MT4C1625 Search Results

Contextual Info: m i t i » MT4C16256/7/8/9 L 256K X 1 6 WIDE DRAM MICRON • SEMICONDUCTOR. MC WIDE DRAM 256KX16DRAM LOW POWER, EXTENDED REFRESH FEATURES PIN ASSIGNMENT Top View • Industry-standard xl6 pinouts, timing, functions and packages • High-performance CMOS silicon-gate process

Contextual Info: '993 Tí* PRELIMINARY MT4C16256/7/8/9 256K X 16 WIDE DRAM MICRON I SCHICONDUCTOR MC WIDE DRAM 256K X 16 DRAM FAST-PAGE-MODE FEATURES OPTIONS PIN ASSIGNMENT Top View 40-Pin SOJ (DC-6) Vcc [ 1 DOl [ 2 D02 E 3 D03 E 4 004 [ 5 • Write Cycle Access _ BYTE or WORD via WE

MT4C16257

Contextual Info: MT4C16257 L 256KX 16 DRAM (M IC R O N 256K x 16 DRAM DRAM 5V, FAST PAGE MODE, OPTIONAL EXTENDED REFRESH FEATURES • Industry-standard xl6 pinouts, timing, functions and packages • High-performance CMOS silicon-gate process • Single +5V +10% power supply*

Contextual Info: PRELIMINARY MT4C16256/7/8/9 L 256K X 16 WIDE DRAM M IC R O N 256KX16DRAM WIDE DRAM LOW POWER, EXTENDED REFRESH FEATURES PIN ASSIG N M EN T Top View OPTIONS • Write Cycle Access BYTE or WORD via WE - (maskable) BYTE or WORD via CÄS (maskable) • Packages

Contextual Info: m . i s MT4C16256/7/8/9 256K X 16 WIDE DRAM MICRON • ««ICOHOliCTOR MC WIDE DRAM 256K X 16 DRAM FAST-PAGE-MODE FEATURES • Industry-standard xl6 pinouts, timing, functions and packages • High-performance CMOS silicon-gate process • Single +5V ±10% pow er supply*

Contextual Info: PRELIMINARY MT4C16256/7/8/9 256KX 16 WIDE DRAM MICRON WIDE DRAM 256K 16 DRAM X FAST-PAGE-MODE FEATURES • Industry-standard x l6 pinouts, timing, functions and packages • High-perform ance CM OS silicon-gate process • Single +5V ±10% power supply • Low power, 3mW standby; 500m W active, typical

BCM 6302

Abstract: micron MT4C database for 4081 ic
Contextual Info: OBSOLETE MARCH 1995 D18A 512K X 8, 256K x 16 D R A M D IE I^IICRON 512Kx 8, 256Kx 16 DRAM DRAM DIE MT4C8512D18A and MT4C16257D18A G EN ERAL PHYSICAL SPECIFICATIONS • Wafer thickness =18.5 mils ±0.5 mils. • The backside wafer surface Is polished bare silicon.

MT4C16257DJ-6

Abstract: MT4C16257 MT4C16257DJ-6 pin out mt4c16257dj
Contextual Info: 256K x 16 FPM DRAM TECHNOLOGY, INC. MT4C16257 DRAM FEATURES • Industry-standard x16 pinouts, timing, functions and packages • High-performance CMOS silicon-gate process • Single +5V ±10% power supply • All inputs, outputs and clocks are TTL-compatible

Contextual Info: m ' i PRELIMINARY MT4C16256/7/8/9 L 256K X 16 WIDE DRAM MICRON I SEMICONDUCTOR MC WIDE DRAM 256K x 16 DRAM LOW POWER, EXTENDED REFRESH FEATURES • In d u stry -stan d ard x l6 pinouts, tim ing, functions a n d packages • H igh-perform ance CMOS silicon-gate process

MT4C16257DJ-6

Contextual Info: 256K X 16 FPM DRAM MICRON I TECHNOLOGY, INC. DRAM MT4C16257 FEATURES • In d u stry -sta n d a rd x l6 p in o u ts, tim ing, functions an d packages • H igh-perform ance CM OS silicon-gate process • Single +5V +10% p o w er su p p ly • All in p u ts, o u tp u ts an d clocks are TTL-com patible

MT4C16257

Contextual Info: p iC R MT4C16257 L 256K X 16 DRAM O N DRAM 256K x 16 DRAM 5V, FAST PAGE MODE, OPTIONAL EXTENDED REFRESH FEATURES • In d u stry-stan d ard x l 6 p in o u ts, tim in g , fu n ctio n s an d p ackages • H ig h -p erfo rm a n ce C M O S silico n -g a te p ro cess

T4C16257

Abstract: MT4C16256
Contextual Info: MT4C16256/7 256K X 16 DRAM M IC R O N D R A M X 2 5 6 K 1 6 D R A M FAST PAGE MODE FEATURES • Industry-standard x l6 pinouts, tim ing, functions and packages • High-perform ance CM OS silicon-gate process • Single +5V ±10% power supply* • Low power, 3m W standby; 375m W active, typical

Contextual Info: MICRON MT4C16257 256K X 16 DRAM I ,lt— DRAM 256K x 16 DRAM 5V, FAST PAGE M O DE PIN ASSIGNMENT Top View • In d u stry -sta n d a rd x l 6 p in o u ts, tim in g , fu n ctio n s an d packages • H ig h -p erfo rm a n ce C M O S silico n -g ate process

Contextual Info: PRELIMINARY MT4C16256/7/8/9 256K X 16 WIDE DRAM MICRON 256K WIDE DRAM 16 DRAM X FEATURES • Industry-standard x l6 pinouts, timing, functions and packages • High-performance CMOS silicon-gate process • Single +5V ±10% pow er supply • Low power, 3mW standby; 500mW active, typical

AU 6256 28

Abstract: 4043 cmos rs latch
Contextual Info: PRELIMINARY MT4C16256/7/8/9 L 256K X 16 WIDE DRAM M IC R O N 256K x 16 DRAM WIDE DRAM FEATURES PIN ASSIGNMENT Top View • In d u stry -stan d a rd x l 6 p in o u ts, tim in g , fu n ctio n s an d p ack ag es • H ig h -p e rfo rm a n ce C M O S silico n -g a te process

MT4C16257

Abstract: RCD 2226 MT4C16256 256K 16bit DRAM zip
Contextual Info: MICRON TECHNOLOGY INC ADVANCE MICRON • TECHWfìl OGV INC. S5E » ■ b lllS H T MT4C16256/7/8/9 256KX 16 DRAM DÜD4S3T TTT ■ URN 2 5 6 K X 1 6 DRAM DRAM FAST PAGE MODE Zj-j'y • Industry standard xl6 pinouts, timing, functions and packages • High-performance, CMOS silicon-gate process

Contextual Info: ADVANCE MT4C16256/7/8/9 L 256KX 16 DRAM MICRON I r iCH NOLOGY. IN2 MICRON TECHNOLOGY INC 55E P DRAM • LlllSM'î 0G04Sbl IMS HIMRN JEW 256K X16 DRAM LOW POWER, EXTENDED REFRESH — - :- S -1 7 - PIN ASSIGNMENT Top View

Contextual Info: M ICRON SEM ICONDUCTOR INC b 'iE D m b i l l 5 HT G D G cì cì f i 3 B i MRN MT4C16256/7 L 256K X 16 DRAM MICRON I TTh SEPiCO ND'J CIO FiU JC. 256K x 16 DRAM LOW POWER, EXTENDED REFRESH FEATURES • Industry-standard xl6 pinouts, timing, functions and packages

Contextual Info: MICRON SEMICOND UCT OR INC bTE D • b l l l S M 11! DDÜTTbö 7ÖT ■ MRN M ir D H M 1 semiconductor inc. MT4C16256/7 256K X 16 DRAM 2 5 6 K X 16 DRAM DRAM FAST PAGE MODE FEATURES • Industry-standard xl6 pinouts, timing, functions and packages • High-performance CMOS silicon-gate process

MT4C16257

Contextual Info: PRELIMINARY |viic:noN 256K MT4C16256/7/8/9 16 WIDE DRAM X 256K X 16 DRAM WIDE DRAM FAST-PAGE-MODE FEATURES • Industry-standard xl6 pinouts, tim ing, functions and packages • H igh-perform ance CMOS silicon-gate process • Single +5V ±10% pow er supply

Contextual Info: MICRON SEMICONDUCTOR INC b?E D • b 1 1 1 5 MT 000^7=57 711 ■ MRN OBSOLETE JUNE 94 D18A 512K X 8, 256K X 16 DRAM DIE M IC R O N B SEMiCONO'JCTOa INC. 512Kx8, 256Kx16 DRAM DRAM DIE MT4C8512D18A and MT4C16257D18A GENERAL PHYSICAL SPECIFICATIONS • • •

TC5118160

Abstract: msm-561 TMS444000 msm561 M5M418165 M5M418160 tms44c256 TC5117405 HY514264 HY514260
Contextual Info: New Page 1 DRAM 1Meg 1Mx1 256Kx4 FPM FPM Fujitsu MB81C100 MB81C4256 Goldstar GM71C100 GM71C4256 Hitachi HM511000 HM514256 Hyundai HY531000 HY534256 Micron MT4C1024 MT4C4256 Mitsubishi M5M41000 M5M44256 Nec UPD421000 UPD424256 Oki MSM511000 MSM514256 Samsung alt KM41C1000 KM44C256

Contextual Info: ADVANCE MICRON MT4LC16257 S I 2256KX 5 6 K X 16 DRAM DRAM 256K x 16 DRAM 3.3V, FAST PAGE MODE, OPTIONAL SELF REFRESH PIN ASSIGNMENT (Top View) • Industry-standard x l6 pinouts, timing, functions and packages • High-perform ance CMOS silicon-gate process

Contextual Info: MT2D25632, MT4D51232 256K, 512K x 32 DRAM MODULE MICRON I TECHNOLOGY. INC DRAM MODULE 256K, 512K x 32 1, 2 MEGABYTE, 5V, FAST PAGE MODE FEATURES PIN ASSIGNMENT Front View OPTIONS 72-Pin SIMM (DD-5) 256K x 32 (DD-6) 512K x 32 o imïïïïirrffrrmmy^^ 1 PIN#