BGA45 Search Results

BGA456

Abstract: MS-034 sot795
Contextual Info: Package outline Philips Semiconductors BGA456: plastic ball grid array package; 456 balls; body 27 x 27 x 1.75 mm SOT795-1 B D A D1 ball A1 index area A A2 E1 E A1 detail X C e1 e 1/2 e y y1 C ∅v M C A B b ∅w M C AF AD AB AE AC AA Y V T P M K H F D B e

JEDEC tray standard

Abstract: JEDEC TRAY DIMENSIONS SSD-A-H7053-1 45374 H705 1849-pin BGA4545
Contextual Info: TRAY CONTAINER UNIT : mm HEAT PROOF 30.00 7 160°CMAX PPE 2x 6=12 45.20 75.90 BGA45 × 45× 3.74 45.20 51.00 255.0 30.00 315.0 322.6 SECTION A – A' 45.20 7.55 11.50 135.9 NEC A' A Applied Package 1849-pin Plastic BGA (45×45) (FLIP CHIP TYPE) 1752-pin Plastic BGA (45×45)

PRBG0456DA-A

Abstract: PBGA456
Contextual Info: JEITA Package Code P-BGA456-35x35-1.27 RENESAS Code PRBG0456DA-A B D Previous Code 456F7X-B A D1 MASS[Typ.] 5.0g A ZD b S AB e y S Index mark S ZE AF AE AD AC AB AA Y W V U T R P N M L K J H G F E D C B A E1 E e A1 Reference Symbol 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26

sot583

Abstract: BGA456 BGA-456
Contextual Info: PDF: 2000 Mar 07 Philips Semiconductors Package outline BGA456: plastic ball grid array package; 456 balls; body 35 x 35 x 2.15 mm SOT583-1 B D A D1 ball A1 index area A A2 E1 E A1 detail X e1 v M B b e ∅w M y v M A AF AD AB Y V T P M K H F D B AE AC AA

BGA456

Abstract: sot584
Contextual Info: PDF: 2000 Mar 07 Philips Semiconductors Package outline BGA456: plastic ball grid array package; 456 balls; body 35 x 35 x 1.75 mm SOT584-1 B D A D1 ball A1 index area A A2 E1 E A1 detail X k k C e1 v M B b e ∅w M AF AE AD AC AB AA Y W V U T R P N M L K

BGA452

Contextual Info: Package outline BGA452: plastic ball grid array package; 452 balls SOT1096-1 B D A D1 ball A1 index area E1 E A A2 A1 detail X C e1 e AF AD AB Y V T P M K H F D B 1/2 e ∅v ∅w b C A B C y y1 C AE AC AA e W U R e2 N L 1/2 e J G E C A 1 3 5 7 9 11 13 15 17 19 21 23 25

BGA456

Abstract: MS-034 BGA-456
Contextual Info: PDF: 2003 Jan 23 Philips Semiconductors Package outline BGA456: plastic ball grid array package; 456 balls; body 35 x 35 x 1.75 mm SOT584-1 B D A D1 ball A1 index area A E1 E A2 A1 detail X C e1 ∅v M C A B b 1/2 e e y y1 C ∅w M C AF AD AB Y V T P M K H

BGA452

Abstract: SF-BGA452A-B-11
Contextual Info: D Package Code: BGA452A C 31.75mm [1.250"] 0.64mm [0.025"] See BGA pattern code to the right for actual pattern layout Y 0.89mm [0.035"] 31.75mm [1.250"] X Top View reference only 1.27mm [0.050"] 2 0.36mm [0.014"] dia. 0.64mm [0.025"] 5.33mm 3.74mm [0.147"]

Contextual Info: Package outline BGA456: plastic ball grid array package; 456 balls SOT1153-1 B D J1 A ball A1 index area J2 A2 A E A1 detail X e1 e AB Y V T P M K H F D B 1/2 e ∅v ∅w b AA C C A B C y y1 C e W U R N e2 L 1/2 e J G E C A 1 3 5 7 9 11 13 15 17 19 21 2 4 6 8 10 12 14 16 18 20 22

P-BGA-456

Abstract: PBGA456 PRBG0456DD-A PBGA-456 bga456
Contextual Info: JEITA Package Code P-BGA456-35x35-1.27 RENESAS Code PRBG0456DD-A D A D1 B Previous Code 456F7A MASS[Typ.] 4.1g A b ZD S AB e y S Index mark S ZE AF AE AD AC AB AA Y W V U T R P N M L K J H G F E D C B A E1 E e A1 Reference Symbol 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26

Contextual Info: PC board footprint Philips Semiconductors Footprint information for reflow soldering of BGA456 package SOT584-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste

Contextual Info: PC board footprint Philips Semiconductors Footprint information for reflow soldering of BGA456 package SOT795-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste

BGA456

Abstract: MS-034 27x27
Contextual Info: PDF: 2002 Nov 19 Philips Semiconductors Package outline BGA456: plastic ball grid array package; 456 balls; body 27 x 27 x 1.75 mm SOT795-1 B D A D1 ball A1 index area A A2 E1 E A1 detail X C e1 e 1/2 e y y1 C ∅v M C A B b ∅w M C AF AD AB AE AC AA Y V

Lead Free reflow soldering profile BGA

Abstract: BGA-3591 Metcal BGA-3591 Metcal CSP 3502 CSP-3500 BGA-3590 BGA-3592 CSP-085-102 ceramic rework bga rework
Contextual Info: Worldwide and U.S. Headquarters 1530 O’Brien Drive Menlo Park, CA 94025 USA Phone: + 1-650-325-3291 1-800-776-1778 Fax: + 1-650-325-5932 Europe Headquarters Eagle Close, Chandler’s Ford Eastleigh Hampshire SO53 4NF U.K. Phone: + 44 23 8048 9100 Fax: + 44 23 8048 9109

2am smd transistor

Abstract: ALP 102 B4 i386ex intel tc55v2325ff application note scr tic 106 TC55V2325FF ATM622 alps ALP 102
Contextual Info: ICs for Communications ATM Layer Processor ALP PXB 4350 E Version 1.1 Data Sheet 08.2000 DS 1 3;%  5HYLVLRQ +LVWRU\ &XUUHQW 9HUVLRQ  Previous Version: Preliminary Data Sheet 09.98 (DS 2 Page Page Subjects (major changes since last revision)

ATMEL 24C512

Abstract: TM3260 ATmel 750 24c04 trimedia tm3260 24C512 atmel 24c04 CR 6562 NTSC/PAL to RGB/VGA Encoding atmel 24c256 data sheet DATA SHEET 24C256
Contextual Info: PNX15xx Series Data Book Volume 1 of 1 Connected Media Processor Rev. 2 — 1 December 2004 PNX15xx Series Philips Semiconductors Volume 1 of 1 Connected Media Processor Table of Contents Chapter 1: Integrated Circuit Data 1. 2. 2.1 2.2 2.3 2.3.1 2.3.2 3.

d452a

Abstract: PC28F640P33 sharp 21A U12 circuit diagram HP 30 pin lcd flex cable pinout C117 S4 87A CB-502 sharp CMOS Camera Module CSI 74LVC254 IC SOCKET TSOP48 SMT
Contextual Info: phyCORE-i.MX31 HARDWARE MANUAL EDITION JULY 2007 2007 A product of a PHYTEC Technology Holding company phyCOREi.MX31 In this manual are descriptions for copyrighted products that are not explicitly indicated as such. The absence of the trademark  and copyright () symbols does not imply

KB910

Abstract: KB910 B4 edw10 la-2301 IXP150 AOS 3401 RC300ML af7 smd transistor smd transistor MP3 Y8 R833 VL28
Contextual Info: 5 4 3 2 1 D D Compal Confidential C C Fortworth20 EDW10 Schematic Document Intel Protability Processor with ATi RC300ML + IXP150 2004-05-26 B B REV: 1.0 A A Title THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONFIDENTIAL

CP2211

Abstract: VT1634 ac14g mitac 8 W83L950 LM358 K8N800 h55 MOTHERBOARD CIRCUIT diagram ICS952007 cb-1410
Contextual Info: SERVICE MANUAL FOR 8889 BY: Star Meng Repair Technology Research Department /EDVD Nov.2004 8889 N/B Maintenance Contents 1. Hardware Engineering Specification ……………………………………………………………………… 4 1.1 Introduction ………………………………………………………………………………………………………………. 4

fw82443bx

Abstract: HA20 HD-61
Contextual Info: A B C D E 440BX U15A 4 +3V C141 0.1U 0603 C74 0.1U 0603 C112 0.1U 0603 C193 0.1U 0603 GND +3V C145 1000P 0603 G_ST[0.2] 9 GTL_HD#[0.63] 2 GTL_HD#[0.63] C73 1000P 0603 C97 1000P 0603 C194 1000P 0603 GND 3 2 GTL_HA#[3.31] GTL_HD#0 GTL_HD#1 GTL_HD#2 GTL_HD#3

BGA676

Abstract: BGA665 BGA-1156 156 QFN 12X12 LGA240 BGA-783 BGA441 BGA1024 BGA1521 7286X
Contextual Info: Ironwood Electronics Appendix A AP-A.1 APPENDIX A • BGA Chip Package Specification Tables . . . . . . . .page AP.2 thru AP.16 • LGA Chip Package Specification Table . . . . . . . . . . . . . . . . .page AP.17 • MLF Package Specification Table . . . . . . . . . . . . . . . . . . . . .page AP.18

udf1

Abstract: h9311 i386ex intel CRC-10 bga456 Q67001-H9311 GR-1248-CORE life cycle of sustainable product
Contextual Info: ICs for Communications ATM Layer Processor ALP PXB 4350 Version 1.1 Product Overview 04.97 T4350-XV11-O1-7600 PXB 4350 Revision History: Current Version: 04.97 Previous Version: non Page in previous Version Page (in current Version) Editorial Update Subjects (major changes since last revision)

PCR 406 J

Abstract: marking w25 SMD transistor pcr 406 TRANSISTOR SMD MARKING CODE W25 SMD TRANSISTOR MARKING P2 PCR 406 J transistor smd marking K23 transistor pcr 405 Motorola transistor smd marking codes marking g23 SMD
Contextual Info: Da ta Sh ee t, D S 2, D ec em be r 20 01 A B M P r e mi um A T M B uf f e r M a na ge r P XF 4 33 6 V e r s i on 1 . 1 W ir ed Co m mu n ic a ti o n s N e v e r s t o p t h i n k i n g . Edition 2001-12-17 Published by Infineon Technologies AG, St.-Martin-Strasse 53,

marking w25 SMD

Abstract: TRANSISTOR SMD MARKING CODE W25 smd marking g23 SMD CODE w25 SMD MARKING CODE E1H smd w25 66 2310 dhi TOP 242 PN SMD TRANSISTOR MARKING 9b marking g23 SMD
Contextual Info: Da ta Sh ee t, D S 1, D ec em be r 20 01 ABM 3G A T M B uf f e r M a na ge r P XF 4 33 3 V e r s i on 1 . 1 W ir ed Co m mu n ic a ti o n s N e v e r s t o p t h i n k i n g . Edition 2001-12-17 Published by Infineon Technologies AG, St.-Martin-Strasse 53,