CABGA Search Results

Contextual Info: PM8354 QuadPHY 1G Preliminary 4-channel 1.0-1.25 Gbit/s Transceiver 25 :3 06 for the QuadPHY 1G. 03 PHYSICAL 20 • Ultra-low power operation using 0.18 µ CMOS technology. y, • Thermally enhanced, 289-pin, 19 mm x 19 mm CABGA package. • • • eb temperature range -40 to +85 °C and is

pal22v10h

Abstract: MM74HC245AWM 96F8740 PCC473BCTND MC68340 PM4314 PM4388 PM6344 PM7364 PM7375
Contextual Info: PM4388 TOCTL PRELIMINARY INFORMATION REFERENCE DESIGN PMC-980942 ISSUE 1 CABGA TOCTL WITH FREEDM-32 REFERENCE DESIGN PM4388 CABGA TOCTL WITH FREEDM-32 REFERENCE DESIGN PRELIMINARY INFORMATION ISSUE 1: SEPT 1998 PROPRIETARY AND CONFIDENTIAL TO PMC-SIERRA, INC., AND FOR ITS CUSTOMERS’ INTERNAL USE

GR-253-CORE

Abstract: ZL30119 ZL30119GGG ZL30119GGG2 "network interface cards"
Contextual Info: ZL30119 SONET/SDH Low Jitter Line Card Synchronizer Data Sheet December 2005 A full Design Manual is available to qualified customers. To register, please send an email to TimingandSync@Zarlink.com. Ordering Information ZL30119GGG 100 Pin CABGA Trays ZL30119GGG2 100 Pin CABGA*

ZL30123

Abstract: GR-253-CORE STM-16 ZL30123GGG ZL30123GGG2 "network interface cards"
Contextual Info: ZL30123 SONET/SDH Low Jitter Line Card Synchronizer Data Sheet May 2006 A full Design Manual is available to qualified customers. To register, please send an email to TimingandSync@Zarlink.com. Ordering Information ZL30123GGG 100 Pin CABGA Trays ZL30123GGG2 100 Pin CABGA*

TQ32

Abstract: ablestik amkor amkor cabga Nitto ASE LQFP 208 CABGA 6x6
Contextual Info: Atmel Lead Pb -Free Plan Jul-00 Subcontractor Oct-00 Jan-01 Apr-01 Jul-01 Package AIC(Malaysia) 32 lead TSOP AIC(Malaysia) 8 lead SOIC Amkor(Korea) 81 ball CABGA Amkor(Korea) 44 lead TQFP Amkor(Phillip.) 5 X 8 LAP (replaces 8 lead SOIC) Amkor(Korea) 64 lead 10 X 10 LQFP*

E679

Abstract: Amkor CSP mold compound chiparray amkor MO-192 Amkor mold compound Amkor Wafer level mold compound amkor polyimide
Contextual Info: LAMINATE data sheet Stacked CSP Features: Stacked CSP SCSP : The Stacked CSP (SCSP) family leverages Amkor's industry leading ChipArray Ball Grid Array (CABGA) manufacturing capabilities. This broad high volume infrastructure enables the rapid deployment of advances in die stacking

"network interface cards"

Contextual Info: ZL30119 SONET/SDH OC-48/OC-192 Line Card Synchronizer Data Sheet June 2006 A full Design Manual is available to qualified customers. To register, please send an email to TimingandSync@Zarlink.com. Ordering Information ZL30119GGG 100 Pin CABGA Trays ZL30119GGG2 100 Pin CABGA*

PEAK tray drawing

Abstract: 12C-1313-119 daewon 89HPES4T4ZBBCGI TRAY MPPO DAEWON tray drawing PBGA144 daewon tray 72T1 PBGA-144
Contextual Info: Integrated Device Technology, Inc. 6024 Silver Creek Valley Road, San Jose, CA 95138 PRODUCT/PROCESS CHANGE NOTICE PCN PCN #: TB0908-03 DATE: 9/16/2009 Product Affected: 13 mm x 13 mm PBGA-144 & 13 mm x 13 mm CABGA-144 Date Effective: Contact: Title: Phone #:

GR-253-CORE

Abstract: ZL30117 ZL30117GGG ZL30117GGG2 "network interface cards"
Contextual Info: ZL30117 SONET/SDH Low Jitter Line Card Synchronizer Data Sheet February 2006 A full Design Manual is available to qualified customers. To register, please send an email to TimingandSync@Zarlink.com. Ordering Information ZL30117GGG 64 Pin CABGA Trays ZL30117GGG2 64 Pin CABGA*

Contextual Info: Data Sheet LEADFRAME CABGA/fBGA Features ChipArray Packages Amkor’s ChipArray® Ball Grid Array CABGA packages are laminate based packages that are compatible with SMT mounting processes worldwide. The near chip size CABGA fine-pitch BGA (fBGA) offers a

ge100lfcsv

Abstract: GE100LFCS SPIL mold compound aus308 GE-100LFCS-V HL832NX Ablestik 89HPES12N3AZGBCGI AUS-308 89HPES10T4G2ZBBCG
Contextual Info: Integrated Device Technology, Inc. 6024 Silver Creek Valley Road, San Jose, CA - 95138 PRODUCT/PROCESS CHANGE NOTICE PCN PCN #: A1008-03 Product Affected: DATE: September 10, 2010 MEANS OF DISTINGUISHING CHANGED DEVICES: 19mm x 19mm CABGA-324 (Standard & Green)

vFBGA* 96 bALL

Abstract: Amkor Wafer level mold compound amkor cabga thermal resistance BGA 256 PACKAGE thermal resistance Amkor Technology CABGA CTBGA MO-195 BGA PACKAGE thermal resistance amkor cabga
Contextual Info: LAMINATE data sheet CABGA/CTBGA/CVBGA Features: ChipArray Packages: ChipArray® BGA CABGA / LFBGA Thin ChipArray® BGA (CTBGA / TFBGA) Very Thin ChipArray® BGA (CVBGA / VFBGA) Amkor’s ChipArray® packages are laminatebased Ball Grid Array (BGA) packages that are

ARM940T

Abstract: router CX24611 CX82100 usb ethernet single chip switch
Contextual Info: personal computing products Home Network Processor HNP CX82100 Conexant’s CX82100 home network processor (HNP) is a single-chip, high-performance, ARM940T-based processor integrated with multiple network interface hardware functions and packaged in a 196-pin CABGA. This 158 MIPs processor

Contextual Info: ZL30347 IEEE 1588-2008 Synchronization PLL Short-Form Data Sheet June 2012 Features • • • • Ordering Information Frequency, Phase and Time Synchronization over IP, MPLS and Ethernet Packet Networks ZL30347GGG 100 Pin CABGA ZL30347GGG2 100 Pin CABGA*

ZL30117

Abstract: ZL30117GGG ZL30117GGG2 GR-253-CORE "network interface cards"
Contextual Info: ZL30117 SONET/SDH OC-48/OC-192 Line Card Synchronizer Data Sheet June 2006 A full Design Manual is available to qualified customers. To register, please send an email to TimingandSync@Zarlink.com. Ordering Information ZL30117GGG 64 Pin CABGA Trays ZL30117GGG2 64 Pin CABGA*

GR-1244-CORE

Abstract: ZL30120 ZL30120GGG ZL30120GGG2 "network interface cards"
Contextual Info: ZL30120 SONET/SDH/Ethernet Multi-Rate Line Card Synchronizer Data Sheet May 2006 A full Design Manual is available to qualified customers. To register, please send an email to TimingandSync@Zarlink.com. Ordering Information ZL30120GGG 100 Pin CABGA Trays ZL30120GGG2 100 Pin CABGA* Trays

CABGA 6x6

Abstract: CABGA CABGA 8X8 bga 6x8 BGA Package 14x14 CABGA 48 7x7 CABGA 56
Contextual Info: CABGA Color.FRM Page 1 Tuesday, February 9, 1999 3:58 PM CABGA Packaging Capabilities Surface Mount Description 11 mm square in 1mm increments. Ball pitches are 0.5 to 1.0 mm. Rectangular packages are also available in a variety of package sizes. The maximum mounted height is

ZL30107GGG2

Abstract: ZL30107 ZL30107GGG
Contextual Info: ZL30107 GbE Line Card Synchronizer Shortform Data Sheet March 2007 A full Data Sheet is available to qualified customers. To register, please send an email to TimingandSync@zarlink.com. Ordering Information ZL30107GGG 64 Pin CABGA Trays ZL30107GGG2 64 Pin CABGA*

ZL30122GGG

Abstract: GR-253-CORE STM-16 ZL30122 ZL30122GGG2 phase failure "network interface cards"
Contextual Info: ZL30122 SONET/SDH Low Jitter Line Card Synchronizer Data Sheet May 2006 A full Design Manual is available to qualified customers. To register, please send an email to TimingandSync@Zarlink.com. Ordering Information ZL30122GGG 64 Pin CABGA Trays ZL30122GGG2 64 Pin CABGA*

Contextual Info: ZL30116 SONET/SDH OC-48/OC-192 System Synchronizer Data Sheet June 2006 A full Design Manual is available to qualified customers. To register, please send an email to TimingandSync@Zarlink.com. Ordering Information ZL30116GGG ZL30116GGG2 Features • 100 Pin CABGA

GR-1244

Abstract: GR-253 ZL30106 ZL30116 ZL30117 ZL30119
Contextual Info: ZL30116 SONET/SDH OC-48/OC-192 System Synchronizer Data Sheet June 2008 A full Design Manual is available to qualified customers. To register, please send an email to TimingandSync@Zarlink.com. Ordering Information ZL30116GGGV2 100 Pin CABGA ZL30116GGG2V2100 Pin CABGA*

GR-1244

Abstract: GR-253 ZL30106 ZL30116 ZL30116GGG ZL30116GGG2 ZL30117 ZL30119 wand
Contextual Info: ZL30116 SONET/SDH Low Jitter System Synchronizer Data Sheet December 2005 A full Design Manual is available to qualified customers. To register, please send an email to TimingandSync@Zarlink.com. Ordering Information ZL30116GGG 100 Pin CABGA Trays ZL30116GGG2 100 Pin CABGA* Trays

DS7409HGB

Abstract: DS7409HG FCCSP DS-7409HG HL832 nx-a HL832 E700G
Contextual Info: Data Sheet LAMINATE FlipStack CSP Features FlipStack® CSP The FlipStack CSP family utilizes Amkor's industry leading ChipArray® Ball Grid Array CABGA manufacturing capabilities, in combination with Amkor's fcCSP technology. This broad high volume infrastructure enables the rapid deployment of

amkor CABGA 56

Abstract: chiparray amkor CABGA 8X8 CTBGA CABGA 17 x 17 thermal resistance CABGA CVBGA MO-195 8x8 64 footprint amkor cabga
Contextual Info: LAMINATE data sheet CABGA/CTBGA/CVBGA Features: ChipArray Packages: Amkor’s ChipArray® packages are laminatebased Ball Grid Array BGA packages that are compatible with established SMT mounting processes. The near-chip-size standard outlines offer a broad selection of ball array pitch, count,