FLASH MEMORY SAMSUNG K5 Search Results

SAMSUNG MCp

Abstract: samsung NAND FLASH BGA SAMSUNG 128Mb NAND Flash Qualification Reliability
Contextual Info: Preliminary MCP MEMORY K5P5781FCM Document Title Multi-Chip Package MEMORY 256M Bit 16Mx16 Nand Flash Memory / 8M Bit (512Kx16) Full CMOS SRAM Revision History Revision No. History Draft Date Remark 0.0 Initial draft. April 18, 2003 Preliminary 0.1 Revised

SAMSUNG MCP

Abstract: MCP NAND
Contextual Info: Preliminary MCP MEMORY K5P2881BCM Document Title Multi-Chip Package MEMORY 128M Bit 16Mx8 Nand Flash Memory / 8M Bit (512Kx16) Full CMOS SRAM Revision History Revision No. History Draft Date Remark 0.0 Initial draft. - 128M NAND Flash C-die - 8M SRAM B-die

K8D3216UBC-pi07

Abstract: K5E5658HCM KAD070J00M KBH10PD00M K5D1257ACM-D090000 samsung ddr2 ram MTBF KBB05A500A K801716UBC k5d1g13acm k5a3281ctm
Contextual Info: Product Selection Guide Memory and Storage April 2005 MEMORY AND STORAGE SECTION A DRAM DDR2 SDRAM DDR SDRAM SDRAM RDRAM NETWORK DRAM MOBILE SDRAM GRAPHICS DDR SDRAM DRAM ORDERING INFORMATION FLASH NAND, OneNAND, NOR FLASH NAND FLASH ORDERING INFORMATION SRAM

transistor A1624

Abstract: ba21 transistor Samsung K5 128MB flash BA252 BA339 512Mb nor flash memory K5N1229ACD-BQ12 TBA 1205 K5n12 samsung, K5N
Contextual Info: Rev. 1.0, Jun. 2010 K5N1229ACD-BQ12 MCP Specification 512Mb 32M x16 Muxed Burst, Multi Bank SLC NOR Flash + 128Mb (8M x16) Multiplexed Synchronous Burst UtRAM2 datasheet SAMSUNG ELECTRONICS RESERVES THE RIGHT TO CHANGE PRODUCTS, INFORMATION AND SPECIFICATIONS WITHOUT NOTICE.

Contextual Info: S3C82F5/F82F5 8-BIT CMOS MICROCONTROLLERS USER'S MANUAL Revision 1 Important Notice The information in this publication has been carefully checked and is believed to be entirely accurate at the time of publication. Samsung assumes no responsibility, however, for possible errors or

DPP1500

Abstract: K4M28163PH-BG75 pico projector BT656-YUV MSDR 333266 samsung dmd chip DLPS019 DLP pico projector bt.656 to RGB888
Contextual Info: DLPC100 www.ti.com DLPS019B – DECEMBER 2009 – REVISED DECEMBER 2010 DLP Digital Controller for the DLP1700 DMD Check for Samples: DLPC100 FEATURES 1 • • • • • • • Optimized to Operate With DLPR100 and DLP1700 Single 24-Bit Input Port RGB or BT656-YUV

AT91SAM9263-EK Evaluation Board Rev. B User Guide

Abstract: AT91SAM9623 K9F2G08U0M-PCB0 saM9263 MT29F2G08AACWP Atmel PART marking YM BOTTOM AT91SAM9263-ek Atmel touchscreen CR1225 coin cell K9F2G08U0M
Contextual Info: AT91SAM9263-EK Evaluation Board Rev. B . User Guide 6341D–ATARM–30-Sep-09 Table of Contents Section 1 Overview . 1-1

S3C2412X

Abstract: crystal oscillator of samsung mobile phone Samsung s3c2412 S3C2413
Contextual Info: S3C2413X 289-FBGA 32-BIT RISC MICROPROCESSOR USER'S MANUAL Revision 1.03 (July 2006) S3C2413X 1 PRODUCT OVERVIEW PRODUCT OVERVIEW INTRODUCTION This manual describes SAMSUNG's S3C2413X 16/32-bit RISC microprocessor. This product is designed to provide hand-held devices and general applications with cost-effective, low-power, and high-performance microcontroller solution in small die size. To reduce total system cost, the S3C2413X includes the following

ARM processor

Abstract: SPI NAND FLASH samsung k9
Contextual Info: KSZ8692PB Integrated Networking and Communications Controller General Description Dual High-Speed USB 2.0 Interfaces The KSZ8692PB is a highly integrated System-on-Chip SoC containing an ARM 922T 32-bit processor and a rich set of peripherals to address the cost-sensitive, highperformance needs of a wide variety of high bandwidth

Contextual Info: KSZ9692MPB/KSZ9692XPB Integrated Gigabit Networking and Communications Controller General Description The KSZ9692MPB/KSZ9692XPB is a highly integrated System-on-Chip SoC containing an ARM 922T 32-bit processor and a rich set of peripherals to address the costsensitive, high-performance needs of a wide variety of high

Samsung eMMC 4.51

Abstract: samsung eMMC 4.5
Contextual Info: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX50CEC Rev. 2, 05/2012 MCIMX50 Package Information Plastic Package Case 416 MAPBGA 13 x 13 mm, 0.5 mm pitch Case 416 PoPBGA 13 x 13 mm, 0.5 mm pitch Case 400 MAPBGA 17 x 17 mm, 0.8 mm pitch

sony IMX 136

Abstract: IMX6DQ6SDLSRM sony sensor imx 136 sony CMOS sensor imx 136 Sony imx 134 cmos sensor sony IMX 138 sony cmos sensor imx 123 sony cmos sensor imx 174 sony CMOS sensor imx 135 sony IMX 260
Contextual Info: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX6DQIEC Rev. 2.2, 07/2013 MCIMX6QxCxxxxC MCIMX6DxCxxxxC i.MX 6Dual/6Quad Applications Processors for Industrial Products Package Information Case FCPBGA 21 x 21 mm, 0.8 mm pitch Ordering Information

intel 8008 cpu

Contextual Info: UM10326 LPC32x0 and LPC32x0/01 User manual Rev. 3 — 22 July 2011 User manual Document information Info Content Keywords LPC3220, LPC3230, LPC3240, LPC3250, ARM9, LPC3220/01, LPC3230/01, LPC3240/01, LPC3250/01, 16/32-bit ARM microcontroller. Abstract User manual for LPC32x0.

sony CMOS sensor imx 135

Abstract: sony iMX 145 cmos image sensor sony cmos sensor imx 174 Sony imx 145 sony iMX 174 cmos image sensor sony IMX 135 sony cmos sensor imx 175 Sony sony imx 175 sony cmos sensor imx 123
Contextual Info: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX6SDLCEC Rev. 3, 03/2014 MCIMX6SxExxxxxB MCIMX6SxExxxxxC MCIMX6UxExxxxxB MCIMX6UxExxxxxC MCIMX6SxDxxxxxB MCIMX6SxDxxxxxC MCIMX6UxDxxxxxB MCIMX6UxDxxxxxC i.MX 6Solo/6DualLite Applications Processors

IMX6DQ6SDLSRM

Contextual Info: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX6DQIEC Rev. 2.3, 07/2013 MCIMX6QxCxxxxC MCIMX6DxCxxxxC i.MX 6Dual/6Quad Applications Processors for Industrial Products Package Information Case FCPBGA 21 x 21 mm, 0.8 mm pitch Ordering Information

IMX6DQ6SDLSRM

Contextual Info: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX6DQAEC Rev. 2.3, 07/2013 MCIMX6QxAxxxxC MCIMX6DxAxxxxC i.MX 6Dual/6Quad Automotive and Infotainment Applications Processors Package Information Case FCPBGA 21 x 21 mm, 0.8 mm pitch Ordering Information

SCIMX

Abstract: sony cmos sensor imx 174
Contextual Info: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX6DQCEC Rev. 2.3, 07/2013 MCIMX6QxDxxxxC MCIMX6QxExxxxC MCIMX6DxDxxxxC MCIMX6DxExxxxC i.MX 6Dual/6Quad Applications Processors for Consumer Products Package Information Case FCPBGA 21 x 21 mm, 0.8 mm pitch

samsung lcd tv circuits diagrams

Abstract: SCIMX IMX6DQ6SDLSRM
Contextual Info: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX6DQCEC Rev. 2.2, 07/2013 MCIMX6QxDxxxxC MCIMX6QxExxxxC MCIMX6DxDxxxxC MCIMX6DxExxxxC i.MX 6Dual/6Quad Applications Processors for Consumer Products Package Information Case FCPBGA 21 x 21 mm, 0.8 mm pitch

IMX6DQ6SDLSRM

Contextual Info: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX6DQIEC Rev. 3, 03/2014 MCIMX6QxCxxxxC MCIMX6QxCxxxxD MCIMX6DxCxxxxC MCIMX6DxCxxxxD i.MX 6Dual/6Quad Applications Processors for Industrial Products Package Information Case FCPBGA 21 x 21 mm, 0.8 mm pitch

SCIMX

Abstract: IMX6DQ6SDLSRM IMX6DQCEC
Contextual Info: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX6DQCEC Rev. 3, 02/2014 MCIMX6QxExxxxC MCIMX6QxExxxxD MCIMX6DxExxxxC MCIMX6DxExxxxD i.MX 6Dual/6Quad Applications Processors for Consumer Products Package Information Case FCPBGA 21 x 21 mm, 0.8 mm pitch

Sony imx 147

Abstract: sony cmos sensor imx 174
Contextual Info: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX6DQAEC Rev. 2.2, 07/2013 MCIMX6QxAxxxxC MCIMX6DxAxxxxC i.MX 6Dual/6Quad Automotive and Infotainment Applications Processors Package Information Case FCPBGA 21 x 21 mm, 0.8 mm pitch Ordering Information

sony IMX 159 camera

Abstract: IMX6DQ6SDLSRM arm cortex a9 mpcore sony CMOS sensor imx 135 sony IMX 135 LVDS to MIPI CSI Samsung eMMC 4.41 MIPI CSI-2 Parallel bridge sony cmos sensor imx 174 sony IMX 132
Contextual Info: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX6DQAxEC Rev. 2, 04/2013 MCIMX6QxAxxxxC MCIMX6DxAxxxxC i.MX 6Dual/6Quad Automotive and Infotainment Applications Processors Package Information Case FCPBGA 21 x 21 mm, 0.8 mm pitch Ordering Information

Sony imx 134

Abstract: IMX6DQ6SDLSRM Sony imx 134 cmos sensor Samsung eMMC 4.41 emmc 4.41 spec MIPI CSI-2 Parallel bridge LVDS to MIPI CSI MCIMX6Q5EYM10AC sony IMX 135 sony IMX 136
Contextual Info: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX6DQCxEC Rev. 2, 04/2013 MCIMX6QxDxxxxC MCIMX6QxExxxxC MCIMX6DxDxxxxC MCIMX6DxExxxxC i.MX 6Dual/6Quad Applications Processors for Consumer Products Package Information Case FCPBGA 21 x 21 mm, 0.8 mm pitch

S3C2400X01

Abstract: S3C2400 S3C44B0 0.18um ST inverter delay pmc MANUFACTURE LABEL Samsung S3C samsung 42" plasma tv power supply diagrams 0x14400000 S3C2400X
Contextual Info: 21.0-S3-C2400X-022002 USER'S MANUAL S3C2400X 32-Bit RISC Microprocessor Revision 1.0 NOTIFICATION OF REVISIONS ORIGINATOR: Samsung Electronics, SOC Development Group, Ki-Heung, South Korea PRODUCT NAME: S3C2400X RISC Microcontroller DOCUMENT NAME: S3C2400X User's Manual, Revision 1.0