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    CABGA 6X6 Search Results

    CABGA 6X6 Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    CABGA 6x6

    Abstract: CABGA CABGA 8X8 bga 6x8 BGA Package 14x14 CABGA 48 7x7 CABGA 56
    Contextual Info: CABGA Color.FRM Page 1 Tuesday, February 9, 1999 3:58 PM CABGA Packaging Capabilities Surface Mount Description 11 mm square in 1mm increments. Ball pitches are 0.5 to 1.0 mm. Rectangular packages are also available in a variety of package sizes. The maximum mounted height is


    Original     		GA98111PDF2/99 CABGA 6x6 CABGA CABGA 8X8 bga 6x8 BGA Package 14x14 CABGA 48 7x7 CABGA 56 PDF

    TQ32

    Abstract: ablestik amkor amkor cabga Nitto ASE LQFP 208 CABGA 6x6
    Contextual Info: Atmel Lead Pb -Free Plan Jul-00 Subcontractor Oct-00 Jan-01 Apr-01 Jul-01 Package AIC(Malaysia) 32 lead TSOP AIC(Malaysia) 8 lead SOIC Amkor(Korea) 81 ball CABGA Amkor(Korea) 44 lead TQFP Amkor(Phillip.) 5 X 8 LAP (replaces 8 lead SOIC) Amkor(Korea) 64 lead 10 X 10 LQFP*


    Original     		Jul-00 Oct-00 Jan-01 Apr-01 Jul-01 Oct-01 10X10, TQ32 ablestik amkor amkor cabga Nitto ASE LQFP 208 CABGA 6x6 PDF

    LFXP2-8E

    Abstract: LFXP2-40E LFXP2-5E LFXP20C theta jc FCBGA LFXP2-17E LFE3-17 Theta JB LFXP15C LFXP2-8E 132
    Contextual Info: Thermal Management July 2009 Introduction Thermal management is recommended as part of any sound CPLD and FPGA design methodology. To properly assess the thermal characteristics of the system, Lattice Semiconductor specifies a maximum allowable junction temperature in all device data sheets. The system designer should always complete a thermal analysis of their specific design to ensure that the device and package does not exceed the junction temperature requirements.


    Original     		64-ball 144-ball LFXP2-8E LFXP2-40E LFXP2-5E LFXP20C theta jc FCBGA LFXP2-17E LFE3-17 Theta JB LFXP15C LFXP2-8E 132 PDF

    1f1-1717-a19

    Abstract: 153FBGA BGA 6x6 tray FBGA tray kostat tray bga 6x6 169fbga-12.0x16.0-8x16-0 78BOC-11 78BOC ePAK BGA 5x5 tray 153FBGA-9
    Contextual Info: Jul. 2010 Packing Tray Material Line-up Quantity Bake Temp. 8.1*15.1 8*12 ,256M DDR 5G 60WMBG Package 8*12 130℃ MAX 60M/54WBGA-8.10X15.10-8X12-A TR_MARKING LA69-00635A Material Code Material Spec 48TBGA,10.0*9.0(8*16) 8*16 130℃ MAX 48-TBGA-10.0X9.0-8X16-O


    Original     		60WMBG 60M/54WBGA-8 10X15 10-8X12-A LA69-00635A 48TBGA 48-TBGA-10 0-8X16-O LA69-00267A ADS11981 1f1-1717-a19 153FBGA BGA 6x6 tray FBGA tray kostat tray bga 6x6 169fbga-12.0x16.0-8x16-0 78BOC-11 78BOC ePAK BGA 5x5 tray 153FBGA-9 PDF

    HL832N

    Abstract: FCCSP HL832 Amkor CSP mold compound cu pillar amkor cabga thermal resistance CABGA 6x6 flip chip bga 0,8 mm BGA 64 PACKAGE thermal resistance amkor Cu pillar
    Contextual Info: LAMINATE data sheet fcCSP Features: fcCSP Packages: Amkor Technology is now offering the Flip Chip CSP fcCSP package - a flip chip solution in a CSP package format. This package construction utilizes Pb-Free (or Eut. SnPb) flip chip interconnect technology, in either area array or


    Original     		PDF

    BGA 11x11 junction to board thermal resistance

    Abstract: 45x45 mm bga BGA 64 PACKAGE thermal resistance qfn jc jb 45x45 bga BGA 23X23 PQFP 32X32 QFN 48 JC JB 35x35 bga QFN 20X20
    Contextual Info: Thermal Management February 2004 Introduction to Thermal Management Thermal considerations are rarely an issue with low-density PLDs such as the Lattice Semiconductor GAL products, however, high-density PLDs often require consideration of thermal issues as part of any sound design methodology. To avoid reliability problems, Lattice Semiconductor specifies a maximum allowable junction temperature


    Original     		320-ball 432-ball 27x27 31x31 35x35 40x40 45x45 BGA 11x11 junction to board thermal resistance 45x45 mm bga BGA 64 PACKAGE thermal resistance qfn jc jb 45x45 bga BGA 23X23 PQFP 32X32 QFN 48 JC JB 35x35 bga QFN 20X20 PDF

    BGA 64 PACKAGE thermal resistance

    Abstract: FCCSP CABGA 6x6 amkor flip fcBGA PACKAGE thermal resistance bga 9x9 Shipping Trays CABGA 8X8 BGA 256 PACKAGE power dissipation BGA 256 PACKAGE thermal resistance BGA45
    Contextual Info: LAMINATE data sheet fcCSP Features: fcCSP Packages: Amkor Technology is now offering the Flip Chip CSP fcCSP package — a flip chip solution in a CSP package format. This package construction utilizes eutectic tin/lead (63Sn/37Pb) flip chip interconnect


    Original     		63Sn/37Pb) BGA 64 PACKAGE thermal resistance FCCSP CABGA 6x6 amkor flip fcBGA PACKAGE thermal resistance bga 9x9 Shipping Trays CABGA 8X8 BGA 256 PACKAGE power dissipation BGA 256 PACKAGE thermal resistance BGA45 PDF

    cu pillar

    Abstract: Flip Chip Substrate HL832 ds7409 FCCSP amkor flip chiparray amkor HL832N CABGA 48 7x7 amkor cabga thermal resistance
    Contextual Info: LAMINATE data sheet fcCSP Features: fcCSP Packages: Amkor Technology is now offering the Flip Chip CSP fcCSP package - a flip chip solution in a CSP package format. This package construction utilizes Pb-Free (or Eut. SnPb) flip chip interconnect technology, in either area array or


    Original     		PDF

    LE79Q2281

    Abstract: 1N6761-1 2N2369AU 2N2907AUB BR17 datasheet transistor SI 6822 Dimming LED aplications Dimming LED Driver aplications GC4600 IC ZL70572
    Contextual Info: Product Portfolio 2013-2014 ng-edge Embed Power Matters. About Microsemi Microsemi Corporation is a leading provider of semiconductor solutions differentiated by power, security, reliability and performance. The company concentrates on providing solutions for applications where power matters, security


    Original     		PDF

    MAGNACHIP MAP 9000

    Abstract: DIGRAM FOR TEST IC 324 smd transistor marking H1A smd marking H1A smd marking H1A 3 pin transistor H1A smd smd marking code H1A samsung "nand flash" derating H1A transistor SMD marking date code samsung semiconductor
    Contextual Info: HMS30C7210 ARM Based 32-Bit Microprocessor DATASHEET 7210 DS-07 Copyright. 2004 MagnaChip Semiconductor Ltd. ALL RIGHTS RESERVED. No part of this publication may be copied in any form, by photocopy, microfilm, retrieval system, or by any other means now known or hereafter invented without the prior written permission of MagnaChip Semiconductor Ltd.


    Original     		HMS30C7210 32-Bit DS-07) 0x8005 MAGNACHIP MAP 9000 DIGRAM FOR TEST IC 324 smd transistor marking H1A smd marking H1A smd marking H1A 3 pin transistor H1A smd smd marking code H1A samsung "nand flash" derating H1A transistor SMD marking date code samsung semiconductor PDF

    MAGNACHIP MAP 9000

    Contextual Info: HMS30C7210 ARM Based 32-Bit Microprocessor DATASHEET 7210 DS-08 Copyright. 2004 MagnaChip Semiconductor Ltd. ALL RIGHTS RESERVED. No part of this publication may be copied in any form, by photocopy, microfilm, retrieval system, or by any other means now known or hereafter invented without the prior written permission of MagnaChip Semiconductor Ltd.


    Original     		HMS30C7210 32-Bit DS-08) 0x8005 MAGNACHIP MAP 9000 PDF

    smd 9103 manual

    Abstract: csc 9102
    Contextual Info: HMS30C7210 ARM Based 32-Bit Microprocessor Datasheet Preliminary MagnaChip Semiconductor Ltd. HMS30C7210 ii 2004 MagnaChip Semiconductor Ltd. All Rights Reserved. - ii - Preliminary HMS30C7210 Copyright. 2004 MagnaChip Semiconductor Ltd. ALL RIGHTS RESERVED. No part of this publication may be copied in any form, by photocopy, microfilm, retrieval


    Original     		HMS30C7210 32-Bit 0x8005 smd 9103 manual csc 9102 PDF