EQUIVALENCES TRANSISTOR LIST Search Results

transistor x1

Abstract: SMD led spice model list of P channel power mosfet buz siemens motor starter wiring schematic infineon cool MOSFET dynamic characteristic test Siemens 3TH 80 siemens datenbuch Siemens 3th Siemens 3TH 20-22 siemens profet
Contextual Info: Thermal System Modeling Thermal Modeling of Power-electronic Systems Dr. Martin März, Paul Nance Infineon Technologies AG, Munich Increasing power densities, cost pressure and an associated greater utilization of the robustness of modern power semiconductors are making thermal system optimization more and more important in relation to electrical optimization. Simulation models

BA100 diode

Abstract: BA102 AAY20 B2M1-5 1N2528 PH1021 OA210 diode DIODE AA116 BB105 GAZ17
Contextual Info: r im m i if Hill tWIBHHH ElBtlAlEHTS I SIISHIIffl IT 1 . 1. m n t IElHlllS{|iliitltrs|lfl The Grampians Shepherds Bush Road,. London W6 7NF ' ' Although every care is taken with the preparation o f this book the publishers will, not be responsible fo r any

2n189

Abstract: 2N1136b 2N420 B1151 EQUIVALENT 2SA114 OC59 2T312 2T203 SFT125 2N1152
Contextual Info: INTERNATIONAL TRANSISTOR SUBSTITUTION GUIDEBOOK by KEATS A. PULLEN. Jr., Eng. D. Member of the Scientific Staff, Ballistic Research Laboratories, Aberdeen Proving G rounds Adjunct Professor of Electrical Engineering, Drexel Institute of Technology Author of: Conductance Design of Active Circuits

FD6666 diode

Abstract: diode BY100 1N4Q07 BA100 diode BY164 BB139 BAY38 diode aa119 1S184 diode 1N82
Contextual Info: mil UIIAGHRISnCS [M IN IS i SDISlimiS BY B J . B AB A N I la TANDY CORPORATION Although every c are is taken with the p rep aration of this book the p u b lish ers will not be resp on sib le for any e r r o r s that might occur. 1975 I. S. B. N. 0 900162 46 5

B 834 Y

Abstract: uA 741 NC 2N2222 ADG839 LVCMOS15 RAM51 KT 907 ST 1076
Contextual Info: 2 – Device Architecture Fusion Stack Architecture To manage the unprecedented level of integration in Fusion devices, Actel developed the Fusion technology stack Figure 2-1 . This layered model offers a flexible design environment, enabling design at very high and very low levels of abstraction. Fusion peripherals include hard analog IP

flashpro3 schematic

Abstract: TTL XOR2 LVCMOS15 kt 501
Contextual Info: 2 – Device Architecture Fusion Stack Architecture To manage the unprecedented level of integration in Fusion devices, Actel developed the Fusion technology stack Figure 2-1 . This layered model offers a flexible design environment, enabling design at very high and very low levels of abstraction. Fusion peripherals include hard analog IP

flashpro3 schematic

Abstract: LVCMOS15
Contextual Info: 2 – Device Architecture Fusion Stack Architecture To manage the unprecedented level of integration in Fusion devices, Actel developed the Fusion technology stack Figure 2-1 . This layered model offers a flexible design environment, enabling design at very high and very low levels of abstraction. Fusion peripherals include hard analog IP

Core8051

Abstract: U1AFS600-FG256 FlashPro3 flashpro3 schematic AES-128 FG256 PQ208 gaa 716 kt 501 PUSH PULL MOSFET DRIVER dip
Contextual Info: Preliminary v0.4 Actel Fusion Mixed-Signal FPGA for the MicroBlade Advanced Mezzanine Card Solution Features and Benefits • Targeted to Advanced Mezzanine Card AdvancedMC Designs • Designed in Partnership with MicroBlade • 8051-Based Module Management Controller (MMC)

Contextual Info: Revision 2 Extended Temperature Fusion Family of Mixed Signal FPGAs Features and Benefits • Extended Temperature Tested • Each Device Tested from –55°C to 100°C Junction Temperature High-Performance Reprogrammable Flash Technology • • • • Advanced 130-nm, 7-Layer Metal, Flash-Based CMOS Process

Contextual Info: Advanced v0.1 Actel Fusion Programmable System Chips for the MicroBlade Advanced Mezzanine Card Solution Features and Benefits On-Chip Clocking Support Targeted to Advanced Mezzanine Card AdvancedMC Designs Designed in Partnership with MicroBlade 8051-Based Module Management Controller (MMC)

"Direct Replacement" microsemi

Abstract: 3 phase ac motor speed control Microsemi hearing aid national semiconductor linear applications handbook 2n2222 h 331 datasheet
Contextual Info: Revision 2 Extended Temperature Fusion Family of Mixed Signal FPGAs Features and Benefits • Extended Temperature Tested • Each Device Tested from –55°C to 100°C Junction Temperature High-Performance Reprogrammable Flash Technology • • • • Advanced 130-nm, 7-Layer Metal, Flash-Based CMOS Process

actel smart fusion

Contextual Info: Preliminary v0.4 Actel Fusion Mixed-Signal FPGA for the MicroBlade Advanced Mezzanine Card Solution Features and Benefits • Targeted to Advanced Mezzanine Card AdvancedMC Designs • Designed in Partnership with MicroBlade • 8051-Based Module Management Controller (MMC)

A54 ZENER

Abstract: AFS600-FG256 mark AT0 QN108 CORE8051 bipolar ROM
Contextual Info: v2.0 Actel Fusion Family of Mixed-Signal FPGAs Features and Benefits In-System Programming ISP and Security High-Performance Reprogrammable Flash Technology Advanced Digital I/O • • • • • Secure ISP with 128-Bit AES via JTAG • FlashLock® to Secure FPGA Contents

a51 ZENER DIODE

Abstract: transistor 2n2222 bipolar ROM EQUIVALENCES TRANSISTOR LIST ProASIC3 lvds yl 1060
Contextual Info: Revision 3 Fusion Family of Mixed Signal FPGAs Features and Benefits In-System Programming ISP and Security • ISP with 128-Bit AES via JTAG • FlashLock Designed to Protect FPGA Contents High-Performance Reprogrammable Flash Technology • • • •

zo 103 ma 75 607

Contextual Info: Advanced v1.6 Actel Fusion Mixed-Signal FPGAs ® with Optional ARM® Support Features and Benefits Low Power Consumption • • High-Performance Reprogrammable Flash Technology • • • • Advanced 130-nm, 7-Layer Metal, Flash-Based CMOS Process Nonvolatile, Retains Program when Powered Off

actel core 8051

Contextual Info: Revision 4 Fusion Family of Mixed Signal FPGAs Features and Benefits In-System Programming ISP and Security • ISP with 128-Bit AES via JTAG • FlashLock Designed to Protect FPGA Contents High-Performance Reprogrammable Flash Technology • • • •

transistor part number 2N2222A 338

Abstract: Actel igloo "Direct Replacement" microsemi 2n3904 j17
Contextual Info: Revision 2 Fusion Family of Mixed Signal FPGAs Features and Benefits In-System Programming ISP and Security • ISP with 128-Bit AES via JTAG • FlashLock Designed to Protect FPGA Contents High-Performance Reprogrammable Flash Technology • • • •

TBD 234 V12

Abstract: op amp ua 745
Contextual Info: Advanced v1.2 Actel Fusion Programmable System Chips ® Mixed-Signal Family with Optional ARM® Support Features and Benefits Low Power Consumption • • High-Performance Reprogrammable Flash Technology • • • • Advanced 130-nm, 7-Layer Metal, Flash-Based CMOS Process

a52 zener diode

Abstract: diode ZENER A26 A54 ZENER mark AT0 QN108 CORE8051 NF 838 G bipolar ROM EQUIVALENCES TRANSISTOR LIST 2168 4K1
Contextual Info: Revision 1 Actel Fusion Family of Mixed Signal FPGAs Features and Benefits In-System Programming ISP and Security • Secure ISP with 128-Bit AES via JTAG • FlashLock® to Secure FPGA Contents High-Performance Reprogrammable Flash Technology • •

Contextual Info: Revision 6 Fusion Family of Mixed Signal FPGAs Features and Benefits In-System Programming ISP and Security • ISP with 128-Bit AES via JTAG • FlashLock Designed to Protect FPGA Contents High-Performance Reprogrammable Flash Technology • Advanced 130-nm, 7-Layer Metal, Flash-Based CMOS

EQUIVALENCES TRANSISTOR LIST

Contextual Info: v2.0 Actel Fusion Family of Mixed-Signal FPGAs Features and Benefits In-System Programming ISP and Security High-Performance Reprogrammable Flash Technology Advanced Digital I/O • • • • • Secure ISP with 128-Bit AES via JTAG • FlashLock® to Secure FPGA Contents

motor IG 2200 19 00001

Abstract: ARM7 2148
Contextual Info: Advanced v1.1 Fusion Family of Mixed-Signal Flash FPGAs ® with Optional Soft ARM Support Features and Benefits Low Power Consumption • • High-Performance Reprogrammable Flash Technology • • • • Advanced 130-nm, 7-Layer Metal, Flash-Based CMOS Process

Contextual Info: Advanced v1.3 Actel Fusion Programmable System Chips ® Mixed-Signal Family with Optional ARM® Support Features and Benefits Low Power Consumption • • High-Performance Reprogrammable Flash Technology • • • • Advanced 130-nm, 7-Layer Metal, Flash-Based CMOS Process

Contextual Info: Revision 5 Fusion Family of Mixed Signal FPGAs Features and Benefits In-System Programming ISP and Security • ISP with 128-Bit AES via JTAG • FlashLock Designed to Protect FPGA Contents High-Performance Reprogrammable Flash Technology • • • •