MP8000C
Abstract: SN20 MIC2563A-0YSM MIC2563A-1YSM PCB BOARD DIMENSION
Contextual Info: RELIABILITY REPORT DATE: 1/16/04 QUALITY ENG : PURPOSE: Dinh Pham Lead Free Package Qualification. PART # : PACKAGE TYPE : ASSEMBLY LOC M.COMPD LOT # FAB D/C # PROCESS MIC2563A-1YSM 28L SSOP UNISEM MP8000C 2A28088M01 SJ 0309 BCD3 MIC2563A-0YSM 28L SSOP UNISEM
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mic2563a-1ysmmp8000c2a28088m01mic2563a-0ysm+52a33343m043a32765m42mil-std-883sn20pcb board dimension
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MIC29151WU
Abstract: MIC2171WU MIC29151BU MIC2177YWM 20L SOT-23 UNISEM Preconditioning 3a204
Contextual Info: RELIABILITY REPORT DATE: 4/28/2004 QUALITY ENG : Herb Grimm PURPOSE: Matte Tin Reliability Test Summary. HTOL - High Temperature Operating Life Test TA= + 125°C PACKAGE TYPE : PART NO. LOT ID. 168 HR 500 HR 1000HR SSOP 28L MIC2563AYSM 2A28088M01 0/116 0/116
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1000hrmic2563aysm2a28088m01mic2177ywm+123a02058meaot-23mic5248ym2a09099meao-263mic29151wumic2171wumic29151bu20l sot-23unisempreconditioning3a204
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Contextual Info: BCD3 - 3 micron BiPolar Process OPERATING LIFE @ TA = +125C AT RATED VOLTAGE Sample Act Size Hrs Fails +12V 116 168 MSOP +12V 110 168 500 SOICW SOIC SOIC SOIC SOIC SOIC MLF MLF SOT-23 SOT-23 SOIC SOIC SOIC +18.0V +32.0V +32.0V +14V +14V +14V +32.0V +32.0V
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B1340
Abstract: sy10s897 TSMC 0.18 um CMOS 2A243 bcd3 cmos tsmc 0.18 TSMC 0.25Um MIC29203BU Unisem B816E
Contextual Info: Q1-2004-MICREL- PKG STORAGE LIFE TEST BAKE TA = + 150C Package Family PKG Type Lds Device WM W-SOIC W-SOIC W-SOIC WSOIC WSOIC WSOIC WSOIC WSOIC WSOIC WSOIC WSOIC 16 16 16 20 28 28 28 28 28 28 28 MIC2027 MIC2527 MIC2527 MIC2177 MIC1700B SY69952ZC SY69952ZC
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q1-2004-micrel-mic2027mic2527mic2177+13mic1700bsy69952zcsy87701vb1340sy10s897tsmc 0.18 um cmos2a243bcd3cmos tsmc 0.18tsmc 0.25ummic29203buunisemb816e
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