The Datasheet Archive

Top Results (6)

Part ECAD Model Manufacturer Description Datasheet Download Buy Part
TMS320C28344ZEPQ TMS320C28344ZEPQ ECAD Model Texas Instruments Delfino Microcontroller 256-BGA
TMS320C28342ZEPQ TMS320C28342ZEPQ ECAD Model Texas Instruments Delfino Microcontroller 256-BGA
TMS320C28343ZEPQ TMS320C28343ZEPQ ECAD Model Texas Instruments Delfino Microcontroller 256-BGA
TMX320C28346ZFE TMX320C28346ZFE ECAD Model Texas Instruments Delfino Microcontroller 256-BGA
TMS320C28341ZEPQ TMS320C28341ZEPQ ECAD Model Texas Instruments Delfino Microcontroller 256-BGA
AM1707DZKBT3 AM1707DZKBT3 ECAD Model Texas Instruments Sitara Processor 256-BGA

64-ball Datasheets Context Search

Catalog Datasheet MFG & Type PDF Document Tags
2009 - MX29GL256

Abstract: 28F512P30 Numonyx M29W256G 28F00AP30 w25q128 MX25L6445 28F00AM29EW M29DW127G 28F128P30 PF38F3040M0Y3D
Text: 2.7-3.6 ADP x16 Boot Sector 16 85 52 64-Ball TBGA -40 to +85C S29WS128N No , 2.7-3.6 ADP x16 Boot Sector 16 85 52 64-Ball TBGA -40 to +85C S29WS256N No , 85 52 64-Ball EasyBGA 56-Pin TSOP 88- Ball SCSP -40 to +85C S29GL064N No No , 52 64-Ball EasyBGA 56-Pin TSOP 88- Ball SCSP -40 to +85C S29GL128P No No This , 1.7-2.0 1.7-3.6 ADP x16 Boot Sector 1 100 (BGA) 110 (TSOP) 52 64-Ball EasyBGA 56


Original
PDF AT49SV163D 48-Pin 48-Ball S29AS016J EN29SL800 S29AS00gest MX29GL256 28F512P30 Numonyx M29W256G 28F00AP30 w25q128 MX25L6445 28F00AM29EW M29DW127G 28F128P30 PF38F3040M0Y3D
S19GL016atfa0090

Abstract: S19GL016ATF S19GL016A S19GL032A s19gl032 48pin TSOP TSOP 56 Package S29GL128P TSOP 56 SPANSION S29GL512P
Text: Types 48- ball Fine-Pitch BGA 48-pin TSOP 64-ball Fortified BGA 48- ball Fine-Pitch BGA 48-pin TSOP 56-pin TSOP 64-ball Fortified BGA 48- ball Fine-Pitch BGA 48-pin TSOP 56-pin TSOP 64-ball Fortified BGA 56-pin TSOP 64-ball Fortified BGA 56-pin TSOP 64-ball Fortified BGA 56-pin TSOP Memory, x8/x16, Page-mode, MirrorBit technology 64-ball Fortified BGA Product Line: CSID ­ , Package Types 48- ball Fine-Pitch BGA 48-pin TSOP 64-ball Fortified BGA 48- ball Fine-Pitch BGA 48


Original
PDF S19GL016A, S19GL032A, S19GL064A, S19GL128N, S19GL256N, S19GL512N S19GL016atfa0090 S19GL016ATF S19GL016A S19GL032A s19gl032 48pin TSOP TSOP 56 Package S29GL128P TSOP 56 SPANSION S29GL512P
2011 - S25FL129

Abstract: S98GL064NB0 S98GL064 s29gl256p90 S70FL256 S98GL064NB s71vs128 S25FL129P WSON 6x8 S25FL032K
Text: . RoHS-compliant lead-free available . 56-pin TSOP package . 64-ball fortified BGA package . , OTP region OTP region Packages 48- ball and 64-ball BGA 40-pin and 48-pin TSOP 56-pin SSOP Wafer and die form 48-pin TSOP 48- ball BGA Wafer and die form 48- ball , 56- ball , 64-ball and 80- ball , Silicon Region, 256-word OTP sector for permanent, secure identification Packages . 44- ball , 64-ball , Universal Footprint provides a common pinout architecture to simplify development and board design. 64-ball


Original
PDF 128Mb 256Mb 512Mb 1-866-SPANSION 43715B S25FL129 S98GL064NB0 S98GL064 s29gl256p90 S70FL256 S98GL064NB s71vs128 S25FL129P WSON 6x8 S25FL032K
2014 - Not Available

Abstract: No abstract text available
Text: 2 Wiha Hex Tools Index Wiha Ball End Hex Tools Index DESCRIPTION Page Ball End L-keys & Sets 6 Colored Coded L-keys 5 Ball End L-keys & Sets 7-9 , PicoFinish Soft Grip 27 SYSTEM 4 Blades 29 Stubby Bit Holder Sets 32 Ball End Hex Insert Bit 36 Ball End Hex Socket 39 31 Insert/Power Bit Sets 32 , Metric 23 MicroFinish Non-Slip Grip Drive-Loc VI Blades 23 Ball End Hex & Hex Inch


Original
PDF
M4A3-64/32-12VNI

Abstract: LC4512V M4A5-64/32-10VNC48 LC4256V-75T176C GAL16V8D-25LJN M4A5-32/32-10VNC48 lx64ev-3f100c LFEC6E-4FN256C LC4032V LC5512MV-45FN256C
Text: Lead-Free 176-Pin TQFP Lead-Free 208- Ball fpBGA Lead-Free 100-Pin TQFP Lead-Free 176-Pin TQFP Lead-Free 208- Ball fpBGA Lead-Free 100-Pin TQFP Lead-Free 176-Pin TQFP Lead-Free 208- Ball fpBGA Lead-Free , Lead-Free 256- Ball fpBGA Lead-Free 256- Ball fpBGA Lead-Free 256- Ball fpBGA Lead-Free 256- Ball fpBGA Lead-Free 256- Ball fpBGA Lead-Free 256- Ball fpBGA Lead-Free 256- Ball fpBGA Lead-Free 256- Ball fpBGA Lead-Free 256- Ball fpBGA Lead-Free 256- Ball fpBGA Lead-Free 256- Ball fpBGA Lead-Free 256- Ball fpBGA


Original
PDF GAL16LV8 GAL16V8 GAL22V10 ispGAL22V10 ispGAL22V10AV GAL16LV8D-3LJ GAL16LV8D-5LJ GAL16LV8C-7LJ GAL16LV8C-10LJ GAL16LV8C-15LJ M4A3-64/32-12VNI LC4512V M4A5-64/32-10VNC48 LC4256V-75T176C GAL16V8D-25LJN M4A5-32/32-10VNC48 lx64ev-3f100c LFEC6E-4FN256C LC4032V LC5512MV-45FN256C
2004 - X32K

Abstract: No abstract text available
Text: Per-Stream M M M M M M M M 16 16 16 16 16 16 16 16 1.8 V 196 ball PBGA 196 ball PBGA (pin compatible with MT90871) 256 ball PBGA 196 ball PBGA 256 pin LQFP 272 ball PBGA 272 ball PBGA (pin compatible with MT90870) 256 ball PBGA 12 K x 12 K 48 48 12 K x 12 K 48 48 12 K x 12 K 48 48 www.ZARLINK.com 5V , M M M M M 16 16 16 16 16 16 1.8 V 272 ball PBGA 256 ball PBGA 272 ball PBGA (pin compatible with MT90869) 256 ball PBGA 196 ball PBGA 256 pin LQFP 484 ball PBGA 484 ball PBGA 484 ball PBGA 324


Original
PDF MT90871 ZL50050 ZL50051 ZL50052 ZL50053 MT90870 ZL50057 ZL50058 MT90869 ZL50060 X32K
2012 - S25FL256

Abstract: S25FL512 S98GL064 S25FL256* spansion S98GL064NB S98GL064NB0 S25FL204 s25fl128s S25FL129 S25FL032K
Text: > RoHS-compliant lead-free available 56-pin TSOP package 64-ball fortified BGA package Wafer and die form , OTP region 48- ball and 64-ball BGA, 40-pin and 48-pin TSOP, 56-pin SSOP, Wafer and die form 3.0V , , -40°C to +85°C OTP region 48- ball , 56- ball , 64-ball and 80- ball BGA, 56-pin TSOP Top/Bottom boot , > > packages > 44- ball , 64-ball , 84- ball BGA Wafer and die form SECTOR TYPE INITIAL ACCESS TIME PAGE , -pin TSOP 48-pin and 56-pin TSOP For extreme design flexibility 8Mb ­ 1Gb 64-BALL FORTIFIED BGA For


Original
PDF 128Mb 256Mb 512Mb 43715C S25FL256 S25FL512 S98GL064 S25FL256* spansion S98GL064NB S98GL064NB0 S25FL204 s25fl128s S25FL129 S25FL032K
2013 - Not Available

Abstract: No abstract text available
Text: program/erase endurance cycles.  Package Options - 56-pin TSOP - 64-ball 11mm x 13mm BGA (Call , RFU VIO IS29GL128H/L Figure 2. 64-ball Ball Grid Array (Top View, Balls Facing Down) A8 B8 , -pin TSOP G = 64-Ball Ball Grid Array (BGA) 1.0mm pitch, 11mm x 13mm package (Call Factory) SPEED 70 = , #/ACC=L) Package High Order Part Number 56-pin TSOP IS29GL128H-70SLI 64-Ball Ball Grid , 64-Ball Ball Grid Array (BGA) IS29GL128H- 70SLA1 High 56-pin TSOP IS29GL128H


Original
PDF IS29GL128H/L IS29GL128 16384K 8192K 16-bit) 56-pin IS29GL128H-70SLI 64-Ball IS29GL128H-70GLI IS29GL128L-70SLI
2010 - Recommended land pattern smd-0.5

Abstract: "x-ray machine" Lattice Semiconductor Package Diagrams 256-Ball fpBGA pcb fabrication process ultra fine pitch BGA LC4064ZE package dimension 256-FTBGA nomenclature pcb hdi of BGA Staggered Pins package BN256
Text: Layout Recommendations for BGA Packages Lattice Semiconductor 64-ball csBGA BGA Breakout and Routing Example This example places an ispMACH 4000ZE CPLD in a 5x5 mm, 0.5 mm pitch, 64-ball csBGA package (LC4064ZEMN64) in an 6-layer stack up with maximum I/O utilization. Figure 19-2. CAM Artwork Screen Shots 64-Ball , Secondary 19-4 PCB Layout Recommendations for BGA Packages Lattice Semiconductor 64-ball ucBGA , pitch, 64-ball ucBGA package (LC4064ZEUMN64) in an n-layer stack up with maximum I/O utilization. This


Original
PDF TN1074 Recommended land pattern smd-0.5 "x-ray machine" Lattice Semiconductor Package Diagrams 256-Ball fpBGA pcb fabrication process ultra fine pitch BGA LC4064ZE package dimension 256-FTBGA nomenclature pcb hdi of BGA Staggered Pins package BN256
2013 - Not Available

Abstract: No abstract text available
Text: -pin TSOP - 64-ball 11mm x 13mm BGA (Call Factory)  Automotive Grades (Call Factory) GENERAL , ©2013 Integrated Silicon Solution, Inc., www.issi.com IS29GL064 Figure 2. 64-ball Ball Grid Array , CONTENT L = RoHS compliant PACKAGE S = 56-pin TSOP G = 64-Ball Ball Grid Array (BGA) 1.0mm pitch , ) High 56-pin TSOP High 64-Ball Ball Grid Array (BGA) IS29GL064L-70SLI Low 56-pin TSOP IS29GL064L-70GLI Low 64-Ball Ball Grid Array (BGA) IS29GL064H- 70SLA1 High 56-pin TSOP


Original
PDF IS29GL064 8192K 4096K 16-bit) 8-word/16-byte 16-word/32-byte sIS29GL064L-70SLI 56-pin IS29GL064L-70GLI
2013 - Not Available

Abstract: No abstract text available
Text: Two hundred fifty-six sectors  Package Options - 56-pin TSOP - 64-ball 11mm x 13mm BGA (Call , 2. 64-ball Ball Grid Array (Top View, Balls Facing Down) A8 B8 C8 RFU A22 A23 , +85°C) (Call Factory) PACKAGING CONTENT L = RoHS compliant PACKAGE S = 56-pin TSOP G= 64-Ball , -90SLI Sector for Write Protect (WP#/ACC=L) Package High 56-pin TSOP 64-Ball Ball Grid Array (BGA) IS29GL256H-90GLI IS29GL256L-90SLI Low 56-pin TSOP IS29GL256L-90GLI Low 64-Ball Ball Grid


Original
PDF IS29GL256H/L IS29GL256 32768K 16384K 16-bit) 56-pin 64-Ball IS29GL256H-90GLI IS29GL256L-90SLI
2013 - Not Available

Abstract: No abstract text available
Text: .  Minimum 100K program/erase endurance cycles.  Package Options - 56-pin TSOP - 64-ball , ©2013 Integrated Silicon Solution, Inc., www.issi.com IS29GL064 Figure 2. 64-ball Ball Grid Array , CONTENT L = RoHS compliant PACKAGE S = 56-pin TSOP G = 64-Ball Ball Grid Array (BGA) 1.0mm pitch , Part Number 56-pin TSOP 64-Ball Ball Grid Array (BGA) IS29GL064H-70GLI IS29GL064L-70SLI Low 56-pin TSOP IS29GL064L-70GLI Low 64-Ball Ball Grid Array (BGA) IS29GL064H- 70SLA1


Original
PDF IS29GL064 8192K 4096K 16-bit) 8-word/16-byte 16-word/32-byte IS29GL064H-70SLI 56-pin 64-Ball
2005 - S71PL127NC0

Abstract: S71PL129NC0 S71PL127N S71PL127NB0 S71PL129N S71PL256N S71PL-N S71PL127NB
Text: Type 2 4U TLA064 8 x 11.6 x 1.2 mm, 64-ball Type 8 S71PL127NC0 4B S71PL129NB0 HAW , TLA064 8 x 11.6 x 1.2 mm, 64-ball Type 8 S71PL129NC0 5B Type 2 5U Type 8 5B Type 2 , 7 Data 5.3 Sheet S71PL127N-TLA064 Figure 5.4 64-ball Fine-Pitch Ball Grid Array , _00_A9 December 8, 2006 Da t a 5.4 Sh ee t S71PL129N-TLA064 Figure 5.5 64-ball Fine-Pitch Ball Grid , Speed ­ 84- Ball Fine-Pitch Ball Grid Array (FBGA) S71PL256NC0 S71PL256ND0 ­ 64 Ball Fine-Pitch


Original
PDF S71PL-N S71PL256N, S71PL127N, S71PL129N 16-Bit) S71PL127NC0 S71PL129NC0 S71PL127N S71PL127NB0 S71PL129N S71PL256N S71PL127NB
2005 - LQFP 208

Abstract: ZL3806 LQFP208 LBGA-100
Text: V core 5V 28 pin PLCC, PDIP 28 pin PLCC, PDIP 100 pin LQFP, 208 ball LBGA 100 pin LQFP, 208 ball LBGA 100 pin LQFP, 208 ball LBGA 160 pin MQFP, 208 ball LBGA 100 pin LQFP, 208 ball LBGA 100 pin LQFP, 208 ball LBGA 100 pin LQFP, 208 ball LBGA 365 ball BGA 535 ball BGA 535 ball BGA 535 ball BGA


Original
PDF IEEE-1149 164/G165 MT9122 MT9123 ZL50233 ZL50234 ZL50235 MT9300B MT93L00 ZL50232 LQFP 208 ZL3806 LQFP208 LBGA-100
2005 - S71PL127NC0

Abstract: No abstract text available
Text: Flash Speed Option pSRAM Speed Options Package Name TLA064 8 x 11.6 x 1.2 mm, 64-ball TLA064 8 x 11.6 x 1.2 mm, 64-ball TLA0848 x 11.6 x 1.2 mm, 84- ball TSB084 8 x 11.6 x 1.2, 84- ball Notes: 1. Type , S71PL127N-TLA064 Figure 5.4 64-ball Fine-Pitch Ball Grid Array (S71PL127N) A1 DNU B5 RFU C3 A7 D2 A3 E2 A2 F2 , ee t 5.4 S71PL129N-TLA064 Figure 5.5 64-ball Fine-Pitch Ball Grid Array (S71PL129N) A1 DNU , S71PL129NC0 S71PL127NB0 S71PL127NC0 8.0 x 11.6 x 1.2 mm Packages ­ 84- Ball Fine-Pitch Ball Grid Array


Original
PDF S71PL-N S71PL256N, S71PL127N, S71PL129N 16-Bit) S71PL127NC0
2013 - Not Available

Abstract: No abstract text available
Text: Architecture Two hundred fifty-six sectors  Package Options - 56-pin TSOP - 64-ball 11mm x 13mm BGA , 2. 64-ball Ball Grid Array (Top View, Balls Facing Down) A8 B8 C8 RFU A22 A23 , ) PACKAGING CONTENT L = RoHS compliant PACKAGE S = 56-pin TSOP G= 64-Ball Ball Grid Array (BGA) 1.0mm , #/ACC=L) Package High 56-pin TSOP 64-Ball Ball Grid Array (BGA) IS29GL256H-90GLI IS29GL256L-90SLI Low 56-pin TSOP IS29GL256L-90GLI Low 64-Ball Ball Grid Array (BGA


Original
PDF IS29GL256H/L 32768K 16384K 16-bit) IS29GL256 56-pin 64-Ball IS29GL256H-90GLI IS29GL256L-90SLI
2009 - 416-ball

Abstract: 1152-ball 132-ball lattice fpbga 484 FPBGA
Text: Type 48-Pin QFNS 49- Ball caBGA 56- Ball csBGA 64-Pin TQFP 64-Pin QFNS 64-Ball csBGA 64-Ball ucBGA 68-Pin JLCC 68-Pin PLCC 84-Pin CPGA 84-Pin PLCC 100- Ball caBGA 100- Ball csBGA 100- Ball fpBGA 100-Pin PQFP 100-Pin TQFP 120-Pin PQFP 128-Pin PQFP 128-Pin TQFP 132- Ball csBGA 132- Ball ucBGA 133-Pin CPGA 144- Ball csBGA 144- Ball fpBGA 144-Pin TQFP 160-Pin PQFP 176-Pin TQFP 208- Ball fpBGA 208-Pin PQFP 240-Pin PQFP 256- Ball fpBGA 256- Ball caBGA 256- Ball ftBGA 256- Ball SBGA 272- Ball


Original
PDF PB1240H 20-Pin 24-Pin 28-Pin 416-ball 1152-ball 132-ball lattice fpbga 484 FPBGA
2013 - Not Available

Abstract: No abstract text available
Text: Architecture Two hundred fifty-six sectors  Package Options - 56-pin TSOP - 64-ball 11mm x 13mm BGA , 2. 64-ball Ball Grid Array (Top View, Balls Facing Down) A8 B8 C8 RFU A22 A23 , ) PACKAGING CONTENT L = RoHS compliant PACKAGE S = 56-pin TSOP G= 64-Ball Ball Grid Array (BGA) 1.0mm , #/ACC=L) Package High 56-pin TSOP 64-Ball Ball Grid Array (BGA) IS29GL256H-90GLI IS29GL256L-90SLI Low 56-pin TSOP IS29GL256L-90GLI Low 64-Ball Ball Grid Array (BGA


Original
PDF IS29GL256H/L 32768K 16384K 16-bit) IS29GL256 56-pin 64-Ball IS29GL256H-90GLI IS29GL256L-90SLI
2013 - Not Available

Abstract: No abstract text available
Text: program/erase endurance cycles.  Package Options - 56-pin TSOP - 64-ball 11mm x 13mm BGA (Call , RFU VIO IS29GL128H/L Figure 2. 64-ball Ball Grid Array (Top View, Balls Facing Down) A8 B8 , CONTENT L = RoHS compliant PACKAGE S = 56-pin TSOP G = 64-Ball Ball Grid Array (BGA) 1.0mm pitch , -pin TSOP IS29GL128H-70SLI 64-Ball Ball Grid Array (BGA) IS29GL128H-70GLI IS29GL128L-70SLI Low 56-pin TSOP IS29GL128L-70GLI Low 64-Ball Ball Grid Array (BGA) IS29GL128H- 70SLA1


Original
PDF IS29GL128H/L IS29GL128 16384K 8192K 16-bit) 56-pin IS29GL128H-70SLI 64-Ball IS29GL128H-70GLI IS29GL128L-70SLI
2005 - A9F7

Abstract: No abstract text available
Text: 11.6 x 1.2 mm, 84- ball TSB084 8 x 11.6 x 1.2, 84- ball 70 ns 70 ns TLA064 8 x 11.6 x 1.2 mm, 64-ball TLA064 8 x 11.6 x 1.2 mm, 64-ball Flash Speed Option pSRAM Speed Options Package Name Notes: 1 , 7 Data Sheet 5.3 S71PL127N-TLA064 Figure 5.4 64-ball Fine-Pitch Ball Grid Array , S71PL-N_00_A8 October 6, 2006 Da t a Sh ee t 5.4 S71PL129N-TLA064 Figure 5.5 64-ball , S71PL129NC0 S71PL127NB0 S71PL127NC0 8.0 x 11.6 x 1.2 mm Packages ­ 84- Ball Fine-Pitch Ball Grid Array


Original
PDF S71PL-N S71PL256N, S71PL127N, S71PL129N 16-Bit) A9F7
2014 - tray lqfp

Abstract: JEDEC qfn tray QFn Package tray JEDEC TRAY DIMENSIONS QFN
Text: TOP VIEW 32 SAM4S Series [SUMMARY DATASHEET] 11100ES–ATARM–29-Jan-14 21 4.2.3 64-ball WLCSP Package Outline Figure 4-6. Orientation of the 64-ball WLCSP Package 4.2.4 64-lead LQFP and , connected to ground. SAM4S Series [SUMMARY DATASHEET] 11100ES–ATARM–29-Jan-14 22 4.2.5 64-ball WLCSP Pinout Table 4-5. SAM4S16/S8 64-ball WLCSP Pinout A1 PA31 C1 GND E1 PA29 , PB2 F8 VDDOUT H8 GND Table 4-6. SAM4S4/S2 64-ball WLCSP Pinout A1 PB5 C1


Original
PDF 32-bit tray lqfp JEDEC qfn tray QFn Package tray JEDEC TRAY DIMENSIONS QFN
2005 - Not Available

Abstract: No abstract text available
Text: Options 70 ns Package Name TLA064 8 x 11.6 x 1.2 mm, 64-ball TLA064 8 x 11.6 x 1.2 mm, 64-ball TLA0848 x , :A0 A21:A0 Figure 3.4 64-ball Fine-Pitch Ball Grid Array (S71PL127N) April 12, 2006 S71PL-N , A21 - Shared Addresses A20:A0 A21:A0 Figure 3.5 64-ball Fine-Pitch Ball Grid Array , Flash: 70 ns - pSRAM: 70 ns 8.0 x 11.6 x 1.2 mm Packages - 84- Ball Fine-Pitch Ball Grid Array (FBGA) ­ S71PL256NC0 ­ S71PL256ND0 - 64 Ball Fine-Pitch Ball Grid Array (FBGA) ­ S71PL129NB0 ­ S71PL129NC0 ­


Original
PDF S71PL-N S71PL256N, S71PL127N, S71PL129N 16-Bit)
Not Available

Abstract: No abstract text available
Text: entry Black Finish SHOP 334 Soft Grip Ball Hex Inch Dual Drive T-handle CVM steel, hardened, black finish. Ball tip for speed & easy insertion. Wiha soft grips are molded on with through the , 5/16 7.9 .35 10 334 40 3/8 7.9 .51 10 334 Soft Grip Ball End Hex Metric Dual Drive T-handle CVM steel, hardened, black finish. Ball tip for speed & easy insertion. Wiha soft grip are , 150 .18 10 334 52 6.0 150 .21 10 334 54 8.0 200 .35 10 334 58 10.0 200 .55 10 *No Ball -


Original
PDF
q406 transistor

Abstract: q406 equivalent q406 S29GL032m90tfir4 S29GL064M90TFIR40 S29GL128M10TFIR1 S29GL128M10TFIR2 S29GL128M10TFIR10 S29AL016M90TCIR1 S29GL032M90FFCR40
Text: -Megabit Flash Memory, Package Types TS048: 48-pin TSOP FBA048: 48- ball Fine-Pitch BGA LAA064: 64-ball Fine-Pitch BGA TS040: 40-pin TSOP TS048: 48-pin TSOP TS056: 56-pin TSOP FBC048: 48- ball Fine-Pitch BGA LAA064: 64-ball Fine-Pitch BGA FAA064: 64-ball Fine-Pitch BGA TS048: 48-pin TSOP TS056: 56-pin TSOP LAA064: 64-ball Fine-Pitch BGA TS056: 56-pin TSOP LAA064: 64-ball Fine-Pitch BGA TS056: 56-pin TSOP , S71GL032M S99GL512M AMD OPNs Am29DS323D LAA064: 64-ball Fine-Pitch BGA Package Types TS048: 48


Original
PDF S29AL016M S29GL032M S29GL064M S29GL128M S29GL256M 16-Megabit x8/x16, 32-Megabit 64-Megabit q406 transistor q406 equivalent q406 S29GL032m90tfir4 S29GL064M90TFIR40 S29GL128M10TFIR1 S29GL128M10TFIR2 S29GL128M10TFIR10 S29AL016M90TCIR1 S29GL032M90FFCR40
2005 - S71PL127NB0HHW4U

Abstract: S71PL127NC0 VBU056 S71PL256N PL129N PL256N dc m7 footprint HFW 12 30 K JESD 95-1, SPP-010 S71PL127N
Text: ) TLA064 8 x 11.6 x 1.2 mm, 64-ball S71PL127NC0 4B (4) S71PL129NB0 4U (4) Type 2 0, 2, 3 (1 , \ 16-038.22a S71PL-N_00_A11 June 9, 2010 Da t a 5.3 Sh ee t S71PL127N-TLA064 Figure 5.4 64-ball , :A0 S71PL-N MirrorBit® MCPs 9 Data 5.4 Sheet S71PL129N-TLA064 Figure 5.5 64-ball , Speed ­ 84- Ball Fine-Pitch Ball Grid Array (FBGA) S71PL256NC0 S71PL256ND0 ­ 64 Ball Fine-Pitch Ball Grid Array (FBGA) S71PL129NB0 ­ Flash: 70 ns ­ pSRAM: 70 ns Operating Temperature Range ­


Original
PDF S71PL-N S71PL256N, S71PL127N, S71PL129N 16-Bit) S71PL127NB0HHW4U S71PL127NC0 VBU056 S71PL256N PL129N PL256N dc m7 footprint HFW 12 30 K JESD 95-1, SPP-010 S71PL127N
Supplyframe Tracking Pixel