MP8000C Search Results

MP8000C

Abstract: SN20 MIC2563A-0YSM MIC2563A-1YSM PCB BOARD DIMENSION
Contextual Info: RELIABILITY REPORT DATE: 1/16/04 QUALITY ENG : PURPOSE: Dinh Pham Lead Free Package Qualification. PART # : PACKAGE TYPE : ASSEMBLY LOC M.COMPD LOT # FAB D/C # PROCESS MIC2563A-1YSM 28L SSOP UNISEM MP8000C 2A28088M01 SJ 0309 BCD3 MIC2563A-0YSM 28L SSOP UNISEM

datecode

Abstract: DS2181 DS2164Q DS2165Q DS1212Q DS1284Q DS1285Q DS2130Q DS2167Q MP8000C
Contextual Info: DALLAS SEMICONDUCTOR 4401 South Beltwood Parkway Dallas, Texas 75244-3292 972 371-4000 Date: April 23rd , 1999 Subject: PRODUCT CHANGE NOTICE - D92301 Description: Qualification of Nitto MP8000C Mold Compound for 28 and 32 L PLCC Packages

MP8000C

Abstract: DS2141A DS2151 DS2153 DS2180A DS2181A DS80320 DS87520 mold compound MP-8000
Contextual Info: DALLAS SEMICONDUCTOR 4401 South Beltwood Parkway Dallas, Texas 75244-3292 972-371-4000 Date: 8/26/98 Subject: PRODUCT CHANGE NOTIFICATION Description: Qualification of MP8000C Mold Compound and adding Hana, Hong Kong as a second source for 44L PLCC packages.

AOZ1075AI

Abstract: aoz1075 G700HC AOZ107 2a 200v schottky diode AOZ1094DI AOZ1015AI BA004 aoz1094 1015AI
Contextual Info: AOS Semiconductor Product Reliability Report AOZ1016AI/1017AI/1015AI/1019AI/1075AI/1081AI/ 1017DI/1094DI, rev 8 Plastic Encapsulated Device ALPHA & OMEGA Semiconductor, Inc 495 Mercury Drive Sunnyvale, CA 94085 U.S. Tel: 408 830-9742 www.aosmd.com October 10, 2008

cel8240

Abstract: CEL8240HF10 CEL8240HF10LXC CEL8240HF10LX PPF leadframe SP6125 SP6126EK1-L SP6330 SP6339 MP-8000C
Contextual Info: PRODUCT CHANGE NOTICE PCN PART NUMBER(S): PCN No.: 08-1201-01 REFER TO ATTACHMENT A DATE: 12/16/08 PART DESCRIPTION: SP6125 /SP6126 /SP6127: High Voltage Step Down Controller in TSOT 6 SP6330: Quad Micropower Supervisory Circuits With Manual Reset and Watchdog

PCN0801

Abstract: hitachi epoxy en4900 Ablestik 8290 en4900 EN-4900 hitachi en4900 epcs1n Nitto* mp8000ch4 epoxy 8290 mp8000ch4
Contextual Info: Revision: 1.1.0 PROCESS CHANGE NOTIFICATION PCN0801 ALTERNATIVE MANUFACTURING SITE FOR EPCS FAMILY Change Description This is an update to PCN0801; please see the revision history table for information specific to this update. Altera introduced Amkor Philippines as an alternative assembly manufacturing site for the Altera

PCN0702

Abstract: SUMITOMO G700 SUMITOMO G600 SUMITOMO EME G700 sumitomo 6300h mold compound SUMITOMO EME G600 EME G600 material properties G600 mold compound mp8000ch4 sumitomo G700 Tg
Contextual Info: Revision: 1.2.0 PROCESS CHANGE NOTIFICATION PCN0702 UPDATE MOLD COMPOUND CHANGE FOR PQFP, PDIP, AND RQFP PACKAGES Change Description: This is an update to PCN0702, published March, 2007. Altera is implementing mold compound material changes on the Plastic Quad Flat Pack PQFP , Plastic Dual In-Line

capacitor vehicle mttf

Abstract: J-STD-020 S9730 ablebond 293 Nitto
Contextual Info: 05/27/2002 RELIABILITY REPORT FOR DS2153, A7 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : ken.wendel@dalsemi.com

CDA194

Abstract: mark a7 sot23 mold compound
Contextual Info: 08/23/2004 RELIABILITY REPORT FOR DS1817, Rev A7 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : ken.wendel@dalsemi.com

Marking c9 SOT23-5

Abstract: Marking b4 SOT23-5 eme marking sot23 lem crossovers marking E5 amplifier Marking G2 SOT23-5 LMV321 LMV921 LMV921M7 LMV921M7X
Contextual Info: LMV921 Qualification Package World’s Smallest 1.8V RR I/O Op Amp •CMVR 300mV beyond rails •RR output swing within 30mV @ 2K load •SC-70 and SOT packaging •LMV321 pin-compatible SC-70 shown actual size. LMV921 QUALIFICATION PACKAGE Summer 1999 Table of

Nitto MP8000

Abstract: Sumitomo G700K g700k JESD78 JESD-78 sumitomo 6600h ablebond ablestik BCB4026
Contextual Info: 8/29/2006 RELIABILITY REPORT FOR DS1086, Rev A1 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : ken.wendel@dalsemi.com

Sumitomo G700K

Abstract: SUMITOMO g600 Ablestik 84-1 sumitomo 6600h G700K
Contextual Info: 8/29/2006 RELIABILITY REPORT FOR DS1094L, Rev A3 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : ken.wendel@dalsemi.com

Contextual Info: 08/23/2004 RELIABILITY REPORT FOR DS1818, Rev A6 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : ken.wendel@dalsemi.com

Intel 21050

Abstract: 21050-AA
Contextual Info: Product Change Notification PCN#: H038 Please respond to your distributor if you have any issues with the timeline or content of this change. No response from customers will be deemed as acceptance of the change and the change will be implemented pursuant to the key milestones set forth in this attached PCN.

z1031

Abstract: QMI2419 CY7C346 JESD22A-112 JESD22-A112
Contextual Info: Cypress Semiconductor Product Qualification Report QTP# 93332/97316/99211 VERSION 1.0 March, 2000 MAX  EPLD, P20 Technology, Fab 2 CY7C346 128-Macrocell MAX EPLD MAX is a Registered Trademark of ALTERA Corporation CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA:

A48 sc70

Abstract: FSC20010035 LMV301 LMV321 LMV821 SC70-5 SC70-5L LMV301MGX
Contextual Info: LMV301 Low Input Bias Current, Single Op Amp Qualification Package National’s LMV301–Low Power, Low Voltage, Single Op Amp Delivers RR/O in a Space Saving SC70 Package IBIAS Current vs. VCM 5 VS =5V 4 IBIAS pA - • Low Input Bias Current (0.18 pA Typ.)

nitto UV tape

Abstract: EME-6710 EME6710 Package 53 8000C MP800 sumitomo epoxy novolac
Contextual Info: 2.0 DEVICE INFORMATION 2.1 Datasheets 2.1.1 LMV7251/55 and LMV7235/395 LMV7251/LMV7255 1.8V Low Voltage Comparator with Rail-to-Rail Input General Description Features The LMV7251/LMV7255 are rail-to-rail input low voltage comparators, which can operate at supply voltage range of

Unisem

Abstract: MIC2563A MP8000C MP-8000
Contextual Info: UNISEM M BERHAD RELIABILITY & QUALITY ASSURANCE Co. No.: 183314-V QUALIFICATION LOT LABORATORY REPORT DESCRIPTION: MICREL LEAD-FREE PACKAGE SOLDERABILTY (MATTE TIN) LOT INFORMATION: Customer Package Device Lot # Serial # Die Attach Mold Comp. Date Code Pad Size

121C-2

Abstract: XC1765D XC95108 XL mp8000ch4 p103 pot datasheet reliability report PQFP240 XC95xxx 17256d D1 PGA 478
Contextual Info: The Reliability Data Program Expanded Version Jan. 1, 2000 Cover P1 TABLE OF CONTENTS Introduction .…4 The Reliability Program. .…4

mark a7 sot23

Contextual Info: 08/23/2004 RELIABILITY REPORT FOR DS1815, Rev A7 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : ken.wendel@dalsemi.com

JESD22-B107

Abstract: J-STD-020 JSTD-020 JESD22-B105 shinetsu
Contextual Info: 05/03/2006 RELIABILITY REPORT FOR DS1609, Rev A1 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : ken.wendel@dalsemi.com

nitto 201

Abstract: mp8000ch4 8361H CY62128B MP8000CH4-A2 MP8000C 7C62128
Contextual Info: Cypress Semiconductor Technology Derivative Qualification Report QTP# 99396 VERSION 1.2 November, 2000 R52LD-5R Technology Fab 4 Cypress CY62128B 128K x 8 Static RAM CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA: Ed Russell Reliability Director 408 432-7069

XC95XXXL

Abstract: XC95XXX XC1765D PQFP240 C17S xc9536 A9903 XCV1000E FG HT 12E APPLICATION Reliability Test Methods for Packaged Devices
Contextual Info: The Reliability Data Program Expanded Version July 1, 2000 Cover P1 TABLE OF CONTENTS Introduction .…4 The Reliability Program. .…4

Nitto

Abstract: CY7C199 JESD22
Contextual Info: Qualification Report August 1996, QTP# 96114, Version 1.0 NITTO LOW ALPHA MOLDING COMPOUND PRODUCT DESCRIPTION for qualification Information provided in this document is intended for generic qualification and technically describes the Cypress part supplied: