INTEL STACKED CSP Search Results

INTEL STACKED CSP Result Highlights (5)

Part	Manufacturer	Description	Download
EN80C188XL-12	Rochester Electronics LLC	80C188XL - MPU Intel 186 CISC 16-Bit	PDF
EN80C188XL-20	Rochester Electronics LLC	80C188XL - MPU Intel 186 CISC 16-Bit	PDF
54112-801300800LF	Amphenol Communications Solutions	BERGSTIK STACKING	PDF
54242-808202350LF	Amphenol Communications Solutions	BERGSTIK STACKING	PDF
54112-101260800LF	Amphenol Communications Solutions	BERGSTIK STACKING	PDF

INTEL STACKED CSP Datasheets Context Search

Catalog Datasheet	Type	Document Tags	PDF
252633 Abstract: INTEL STRATAFLASH 1.8V Contextual Info: 256-Mbit 1.8 Volt Intel StrataFlash Wireless Memory L18/L30 Stacked-Chip Scale Package (x16) 48F3300L0YDQ0 (x16), 48F3300L0ZDQ0 (x16) Datasheet Product Features • ■ ■ Stacked Chip Scale Package (Stacked-CSP) Architecture — 128-Mbit L18 Flash + 128-Mbit L18 Flash	Original	256-Mbit L18/L30) 48F3300L0YDQ0 48F3300L0ZDQ0 128-Mbit 48F3300L0YDQ0 48F3300L0ZDQ0 252633 INTEL STRATAFLASH 1.8V	PDF
28F6408J3 Abstract: 28F6408J3A Intel SCSP Contextual Info: 3 Volt Intel StrataFlash Memory Stacked-CSP 28F6408J3 Preliminary Datasheet Product Features • ■ ■ ■ ■ ■ ■ Flash Memory plus SRAM — Reduces Memory Board Space Required, Simplifying PCB Design Complexity Stacked Chip Scale Package Technology	Original	28F6408J3 64-Mbit 64-Kword 128-bit AP-663 AP-660 AP-646 28F6408J3 28F6408J3A Intel SCSP	PDF
Intel Stacked CSP Abstract: transistor a018 28F1602C3 28F1604C3 28F3204C3 28F3208C3 29066 28f160 Contextual Info: 3 Volt Intel Advanced+ Stacked Chip Scale Package Memory 28F1602C3, 28F1604C3, 28F3204C3, 28F3208C3 Preliminary Datasheet Product Features • ■ ■ ■ Flash Memory Plus SRAM — Reduces Memory Board Space Required, Simplifying PCB Design Complexity Stacked Chip Scale Package Technology	Original	28F1602C3, 28F1604C3, 28F3204C3, 28F3208C3 Intel Stacked CSP transistor a018 28F1602C3 28F1604C3 28F3204C3 28F3208C3 29066 28f160	PDF
128W18 Abstract: 28f128w18t Intel SCSP 28F128W18B 28F640W18T 128W-1 128W18B micron flash otp Contextual Info: 128-Mbit 1.8 Volt Intel Wireless Flash Memory W18 + 32-Mbit PSRAM Stacked-CSP Family Datasheet Product Features • ■ ■ ■ Flash Architecture — Flexible, Multiple-Partition, DualOperation: Read-While-Write / ReadWhile-Erase — 32 Partitions, 4 Mbits each	Original	128-Mbit 32-Mbit --32-Kword 128W18 RD48F3000W0YBQ0 RD48F3000W0YTQ0 128W18 32PSRAM RD38F3040W0YBQ0 RD38F3040W0YTQ0 28f128w18t Intel SCSP 28F128W18B 28F640W18T 128W-1 128W18B micron flash otp	PDF
Migration Guide for Intel StrataFlash Memory J Abstract: Intel StrataFlash Memory j3 Intel Stacked CSP 1997 28F008B3 28F008S5 28F016B3 28F128W18 28F160B3 28F320B3 28F800B3 Contextual Info: PRODUCT SELECTION MATRIX P Intel 1.8V Wireless Flash W18/W30 R O D Intel StrataFlash® Memory (J3) U C T S Synchronous Intel StrataFlash® Memory (K3/K18) Advanced+ Boot Block (C3) X8 Organization X16 8 Mb 16 Mb 32 Mb Density 64 Mb 128 Mb 256 Mb Burst	Original	W18/W30) K3/K18) 128-bit Migration Guide for Intel StrataFlash Memory J Intel StrataFlash Memory j3 Intel Stacked CSP 1997 28F008B3 28F008S5 28F016B3 28F128W18 28F160B3 28F320B3 28F800B3	PDF
28F3202C3 Abstract: 29066 Contextual Info: PRODUCT PREVIEW 3 VOLT ADVANCED+ STACKED CHIP SCALE PACKAGE MEMORY 16-Mbit Flash + 2-Mbit SRAM - 28F1602C3 16-Mbit Flash + 4-Mbit SRAM - 28F1604C3 32-Mbit Flash + 4-Mbit SRAM - 28F3204C3 32-Mbit Flash + 2-Mbit SRAM - 28F3202C3 ! Flash Memory Plus SRAM	Original	16-Mbit 28F1602C3 32-Mbit 28F3204C3 28F1604C3 28F3202C3 16-Mb 32-Mb 28F3202C3 29066	PDF
AP-657 Abstract: Intel Stacked CSP 28F1602C3 28F3204C3 29066 Contextual Info: E PRODUCT PREVIEW 3 VOLT ADVANCED+ STACKED CHIP SCALE PACKAGE MEMORY 16-Mbit Flash + 2-Mbit SRAM - 28F1602C3 32-Mbit Flash + 4-Mbit SRAM - 28F3204C3 n n n n n Flash Memory Plus SRAM  Reduces Board Design Complexity n Stacked Die, Chip Scale Package  Smallest Possible Memory	Original	16-Mbit 28F1602C3 32-Mbit 28F3204C3 28F1602C3, AP-657 Intel Stacked CSP 28F1602C3 28F3204C3 29066	PDF
PF38F3040 Abstract: PF38F4050 PF38F4050L0 3144* intel l18scsp Contextual Info: Intel StrataFlash Wireless Memory L18 SCSP 768-Mbit L18 Family with Synchronous PSRAM Datasheet Product Features Device Architecture — Flash Die Density: 128 or 256-Mbit — PSRAM Die Density: 32 or 64-Mbit — x16 Non-Mux or ADMux I/O Interface Option	Original	768-Mbit 256-Mbit 64-Mbit 11x13 PF38F3040 PF38F4050 PF38F4050L0 3144* intel l18scsp	PDF
29066 Contextual Info: 3 Volt Advanced+ Stacked Chip Scale Package Memory 28F1602C3, 28F1604C3, 28F3204C3, 28F3208C3 Preliminary Datasheet Product Features • ■ ■ ■ Flash Memory Plus SRAM — Reduces Memory Board Space Required, Simplifying PCB Design Complexity Stacked Chip Scale Package Technology	Original	28F1602C3, 28F1604C3, 28F3204C3, 28F3208C3 16-Mbit 32-Mbit 32-Mbit/8-Mbit 32-Mbit/4-Mbit, 29066	PDF
28F1602C3 Abstract: 28F1604C3 28F3204C3 28F3208C3 Contextual Info: 3 Volt Advanced+ Stacked Chip Scale Package Memory 28F1602C3, 28F1604C3, 28F3204C3, 28F3208C3 Preliminary Datasheet Product Features • ■ ■ ■ Flash Memory Plus SRAM — Reduces Memory Board Space Required, Simplifying PCB Design Complexity Stacked Chip Scale Package Technology	Original	28F1602C3, 28F1604C3, 28F3204C3, 28F3208C3 16-Mbit 32-Mbit 32-Mbit/4-Mbit, 16-Mbit/4-Mbit 28F1602C3 28F1604C3 28F3204C3 28F3208C3	PDF
PC100 Abstract: PC133 54-PIN HYM71V653201 Contextual Info: 2 . PRODUCT QUICK REFERENCE X XX XX X X XX X X - X - X X£ HYNIX MEMORY PRODUCT Q U IC K REFERENCE HY XX I : Industrial Temperature E: Extended Temperature SPEED s 200MHz 183MHz 55 6 7 PRODUCT GROUP 57 : SDRAMs PROCESS & POWER SUPPLY : CMOS, 3.3V DENSTTY& REFRESH	OCR Scan	200MHz 183MHz 166MHz 143MHz PC133 125MHz PC100, 100MHz PC100 54-PIN HYM71V653201	PDF
29066 Abstract: 28f3204 Contextual Info: 3 Volt Advanced+ Stacked Chip Scale Package Memory 28F1602C3, 28F1604C3, 28F3204C3 Preliminary Datasheet Product Features • ■ ■ ■ Flash Memory Plus SRAM — Reduces Memory Board Space Required, Simplifying PCB Design Complexity Stacked Chip Scale Package Technology	Original	28F1602C3, 28F1604C3, 28F3204C3 16-Mbit 32-Mbit 29066 28f3204	PDF
PH28F640W30BD70 Abstract: ge28f640w30td70 8857H 28F128W30 28F320W30 28F640W30 intel DOC GE28F640W30-B Contextual Info: Intel Wireless Flash Memory W30 28F640W30, 28F320W30, 28F128W30 Datasheet Product Features • ■ ■ ■ High Performance Read-While-Write/Erase — Burst Frequency at 40 MHz — 70 ns Initial Access Speed — 25 ns Page-Mode Read Speed — 20 ns Burst-Mode Read Speed	Original	28F640W30, 28F320W30, 28F128W30 GE28F320W30BD70 GE28F320W30TD70 GE28F320W30BD85 GE28F320W30TD85 PH28F320W30BD70 PH28F320W30TD70 PF48F1000W0ZBQ0 PH28F640W30BD70 ge28f640w30td70 8857H 28F128W30 28F320W30 28F640W30 intel DOC GE28F640W30-B	PDF
NEC stacked MCP 1999 Abstract: Stacked CSP 1999 MCP Technology Trend 13B1 NEC stacked CSP memory NEC stacked CSP 2000 Hitachi Stacked CSP sharp calculator Contextual Info: Packaging Trends for Mobile Application Morihiro Kada Abstract The advent of the CSP has heralded a new paradigm in semiconductor packaging technology. Previously overshadowed by IC chips, packaging technology has begun to take center stage as a key factor in product competitiveness. Packaging technology will develop into 3D packages, and will create a	Original		PDF

csp defects Abstract: 13B1 IMT-2000 PCB design for very fine pitch csp package mitsubishi gaAs 1998 plasma display address electrode driving Contextual Info: The Dawn of 3D Packaging as System-in-Package SIP Morihiro Kada Abstract The three-dimensional chip-stacked CSP, which started with a flash/SRAM combination memory for cellular phones, was the forerunner from which 3D system packages realize full-scale capability. In the future, 3D package technology will act as a savior in achieving greater shrink of	Original		PDF
PXA272 Abstract: PXA271 PXA27x Processor design PXA271fc intel FDI PXA27x Processor Family Users Manual PXA27x Processor Family Intel PXA272 Intel XScale PXA272 pxa272 XScale Contextual Info: Intel PXA27x Processor Family Memory Subsystem Datasheet Product Features • ■ ■ ■ ■ Device Architecture — Flash die density: 128-, 256-Mbit — LPSDRAM die density: 256-Mbit — Flash + LPDRAM Combo x16 — Flash + Flash Combo (x32) Device Voltage	Original	PXA27x 256-Mbit 14x14 256-Mbit PXA272 PXA271 PXA27x Processor design PXA271fc intel FDI PXA27x Processor Family Users Manual PXA27x Processor Family Intel PXA272 Intel XScale PXA272 pxa272 XScale	PDF
PXA271 Abstract: PXA27x Processor Power Supply Requirements PXA27x Processor design Universal Subscriber Identity Module pxa25 pxa272 XScale PXA270 usb Contextual Info: Intel PXA27x Processor Family Electrical, Mechanical, and Thermal Specification Data Sheet • ■ ■ ■ ■ ■ ■ ■ ■ ■ High-performance processor: — Intel XScale® microarchitecture with Intel® Wireless MMX Technology — 7 Stage pipeline	Original	PXA27x PXA271 PXA27x Processor Power Supply Requirements PXA27x Processor design Universal Subscriber Identity Module pxa25 pxa272 XScale PXA270 usb	PDF
SANDISK NAND ID code Abstract: Sandisk TSOP MICRON NAND MLC DATASHEET intel nand flash transistor poly3 SANDISK NAND NAND FLASH BGA Datasheet Micron MLC Sandisk NAND Flash memory controller ecc nand flash gbit Contextual Info: P E R S P E C T I V E S O N P O R T A B L E D E S I G N Flash developments empower portables Flash chip sizes are shrinking as power goes down, yet the number of package options and IC technologies are exploding. T echnological innovation and a buyer’s market are combining to	Original		PDF
PXA271 Abstract: PXA272 FND COMMON CATHODE DISPLAY PXA270 jtag flash programming PXA27x core developers guide MCX 90 motorola blackberry mobile phone circuit diagram 0.65mm pitch BGA socket motorola MCX 90 radio PXA272 jtag flash programming Contextual Info: Intel PXA27x Processor Family Electrical, Mechanical, and Thermal Specification Data Sheet • ■ ■ ■ ■ ■ ■ ■ ■ ■ High-performance processor: — Intel XScale® microarchitecture with Intel® Wireless MMX Technology — 7 Stage pipeline	Original	PXA27x Glossary-14 PXA271 PXA272 FND COMMON CATHODE DISPLAY PXA270 jtag flash programming PXA27x core developers guide MCX 90 motorola blackberry mobile phone circuit diagram 0.65mm pitch BGA socket motorola MCX 90 radio PXA272 jtag flash programming	PDF
Numonyx admux Abstract: PF38F2030W0YTQE numonyx 106 ball PSRAM TBA 931 PF38F2030 4400p0 x16C NOR Flash AAD die000000h Contextual Info: Numonyx Wireless Flash Memory W18 SCSP 128-Mbit W18 Family with Synchronous PSRAM Datasheet Product Features Device Architecture — Flash Die Density: 32, 64 or 128-Mbit — PSRAM Die Density: 16 or 32-Mbit — x16 Non-Mux or ADMux I/O Interface Option	Original	128-Mbit 128-Mbit 32-Mbit x32SH x16SB x16/x32 Numonyx admux PF38F2030W0YTQE numonyx 106 ball PSRAM TBA 931 PF38F2030 4400p0 x16C NOR Flash AAD die000000h	PDF
manual motherboard canada ices 003 class b LGA775 Abstract: manual motherboard intel canada ices 003 class b LGA775 Xeon MTBF S3200SH S3200X38 SC5299-E pcie X8 connector IPMI BMC s3200sh manual ps2 Keyboard pinout color mercury 845 MOTHERBOARD SERVICE MANUAL Contextual Info: Intel Server Boards S3200SH/S3210SH Technical Product Specification Intel Order Number: E14960-004 Revision 1.3 April 2008 Enterprise Platforms and Services Division Revision History Intel® Server Boards S3200SH/S3210SH TPS Revision History Date Sept. 2007	Original	S3200SH/S3210SH E14960-004 S3200SH/S3210SH 16-bit S3200 manual motherboard canada ices 003 class b LGA775 manual motherboard intel canada ices 003 class b LGA775 Xeon MTBF S3200SH S3200X38 SC5299-E pcie X8 connector IPMI BMC s3200sh manual ps2 Keyboard pinout color mercury 845 MOTHERBOARD SERVICE MANUAL	PDF
us 857d Contextual Info: IDTCSPT857D 2.5V - 2.6V PLL DIFFERENTIAL 1:10 SDRAM CLOCK DRIVER COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES 2.5V - 2.6V PHASE LOCKED LOOP DIFFERENTIAL 1:10 SDRAM CLOCK DRIVER IDTCSPT857D ADVANCE INFORMATION DESCRIPTION: FEATURES: The CSPT857D is a PLL based clock driver that acts as a zero delay buffer	Original	IDTCSPT857D CSPT857D 20MHz, us 857d	PDF
pc3200 memory Contextual Info: IDTCSPT857C 2.5V - 2.6V PLL DIFFERENTIAL 1:10 SDRAM CLOCK DRIVER COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES 2.5V - 2.6V PHASE LOCKED LOOP DIFFERENTIAL 1:10 SDRAM CLOCK DRIVER IDTCSPT857C DESCRIPTION: FEATURES: The CSPT857C is a PLL based clock driver that acts as a zero delay buffer	Original	IDTCSPT857C CSPT857C 20MHz, pc3200 memory	PDF
us 857d Abstract: CSPT857D DDR1-400 DDR200 IDTCSPT857D PC2100 PC2700 PC3200 Contextual Info: IDTCSPT857D 2.5V - 2.6V PLL DIFFERENTIAL 1:10 SDRAM CLOCK DRIVER COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES 2.5V - 2.6V PHASE LOCKED LOOP DIFFERENTIAL 1:10 SDRAM CLOCK DRIVER IDTCSPT857D DESCRIPTION: FEATURES: The CSPT857D is a PLL based clock driver that acts as a zero delay buffer	Original	IDTCSPT857D CSPT857D 20MHz, us 857d DDR1-400 DDR200 IDTCSPT857D PC2100 PC2700 PC3200	PDF

INTEL STACKED CSP Search Results

INTEL STACKED CSP Result Highlights (5)

INTEL STACKED CSP Datasheets Context Search

252633

28F6408J3

Intel Stacked CSP

128W18

Migration Guide for Intel StrataFlash Memory J

28F3202C3

AP-657

PF38F3040

29066

28F1602C3

PC100

29066

PH28F640W30BD70

NEC stacked MCP 1999

csp defects

PXA272

PXA271

SANDISK NAND ID code

PXA271

Numonyx admux

manual motherboard canada ices 003 class b LGA775

us 857d

pc3200 memory

us 857d