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Micron Technology Inc


Micron Technology Inc MT4C8512D18AWC2 Memory IC
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
Vyrian	MT4C8512D18AWC2		7,154			1 - 10 - 100 - 1000 - 10000 -	Get Quote
Micron Technology Inc MT4C8512D18ADC2-8 DRAM, 512KX8, 80ns, CMOS
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
Vyrian	MT4C8512D18ADC2-8		6,776			1 - 10 - 100 - 1000 - 10000 -	Get Quote
Micron Technology Inc MT4C8512D18AWC1 DRAM, 512KX8, CMOS
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
Vyrian	MT4C8512D18AWC1		6,569			1 - 10 - 100 - 1000 - 10000 -	Get Quote
Micron Technology Inc MT4C8512D18AWC2-8 DRAM, 512KX8, 80ns, CMOS
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
Vyrian	MT4C8512D18AWC2-8		6,449			1 - 10 - 100 - 1000 - 10000 -	Get Quote
Micron Technology Inc MT4C8512D18AWC1-8 DRAM, 512KX8, 80ns, CMOS
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
Vyrian	MT4C8512D18AWC1-8		6,309			1 - 10 - 100 - 1000 - 10000 -	Get Quote

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MT4C8512D18A Datasheets Context Search

Catalog Datasheet	Type	Document Tags	PDF
BCM 6302 Abstract: micron MT4C database for 4081 ic Contextual Info: OBSOLETE MARCH 1995 D18A 512K X 8, 256K x 16 D R A M D IE I^IICRON 512Kx 8, 256Kx 16 DRAM DRAM DIE MT4C8512D18A and MT4C16257D18A G EN ERAL PHYSICAL SPECIFICATIONS • Wafer thickness =18.5 mils ±0.5 mils. • The backside wafer surface Is polished bare silicon.	OCR Scan	114x114 512Kx 256Kx MT4C8512D18A MT4C16257D18A 150mm BCM 6302 micron MT4C database for 4081 ic	PDF
Contextual Info: MICRON SEMICONDUCTOR INC b?E D • b 1 1 1 5 MT 000^7=57 711 ■ MRN OBSOLETE JUNE 94 D18A 512K X 8, 256K X 16 DRAM DIE M IC R O N B SEMiCONO'JCTOa INC. 512Kx8, 256Kx16 DRAM DRAM DIE MT4C8512D18A and MT4C16257D18A GENERAL PHYSICAL SPECIFICATIONS • • •	OCR Scan	114x114 512Kx8, 256Kx16 MT4C8512D18A MT4C16257D18A 150mm	PDF

Catalog Datasheet

Type

Document Tags

PDF

BCM 6302

Abstract: micron MT4C database for 4081 ic
Contextual Info: OBSOLETE MARCH 1995 D18A 512K X 8, 256K x 16 D R A M D IE I^IICRON 512Kx 8, 256Kx 16 DRAM DRAM DIE MT4C8512D18A and MT4C16257D18A G EN ERAL PHYSICAL SPECIFICATIONS • Wafer thickness =18.5 mils ±0.5 mils. • The backside wafer surface Is polished bare silicon.

OCR Scan

114x114 512Kx 256Kx MT4C8512D18A MT4C16257D18A 150mm BCM 6302 micron MT4C database for 4081 ic

PDF

Contextual Info: MICRON SEMICONDUCTOR INC b?E D • b 1 1 1 5 MT 000^7=57 711 ■ MRN OBSOLETE JUNE 94 D18A 512K X 8, 256K X 16 DRAM DIE M IC R O N B SEMiCONO'JCTOa INC. 512Kx8, 256Kx16 DRAM DRAM DIE MT4C8512D18A and MT4C16257D18A GENERAL PHYSICAL SPECIFICATIONS • • •

OCR Scan

114x114 512Kx8, 256Kx16 MT4C8512D18A MT4C16257D18A 150mm

PDF

MT4C8512D18A Search Results

MT4C8512D18A Price and Stock

Micron Technology Inc MT4C8512D18AWC2

Micron Technology Inc MT4C8512D18ADC2-8

Micron Technology Inc MT4C8512D18AWC1

Micron Technology Inc MT4C8512D18AWC2-8

Micron Technology Inc MT4C8512D18AWC1-8

MT4C8512D18A Datasheets Context Search

BCM 6302