sumitomo epoxy
Abstract: C7025 Compound c7025 heraeus 4851025 SUMITOMO 7351 140C 8361H JESD22 CF-2071 sumitomo
Contextual Info: Cypress Semiconductor Qualification Report QTP# 99302 VERSION 1.0 November, 1999 32L Small Thin Small Outline Package Sumitomo 7351 Molding Compound Cypress Philippines CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA: Ed Russell Reliability Director 408 432-7069
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ABLEBOND
Contextual Info: 8/29/2006 RELIABILITY REPORT FOR DS1086L, Rev A1 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : ken.wendel@dalsemi.com
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G700K
Abstract: Nitto MP8000 Sumitomo G600 Sumitomo G700K JESD78 sumitomo 6600h Compound c7025 JESD-78 BCB4026
Contextual Info: 8/29/2006 RELIABILITY REPORT FOR DS1077L, Rev C2 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : ken.wendel@dalsemi.com
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ds1077ljesd78g700knitto mp8000+6sumitomo g600sumitomo g700ksumitomo 6600hcompound c7025jesd-78bcb4026
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Sumitomo G700K
Abstract: sumitomo 6600h Compound c7025 JESD22-B101 Nitto MP8000 G700K SUMITOMO-G600 epoxy 8290 ablebond ablestik 8290 SUMITOMO g600 UL
Contextual Info: 8/29/2006 RELIABILITY REPORT FOR DS1077, Rev C2 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : ken.wendel@dalsemi.com
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Nitto MP8000
Abstract: Sumitomo G700K g700k JESD78 JESD-78 sumitomo 6600h ablebond ablestik BCB4026
Contextual Info: 8/29/2006 RELIABILITY REPORT FOR DS1086, Rev A1 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : ken.wendel@dalsemi.com
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ds1086jesd78nitto mp8000sumitomo g700k+5g700kjesd-78sumitomo 6600hablebond ablestikbcb4026
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Sumitomo G700K
Abstract: SUMITOMO g600 Ablestik 84-1 sumitomo 6600h G700K
Contextual Info: 8/29/2006 RELIABILITY REPORT FOR DS1094L, Rev A3 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : ken.wendel@dalsemi.com
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ds1094ljesd78sumitomo g700ksumitomo g600+3ablestik 84-1sumitomo 6600hg700k
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sumitomo G700
Abstract: sumitomo epoxy 1076 0038 tsop ablebond Sumitomo 1076 8361J Compound c7025 Die Attach epoxy stamping sumitomo g700 type g700 mold compound
Contextual Info: 10/29/2004 PACKAGE RELIABILITY REPORT FOR 32 TSOP 8mm Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : ken.wendel@dalsemi.com
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sumitomo g700sumitomo epoxy 10760038 tsopablebond+6sumitomo 10768361jcompound c7025die attach epoxy stampingsumitomo g700 typeg700 mold compound
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LMISR4
Abstract: J-STD20A J-STD-20A ablebond copper bond wire copper bond wire amkor ti 9841
Contextual Info: 01/12/05 RELIABILITY REPORT FOR DS1685, Rev B2 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Don Lipps Staff Reliability Engineer Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : don.lipps@dalsemi.com
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ds1685lmisr4j-std20aj-std-20a+4ablebondcopper bond wirecopper bond wire amkorti 9841
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JESD78
Abstract: Sumitomo 6730B Compound c7025 RH-1750
Contextual Info: 05/04/2004 RELIABILITY REPORT FOR DS2770, Rev A4 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : ken.wendel@dalsemi.com
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ds2770reliabilit50cjesd78sumitomo 6730b+2compound c7025rh-1750
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QMI519
Abstract: KEG3000D QMI-519 ra3906 GR828FC Kyocera mold compound Hitachi Datecode KE-G300 KE-G3000 Henkel
Contextual Info: Date Created: 1/28/2004 Date Issued: 3/2/2004 PCN # 20040411 DESIGN/PROCESS CHANGE NOTIFICATION - FINAL This is to inform you that a design and/or process change will be made to the following product s . This notification is for your information and concurrence.
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epax02ext686mm74hct00mtcxmm74hct05mtc+13mm74hct08mtcxmm74hct14mtcmm74hct240mtcxqmi519keg3000dqmi-519ra3906gr828fckyocera mold compoundhitachi datecodeke-g300ke-g3000henkel
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Contextual Info: 08/23/2004 RELIABILITY REPORT FOR DS80C310, D2 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : ken.wendel@dalsemi.com
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7320CR
Abstract: Eftec 64t
Contextual Info: 03/06/2003 RELIABILITY REPORT FOR DS21552, Rev B1 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : ken.wendel@dalsemi.com
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tanaka wire
Abstract: MAC-3070 shinetsu tanaka au wire EME-6730UC Ablestik KMC-184 g991 EME-6730 tanaka wire 10 mils
Contextual Info: Integrated Device Technology, Inc. 2975 Stender Way, Santa Clara, CA - 95054 PRODUCT/PROCESS CHANGE NOTICE PCN DATE: November 18, 1999 MEANS OF DISTINGUISHING CHANGED DEVICES: PCN #: G9911-05 Product Affected: All Platic packages Product Mark Back Mark Manufacturing Location Affected: ALL
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g9911-05kmc184kmc184vaeme-6730+11eme-9730mil-std-883tanaka wiremac-3070shinetsutanaka au wireeme-6730ucablestikkmc-184g991tanaka wire 10 mils
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ALLOY leadframe C7025 material property
Abstract: smd code marking 56L 20L SMD SOT-23 9l marking sot23 ALLOY leadframe C7025 lead frame cu C194 marking code 56l 100L C194 C7025
Contextual Info: A Structured Approach To Lead-Free IC Assembly Transitioning L. Nguyen, R. Walberg, Z. Lin*, T. Koh*, YY Bong*, MC Chua*, S. Chuah*, JJ Yeoh* National Semiconductor Corp. P.O. Box 58090 M/S 19-100 Santa Clara, CA 95052-8090 * National Semiconductor, Singapore
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alloy leadframe c7025 material propertysmd code marking 56l20l smd sot-239l marking sot23+6alloy leadframe c7025lead frame cu c194marking code 56l100lc194c7025
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J-STD-020
Abstract: S0309
Contextual Info: 08/02/2004 RELIABILITY REPORT FOR DS1267, Rev A2 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : ken.wendel@dalsemi.com
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9936
Abstract: 9938 BPSG Ablebond 84-1 LMISR4 9626 Transistors mark 9936 b
Contextual Info: 11/05/2003 RELIABILITY REPORT FOR DS1780, Rev A4, 24 TSSOP 4.4mm Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292
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ds178099369938bpsg+4ablebond 84-1 lmisr49626transistors mark9936 b
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9936
Abstract: 9936 b EFTEC 64T Epoxy
Contextual Info: 12/04/2002 RELIABILITY REPORT FOR DS21Q42 & DS21Q44 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : ken.wendel@dalsemi.com
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ds21q42ds21q4430c/609936+29936 beftec 64t epoxy
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Ablestik 84-1
Abstract: KMC-184 sumitomo epoxy olin 7025 Sumitomo 7351T eme6600cs SUMITOMO EME6600cs 74std kmc184-7 megatest tester
Contextual Info: TM Fairchild Semiconductor Salt Lake 3333 West 9000 South West Jordan, UT 84088-8838 Fax: 1.801.562.7500 CS100HEE MICROWIRE INTERFACE EEPROM QUALIFICATION PACKAGE 1.0um CMOS technology Advanced Semiconductor Manufacturing Corp. of Shanghai Product: .Serial EEPROM
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CDA 194
Abstract: jedec mo-142 footprint jedec ms-024 D2863-77 leadframe C7025 ALJ- 1300 footprint WSON leadframe Cu C7025 MO-052 MO-108
Contextual Info: Chapter 2 Package Design CHAPTER 2 PACKAGE DESIGN Flammability Rating Oxygen Index Fine-Pitch Ball Grid Array Leadframe Packages Packages and Packing Methodologies Handbook 17 Oct 2008 2-1 Chapter 2 Package Design FLAMMABILITY RATING The UL Rating for all Spansion products is 94 V-0.
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FLUX TYPE ROL0
Abstract: ALLOY leadframe C7025 ST-300 C7025 strip specification smd EDL 63 ST-50 adrian borg 10X10 C151 C194
Contextual Info: The Qualification of a Pure Tin Plating Process as a Lead Free Finish for I.C. Packaging Joseph Gauci, Adrian-Michael Borg and Robert Caruana, ST Microelectronics, Malta Keith Whitlaw and Jeff Crosby, Rohm and Haas Electronic Materials, Coventry, UK Abstract
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st-300workshop/54thflux type rol0alloy leadframe c7025+7c7025 strip specificationsmd edl 63st-50adrian borg10x10c151c194
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AN-772
Abstract: EM-99 C7025 IPC-SM-782 JESD51-5 MO220 MO-220 MO229 tssop 16 exposed pad stencil 20-lead lfcsp
Contextual Info: AN-772 Application Note One Technology Way • P.O. Box 9106 • Norwood, MA 02062-9106 • Tel: 781/329-4700 • Fax: 781/461-3113 • www.analog.com A Design and Manufacturing Guide for the Lead Frame Chip Scale Package LFCSP by Gary Griffin Table of Contents
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ph44
Abstract: Tanaka GL2 tanaka wire Ablebond 8340 tanaka au wire tanaka epoxy Compound c7025 Ablebond tanaka C7025
Contextual Info: Integrated Device Technology, Inc. 2975 Stender Way, Santa Clara, CA - 95054 PRODUCT/PROCESS CHANGE NOTICE PCN DATE: November 18, 1999 MEANS OF DISTINGUISHING CHANGED DEVICES: PCN #: G9911-04 Product Affected: All Plastic packages Product Mark Back Mark
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Infineon diffusion solder
Abstract: Cu6Sn5 C1870 equivalent transistor of C1870 Olin-194 C70250 C19400 C14415 F-38019 OLIN194
Contextual Info: Tin Whiskers on Lead-free Platings P.J.T.L. Oberndorff1, M. Dittes2, L. Petit3, C.C. Chen4, J. Klerk1 and E.E. de Kluizenaar1 Philips, Centre for Industrial Technology, P.O. Box 218, 5600 MD Eindhoven, the Netherlands, pascal.oberndorff@philips.com 2 Infineon Technologies AG, P.O. Box 1000944, D-93009 Regensburg, Germany, marc.dittes@infineon .com
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d-93009f-38019infineon diffusion soldercu6sn5+7c1870equivalent transistor of c1870olin-194c70250c19400c14415olin194
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10190N
Abstract: tsmc Activation Energy
Contextual Info: Cypress Semiconductor Technology Qualification Report QTP# 99285 VERSION 1.3 July, 2000 L28-TSMC Technology in TSMC-2A, Taiwan CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA: Ed Russell Reliability Director 408 432-7069 Cypress Semiconductor L28-TSMC Technology in TSMC-2A
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