip module MCM Data Brief Features • GPS Multi Chip Module: – STA2058 Teseo Baseband – STA5620 RF Front-end ■ Complete Embedded Memory System: – Flash 256K+16K bytes – RAM 64K bytes. ■ 66-MHz ARM7TDMI 32 bit processor

P113 IR

Abstract: teseo 2 data output STA8058A 14095 STA8058ATR
Contextual Info: STA8058 TESEO high performance GPS multichip module MCM Data brief − production data Features • GPS multichip module: – STA2058 TESEO Baseband – STA5620 RF Front-end ■ Complete embedded memory system: – Flash 256 KB + 16 Kbytes – RAM 64 Kbytes.

Contextual Info: FEATURES Very fast charge/discharge – High power density – IEC 62391 compliant – Circuit board mountable APPLICATIONS Battery backup/ alternative – Pulse power – Energy harvesting – LED Displays – Mechanical actuators – Audio systems Operating Temperature

IEC 62391

Contextual Info: Super Capacitors DCN APPLICATIONS •   Battery backup Battery alternative Audio systems    Pulse power DC-DC converters Mechanical actuators      Very fast charge/discharge cycling Circuit board mountable High power density Energy Harvesting

Contextual Info: Digital DC/DC PMBus 25A Module ISL8270M Features The ISL8270M is a 25A step-down DC/DC power supply module with integrated digital PWM controller, synchronous power switches, an inductor and passives. Only bulk input and output capacitors are needed to finish the design. The 25A of

Contextual Info: DATASHEET Digital DC/DC PMBus 33A Module ISL8271M Features The ISL8271M is a 33A step-down DC/DC power supply module with integrated digital PWM controller, synchronous power switches, an inductor and passives. Only bulk input and output capacitors are needed to finish the design. The 33A of

Contextual Info: FEATURES Very fast charge/discharge – High power density – IEC 62391 compliant – Circuit board mountable APPLICATIONS Battery backup/ alternative – Pulse power – Energy harvesting – LED Displays – Mechanical actuators – Audio systems Operating Temperature

Contextual Info: Very fast charge/discharge – High power density – IEC 62391 compliant – Circuit board mountable FEATURES APPLICATIONS Battery backup/ alternative – Pulse power – Energy harvesting – LED Displays – Mechanical actuators – Audio systems Operating Temperature

GS 669

Abstract: MC008
Contextual Info: F=7 SGS-THOMSON * IM « SGSP358 CHIP N - CHANNEL ENHANCEMENT MODE POWER MOS TRANSISTOR IN DIE FORM DIE SIZE: 77x77 mils METALLIZATION: Top Al Back A u/C r/N i/A u BACKSIDE THICKNESS: 6100 A DIE THICKNESS: 16 ± 2 mils PASSIVATION: P-Vapox BONDING PAD SIZE:

SG-BGA-6238

Contextual Info: GHz BGA Socket - Direct mount, solderless Top View Features Directly mounts to target PCB needs tooling holes with hardware. High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly 30mm Sqr. Ball guide prevents over compression of elastomer