252633
Abstract: INTEL STRATAFLASH 1.8V
Contextual Info: 256-Mbit 1.8 Volt Intel StrataFlash Wireless Memory L18/L30 Stacked-Chip Scale Package (x16) 48F3300L0YDQ0 (x16), 48F3300L0ZDQ0 (x16) Datasheet Product Features • ■ ■ Stacked Chip Scale Package (Stacked-CSP) Architecture — 128-Mbit L18 Flash + 128-Mbit L18 Flash
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256-mbitl18/l3048f3300l0ydq048f3300l0zdq0+3128-mbit252633intel strataflash 1.8v
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l18scsp
Abstract: 128L18 48F3300L0YDQ0 48F3300L0ZDQ0 28F128L18 28F128L30 251902 RD48F3300L0YDQ0 INTEL STRATAFLASH
Contextual Info: 256-Mbit 1.8 Volt Intel StrataFlash Wireless Memory L18/L30 Stacked-Chip Scale Package (x16) 48F3300L0YDQ0 (x16), 48F3300L0ZDQ0 (x16) Datasheet Product Features • ■ ■ Stacked Chip Scale Package (Stacked-CSP) Architecture — 128-Mbit L18 Flash + 128-Mbit L18 Flash
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256-mbitl18/l3048f3300l0ydq048f3300l0zdq0+8128-mbitl18scsp128l1828f128l1828f128l30251902rd48f3300l0ydq0intel strataflash
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28F6408J3
Abstract: 28F6408J3A Intel SCSP
Contextual Info: 3 Volt Intel StrataFlash Memory Stacked-CSP 28F6408J3 Preliminary Datasheet Product Features • ■ ■ ■ ■ ■ ■ Flash Memory plus SRAM — Reduces Memory Board Space Required, Simplifying PCB Design Complexity Stacked Chip Scale Package Technology
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28f6408j364-mbit64-kword128-bit+5ap-663ap-660ap-64628f6408j3aintel scsp
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Intel Stacked CSP
Abstract: transistor a018 28F1602C3 28F1604C3 28F3204C3 28F3208C3 29066 28f160
Contextual Info: 3 Volt Intel Advanced+ Stacked Chip Scale Package Memory 28F1602C3, 28F1604C3, 28F3204C3, 28F3208C3 Preliminary Datasheet Product Features • ■ ■ ■ Flash Memory Plus SRAM — Reduces Memory Board Space Required, Simplifying PCB Design Complexity Stacked Chip Scale Package Technology
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28f1602c328f1604c328f3204c328f3208c3+4intel stacked csptransistor a0182906628f160
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Intel Stacked CSP
Abstract: transistor 2N 5551 28F160C3 28F320C3 252636 RD28F1604C3BD70 2N2728
Contextual Info: 3 Volt Intel Advanced+ Boot Block Flash Memory C3 Stacked-Chip Scale Package Family Datasheet Product Features • ■ ■ ■ Flash Memory Plus SRAM — Reduces Memory Board Space Required, Simplifying PCB Design Complexity Stacked-Chip Scale Package (StackedCSP) Technology
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16mbit32mbitrd38f1010c0ztl0rd38f1010c0zbl0+10rd28f3208c3t90rd38f1020c0ztl0rd28f3208c3b90intel stacked csptransistor 2n 555128f160c328f320c3252636rd28f1604c3bd702n2728
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Intel Stacked CSP
Abstract: Stacked CSP 1999
Contextual Info: E PRELIMINARY Mechanical Specification for Intel Stacked-Chip Scale Package April 1999 Revision: 1.0 Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in
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128-mbit32-mbit16-mbit72-ball+2intel stacked cspstacked csp 1999
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128W18
Abstract: 28f128w18t Intel SCSP 28F128W18B 28F640W18T 128W-1 128W18B micron flash otp
Contextual Info: 128-Mbit 1.8 Volt Intel Wireless Flash Memory W18 + 32-Mbit PSRAM Stacked-CSP Family Datasheet Product Features • ■ ■ ■ Flash Architecture — Flexible, Multiple-Partition, DualOperation: Read-While-Write / ReadWhile-Erase — 32 Partitions, 4 Mbits each
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128-mbit32-mbit--32-kword128w18+12rd48f3000w0ybq0rd48f3000w0ytq032psramrd38f3040w0ybq0rd38f3040w0ytq028f128w18tintel scsp28f128w18b28f640w18t128w-1128w18bmicron flash otp
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rd33708
Abstract: BGA PACKAGE TOP MARK intel Intel H4 socket 28F3202C3 intel h2 socket 806801 Intel Stacked CSP 28F1602C3 JEDEC TRAY DIMENSIONS 28F3204C3
Contextual Info: Mechanical Specification and Shipping Media Information for Intel Stacked-Chip Scale Packages PRELIMINARY May 2000 Document Number: 298068-005 Information in this document is provided in connection with Inte® products. No license, express or implied, by estoppel or otherwise, to any intellectual
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28f1602c3us04863128f1604c328f3202c3+928f3204c3us048681rd33708bga package top mark intelintel h4 socketintel h2 socket806801intel stacked cspjedec tray dimensions
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Migration Guide for Intel StrataFlash Memory J
Abstract: Intel StrataFlash Memory j3 Intel Stacked CSP 1997 28F008B3 28F008S5 28F016B3 28F128W18 28F160B3 28F320B3 28F800B3
Contextual Info: PRODUCT SELECTION MATRIX P Intel 1.8V Wireless Flash W18/W30 R O D Intel StrataFlash® Memory (J3) U C T S Synchronous Intel StrataFlash® Memory (K3/K18) Advanced+ Boot Block (C3) X8 Organization X16 8 Mb 16 Mb 32 Mb Density 64 Mb 128 Mb 256 Mb Burst
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w18/w30k3/k18128-bitmigration guide for intel strataflash memory j+9intel strataflash memory j3intel stacked csp 199728f008b328f008s528f016b328f128w1828f160b328f320b328f800b3
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1gb pc133 SDRAM DIMM 144pin
Abstract: 54-PIN PC100 gm72v66841
Contextual Info: 2 . PRODUCT QUICK REFERENCE PRODUCT QUICK REFERENCE HY XX X XX XX X X X X X X - xx x .L HYNIX MEMORY : SDRAMs PROCESS & POWER SUPPLY : CMOS, 3.3V DENSITY & REFRESH 64M 4K Refresh 64M 8K Refresh 128M 4K Refresh 256M 8K Refresh 64 65 28 56 12 512M 8K Refresh
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200mhz183mhz166mhz143mhz+7pc133125mhzpc100100mhz1gb pc133 sdram dimm 144pin54-pingm72v66841
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VCC166
Abstract: 128m simm 72 pin ddr 200pin SO DIMM L-71001-0D 72 pin 128mb L7105 L-71051-0C 72 simm edo dram 64mb
Contextual Info: L-71001-0D MITSUBISHI ELECTRIC REV Mitsubishi Memory Module Technical Direction Large Capacity 64MB 128MB 256MB 512MB 1GB High Speed EDO SDRAM Small outline DDR SDRAM RDRAMTM 72pin S.O.DIMM Memory Module 144pin S.O.DIMM 200pin DDR S.O. DIMM 72pin x36 168pin
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l-71001-0d128mb256mb512mb+1172pin144pin200pin168pinvcc166128m simm 72 pinddr 200pin so dimm72 pin 128mbl7105l-71051-0c72 simm edo dram 64mb
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28F3202C3
Abstract: 29066
Contextual Info: PRODUCT PREVIEW 3 VOLT ADVANCED+ STACKED CHIP SCALE PACKAGE MEMORY 16-Mbit Flash + 2-Mbit SRAM - 28F1602C3 16-Mbit Flash + 4-Mbit SRAM - 28F1604C3 32-Mbit Flash + 4-Mbit SRAM - 28F3204C3 32-Mbit Flash + 2-Mbit SRAM - 28F3202C3 ! Flash Memory Plus SRAM
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AP-657
Abstract: Intel Stacked CSP 28F1602C3 28F3204C3 29066
Contextual Info: E PRODUCT PREVIEW 3 VOLT ADVANCED+ STACKED CHIP SCALE PACKAGE MEMORY 16-Mbit Flash + 2-Mbit SRAM - 28F1602C3 32-Mbit Flash + 4-Mbit SRAM - 28F3204C3 n n n n n Flash Memory Plus SRAM Reduces Board Design Complexity n Stacked Die, Chip Scale Package Smallest Possible Memory
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16-mbit28f1602c332-mbit28f3204c3+3ap-657intel stacked csp29066
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PF38F3040
Abstract: PF38F4050 PF38F4050L0 3144* intel l18scsp
Contextual Info: Intel StrataFlash Wireless Memory L18 SCSP 768-Mbit L18 Family with Synchronous PSRAM Datasheet Product Features Device Architecture — Flash Die Density: 128 or 256-Mbit — PSRAM Die Density: 32 or 64-Mbit — x16 Non-Mux or ADMux I/O Interface Option
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768-mbit256-mbit64-mbit11x13+5pf38f3040pf38f4050pf38f4050l03144* intell18scsp
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PF38F1030W0Y
Abstract: PF38F2030 PF38F 3117* intel
Contextual Info: Intel Wireless Flash Memory W18 128-Mbit W18 Family with Synchronous PSRAM Product Features Datasheet Device Architecture — Flash Die Density: 32, 64 or 128-Mbit — PSRAM Die Density: 16 or 32-Mbit — x16 Non-Mux or ADMux I/O Interface Option — Bottom or Top Flash Parameter
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29066
Contextual Info: 3 Volt Advanced+ Stacked Chip Scale Package Memory 28F1602C3, 28F1604C3, 28F3204C3, 28F3208C3 Preliminary Datasheet Product Features • ■ ■ ■ Flash Memory Plus SRAM — Reduces Memory Board Space Required, Simplifying PCB Design Complexity Stacked Chip Scale Package Technology
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28F1602C3
Abstract: 28F1604C3 28F3204C3 28F3208C3
Contextual Info: 3 Volt Advanced+ Stacked Chip Scale Package Memory 28F1602C3, 28F1604C3, 28F3204C3, 28F3208C3 Preliminary Datasheet Product Features • ■ ■ ■ Flash Memory Plus SRAM — Reduces Memory Board Space Required, Simplifying PCB Design Complexity Stacked Chip Scale Package Technology
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IMC016FLSC
Abstract: 28F320C3 IMC008FLSC PLCC 44 intel package dimensions 28F800C3a 28f800b5 3 Volt Intel StrataFlash Memory 28F160S5 28F400B5 28F008B3
Contextual Info: Flash Memory Quick Reference Guide ion 9 Vers ’99 April Intel package and tools lineup Intel Package and Tools Lineup • Software Builder–Application software for Intel Flash memory products. • Online Utilities–Understand how Intel® Flash memory products will
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usa/0499/10k/msimc016flsc28f320c3imc008flsc+7plcc 44 intel package dimensions28f800c3a28f800b53 volt intel strataflash memory28f160s528f400b528f008b3
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PC100
Abstract: PC133 54-PIN HYM71V653201
Contextual Info: 2 . PRODUCT QUICK REFERENCE X XX XX X X XX X X - X - X X£ HYNIX MEMORY PRODUCT Q U IC K REFERENCE HY XX I : Industrial Temperature E: Extended Temperature SPEED s 200MHz 183MHz 55 6 7 PRODUCT GROUP 57 : SDRAMs PROCESS & POWER SUPPLY : CMOS, 3.3V DENSTTY& REFRESH
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200mhz183mhz166mhz143mhz+6pc133125mhzpc100100mhz54-pinhym71v653201
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PF38F4060
Abstract: PF38F4060M SCSP M18 PF38F4050 PF38F4060M0y 3076* intel 3098* intel tba 790
Contextual Info: Intel StrataFlash Cellular Memory M18 SCSP 2048-Mbit M18 Family with Synchronous PSRAM Datasheet Product Features Device Architecture — Flash Die Density: 256, 512 Mbit, or 1 Gbit — PSRAM Die Density: 64 or 128 Mbit — x16 Non-Mux or AD-Mux I/O Interface
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29066
Abstract: 28f3204
Contextual Info: 3 Volt Advanced+ Stacked Chip Scale Package Memory 28F1602C3, 28F1604C3, 28F3204C3 Preliminary Datasheet Product Features • ■ ■ ■ Flash Memory Plus SRAM — Reduces Memory Board Space Required, Simplifying PCB Design Complexity Stacked Chip Scale Package Technology
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L24002
Abstract: NAND "read disturb" 1GB Toshiba 512 NAND MLC FLASH BGA PC133 registered reference design CMOS 0.8mm process cross Lithium battery CR2025 sony M2V28S30AVP M5M51008CFP
Contextual Info: Future On Chips MITSUBISHI SEMICONDUCTORS MITSUBISHI ELECTRIC CORPORATION ULSI Memory Memory Series Series ULSI RAM/MCP/FLASH New Data Package http://www.mitsubishichips.com Jul. 2000 MITSUBISHI ELECTRIC L-11002-01 CONTENTS General Business Operation Network and Production Facilities
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l-11002-0164mdram64msdram128msdram+10256msdram144mrdraml24002nand "read disturb" 1gbtoshiba 512 nand mlc flash bgapc133 registered reference designcmos 0.8mm process crosslithium battery cr2025 sonym2v28s30avpm5m51008cfp
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PH28F640W30BD70
Abstract: ge28f640w30td70 8857H 28F128W30 28F320W30 28F640W30 intel DOC GE28F640W30-B
Contextual Info: Intel Wireless Flash Memory W30 28F640W30, 28F320W30, 28F128W30 Datasheet Product Features • ■ ■ ■ High Performance Read-While-Write/Erase — Burst Frequency at 40 MHz — 70 ns Initial Access Speed — 25 ns Page-Mode Read Speed — 20 ns Burst-Mode Read Speed
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28f640w3028f320w3028f128w30ge28f320w30bd70+11ge28f320w30td70ge28f320w30bd85ge28f320w30td85ph28f320w30bd70ph28f320w30td70pf48f1000w0zbq0ph28f640w30bd70ge28f640w30td708857hintel docge28f640w30-b
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NEC stacked MCP 1999
Abstract: Stacked CSP 1999 MCP Technology Trend 13B1 NEC stacked CSP memory NEC stacked CSP 2000 Hitachi Stacked CSP sharp calculator
Contextual Info: Packaging Trends for Mobile Application Morihiro Kada Abstract The advent of the CSP has heralded a new paradigm in semiconductor packaging technology. Previously overshadowed by IC chips, packaging technology has begun to take center stage as a key factor in product competitiveness. Packaging technology will develop into 3D packages, and will create a
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nec stacked mcp 1999stacked csp 1999mcp technology trend13b1+4nec stacked csp memorynec stacked csp 2000hitachi stacked cspsharp calculator
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