MTP61 Search Results

njm41010

Abstract: NJM41010F1 NJM41010F1T
Contextual Info: NJM41010 2-Input 1-Output Video Driver Q GENERAL DESCRIPTION The NJM41010 is a 2-Input 1-Output general-purpose video switch. It includes 6dB amplifier and 75ohm driver circuit. The NJM41010 is suitable for a variety of AV equipment because of a small package and wide operating temperature

800MHz CDMA Handset Circuit Diagram

Abstract: amplifier lna low noise amplifier s band
Contextual Info: AMPLIFIERS 1.5/1.9GHz BAND LNA GaAs MMIC NJG1103F1/ DATA SHEET NJG1107KB2 DATA SHEET 800MHz BAND CDMA LNA GaAs MMIC NJG1104KB2 DATA SHEET • GENERAL DESCRIPTION ■ GENERAL DESCRIPTION NJG1103F1/NJG1107KB2 is a Low Noise Amplifier GaAs MMIC designed for 1.5GHz an 1.9GHz band digital cellular

EMP20-E2

Abstract: QFP80 QFP64 package QFP80-C3 SSOP20
Contextual Info: RECOMMENDED SOLDER PADS 4. Recommended Solder Pads for Surface Mount Package Recommended solder pads for each package are shown in the following table. Please take easiness of mounting, reliability of bonding, prevention of solder bridge, margin of pattern area into consideration when

Contextual Info: PACKAGE DIMENSIONS MTP6-1 0~10° 2.9±0.2 4 1 2 3 0.6 0.445±0.1 5 +0.2 1.6 - 0.1 6 2.8±0.2 1.9±0.2 0.95 0.4±0.1 0.1 1.1±0.1 0.1MAX 0.8 +0.1 0.13 -0.03 UNIT : mm

DMP14

Abstract: DMP16 EMP14 EMP16-E2 EMP20-E2 EMP24-E3 SDMP30 DMP8 pcb pattern QFP100-C2
Contextual Info: RECOMMENDED SOLDER PADS 4. Recommended Solder Pads for Surface Mount Package Recommended solder pads for each package are shown in the following table. Please take easiness of mounting, reliability of bonding, prevention of solder bridge, margin of pattern area into consideration when

DMP14

Abstract: DMP16 EMP14 SDMP30 SSOP10
Contextual Info: 推奨フットパターン 推奨フットパターン（表面実装パッケージ） 以下に推奨フットパターンの例を示します。設計に際し実装の容易さ、接続の信頼性、配線スペース、はんだブリッジの発生の有無などを

C6198

Abstract: a17 c178 100v 12p quanta TMS 3617 CX20468-31 mtp42 cpu c644 100v 27p capacitor 100u 63V a70 4013 100 12p Quanta KT2
Contextual Info: 5 4 3 2 PCB Rev: A 1 Sch ver : 20040402_07 KT2 BLOCK DIAGRAM D PCB STACK UP LAYER 1 : TOP D PENTIUM-M / Montara-GM / ICH4-M LAYER 2 : GND LAYER 3 : IN1 CPU PENTIUM-M CPU THERMAL SENSOR LAYER 4 : IN2 GMT-781 478 Pins micro FC-PGA PAGE: 3 LAYER 5 : VCC 14.318MHz

CX20468-31

Abstract: BDM7 ATI M26P varistor k35 quanta foxconn varistor 520 k14 ISL6248 conexant cx20468 Socket AM2
Contextual Info: 1 2 3 4 5 6 7 8 PA2A-Block Diagram AC/BATT CONNECTOR A BATT CHARGER MAX1772 PG 29 VGA CPU SYSTEM POWER MAX1845 IO SC1470 CPUHCLK_200M CHANNEL A PG 15 Alviso PM GMCH VGA Memory 64/128 MB PG10 DDR2-SODIMM1 DDR2 SDRAM BGA PG 15 NEWCCLK_100M IDE (PATA) PG 22

Compal Electronics

Abstract: compal smd sot23-3 W32 UFCBGA479 compal la LA-3342P DIODE T25-4 PLC1045P R3381 PR210
Contextual Info: A B C D E 1 1 Compal confidential 2 2 Schematics Document Mobile Yonah uFCPGA with Intel Calistoga_GM/PM+ICH7-M core logic 3 3 2006-07-24 REV:1.0 4 4 Compal Secret Data Security Classification 2005/03/10 Issued Date 2006/03/10 Deciphered Date THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONFIDENTIAL

compal

Abstract: Compal Electronics isl6260 PLC1045P MOBILE INTEL CALISTOGA isl6227caz ISL6260CRZ PJP18 PCBGA1466 MC910
Contextual Info: A B C D E 1 1 Compal confidential 2 2 Schematics Document Mobile Yonah uFCPGA with Intel Calistoga_GM/PM+ICH7-M core logic 3 3 2006-05-19 REV:0.1 4 4 Compal Secret Data Security Classification 2005/03/10 Issued Date 2006/03/10 Deciphered Date THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONFIDENTIAL

AMD am3 socket pinout

Abstract: tv schematic diagram sony j14 amd socket am3 pinout schematic diagram lcd tv SONY T CON quanta 7233a PC97551 915GM schematic diagram tv sony Socket AM2
Contextual Info: 1 A 笔记本图纸QQ107203753 ED3-UMA DESIGN 2 RUN POWER SW 3 4 5 7 8 VER : B3B A AC/BATT CONNECTOR PG 37 BATT CHARGER PG 37 Dothan DC/DC +3V_SRC +5VSUS 478 Micro-FCPGA PG 34 6 PG 34 CPU VR CLOCKS PG 33 PG 17 PG 5, 6 FSB 133MHZ LVDS DDRII-SODIMM1 PG 15, 16

ATI-RS480M

Abstract: 6N131 LA-2771 ati sb400 NISSAN n14 1470804-2 drawing fuse N50 AMD Athlon 64 X2 4800 pin diagram Compal Electronics 2N151
Contextual Info: A B C D E 1 1 Compal confidential 2 2 Schematics Document AMD K8 with ATI RS480M+ATI SB400 3 3 2005-5-17 REV:0.3 4 4 Compal Secret Data Security Classification 2005/03/01 Issued Date 2005/04/06 Deciphered Date A B C Title Cover Page THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONFIDENTIAL

SONY KNC 201 15

Abstract: knc 201 39 KNC 201 KNC 201 08 xo 405 mf tc144e KNC 201 35 conexant cx20493 reference design KNC 201 6 ga g31
Contextual Info: 1 2 3 4 5 6 7 8 ED3-UMA DESIGN A RUN POWER SW AC/BATT CONNECTOR A Dothan PG 37 DC/DC +3V_SRC +5VSUS 478 Micro-FCPGA PG 34 BATT CHARGER VER : F3B PG 37 CPU VR PG 34 CLOCKS PG 17 PG 33 PG 5, 6 FSB 133MHZ LVDS DDRII-SODIMM1 PG 15, 16 Panel Connector PG 18 Alviso 915GM/GML

la2841

Abstract: ICS9LP306 compal TPS2231 PLC1045P mini pcie connector 52 pin vertical Socket AM2 Compal Electronics G993 samsung electronics ba41
Contextual Info: A B C D E 1 1 Compal confidential 2 2 Schematics Document Mobile Yonah uFCPGA with Intel Calistoga_GM/PM+ICH7-M core logic 3 3 2005-12-15 REV:1.0 4 4 Compal Secret Data Security Classification 2005/03/10 Issued Date 2006/03/10 Deciphered Date THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONFIDENTIAL

SC74A

Abstract: SSOP14 SSOP20 VSP8 Package SC-74A
Contextual Info: PACKAGE OUTLINE TABLE I PACKAGE CODE TABLE 1. PACKAGE OUTLINE TABLE Suffix 6Pin 8Pin 10Pin 14Pin 20Pin SSOP V . _ O O VSP R . O _ _ . O* _ _ _ _ _ - - FLP K MTP6 F MTP6-1 F o o ' _ - - * : PRELIMINARY SSOP 2. PACKAGE CODE TABLE VSP NJRC vs . e ia j FLP6 MTP6

B7 SOT-89

Abstract: DMP14 DMP16 EMP14 EMP16-E2 EMP20-E2 SDMP30 BCC36 sot89 E3 QFP80-C2
Contextual Info: 推奨フットパターン 推奨フットパターン（表面実装パッケージ） 以下に推奨フットパターンの例を示します。設計に際し実装の容易さ、接続の信頼性、配線スペース、 はんだブリッジの発生の有無などを考慮して下さい。

ET-7101

Abstract: SSOP10 SSOP14 SSOP20
Contextual Info: TAPING DIMENSIONS 2. TAPING DIMENSIONS There are two types of taping packing, Adhesive Taping in accordance with EIAJ standard ET-7101 ”Packaging of Electronic Components on Continuous Tapes Adhesive Types ” and Emboss carrier taping in accordance with

QFP-144L

Abstract: VSP8 Package EMP8
Contextual Info: PACKAGE DIMENSIONS DIP8 8.8±0.3 5 1 4 6.4±0.2 8 7.62 0.51M IN 1.0±0.2 0.46±0.1 2.54 2.8M IN 0.74MAX 4.7M AX 1.5±0.2 +0.15 0.25 -0.05 ~ 15º UNIT: mm 19.0±0.3 DIP14 8 1 7 6.4±0.2 14 7.62 1.5±0.2 2.54 0.46±0.1 2.8M IN 0.51M IN 4.7M AX 2.03MAX +0.15

EMP24-E3

Abstract: EMP20-E2 QFP80-C3 DMP14 DMP16 EMP14 EMP16-E2 SDMP30 SSOP10
Contextual Info: RECOMMENDED SOLDER PADS 4. Recommended Solder Pads for Surface Mount Package Recommended solder pads for each package are shown in the following table. Please take easiness of mounting, reliability of bonding, prevention of solder bridge, margin of pattern area into consideration when

IC JRC 4558

Abstract: 4558 DX 4558 DX jrc JRC 7201 ic njm 4558 4558 DX dip 8 4558 jrc 7201 JRC JRC 4558 JRC 4558 D
Contextual Info: ORDERING INFORMATION New JRC ICs are named by New JRC Naming Standard. Please order our ICs by their full names. New JRC Naming Standard 1. SILICON IC 1.1 Bipolar : standard Example : NJM 4558 M - A T1 1 2 3 4 5 Item 1 Classification of items NJM - Bipolar monolithic IC

DMP14

Abstract: DMP16 EMP14 SDMP30 SSOP10 QFP-100C
Contextual Info: 推奨フットパターン 推奨フットパターン 推奨フットパターン（表面実装パッケージ） 以下に推奨フットパターンの例を示します。設計に際し実装の容易さ、接続の信頼性、配線スペース、はんだブリッジの発生の有無などを

74248

Abstract: ZO 607 MA GRM36 HK1005 NJG1103F1 161035
Contextual Info: NJG1103F1 1.5/1.9GHz 帯低雑音増幅器 GaAs MMIC •概要 NJG1103F1 は低雑音、高利得、高 IP3 を特徴とし、 1.5/1.9GHz 帯ディジタル携帯電話端末及び PHS での使用 を主目的とした低雑音 GaAs MMIC 増幅器です。

SSOP14 pcb

Abstract: dmp 30 package DMP8 pcb pattern QFP80 SOP32 data sheet SSOP10 Package QFP-100C EMP20-E2 QFP64 package QFP80-C3
Contextual Info: RECOMMENDED SOLDER PADS 4. Recommended Solder Pads for Surface Mount Package Recommended solder pads for each package are shown in the following table. Please take easiness of mounting, reliability of bonding, prevention of solder bridge, margin of pattern area into consideration when

1691-03

Abstract: NJG1102F1 GRM39 HK1608 48.888 MHZ
Contextual Info: NJG1102F1 800MHz 帯低雑音増幅器 GaAs MMIC •概要 NJG1102F1 は低雑音、高利得、高 IP3 を特徴し、 800MHz 帯ディジタル携帯電話端末での使用を主目的 とした低雑音 GaAs MMIC 増幅器です｡ パッケージには MTP6-1 を採用しました。