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    DS7409HG Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    E700G

    Contextual Info: Data Sheet LAMINATE fcCSP fcCSP Packages Amkor Technology offers the Flip Chip CSP fcCSP package – a flip chip solution in a CSP package format. This package construction utilizes Pb-Free (or Eut. SnPb) flip chip interconnect technology, in either area array or


    Original     		ds577ge700g PDF

    DS7409HGB

    Abstract: DS7409HG FCCSP DS-7409HG HL832 nx-a HL832 E700G
    Contextual Info: Data Sheet LAMINATE FlipStack CSP Features FlipStack® CSP The FlipStack CSP family utilizes Amkor's industry leading ChipArray® Ball Grid Array CABGA manufacturing capabilities, in combination with Amkor's fcCSP technology. This broad high volume infrastructure enables the rapid deployment of


    Original     		ds820cds7409hgbds7409hgfccsp+4ds-7409hghl832 nx-ahl832e700g PDF

    EN4900GC

    Abstract: NC7720 CEL9220HF10 EME-G760L EME-G760 HL832nxa Yizbond Hitachi EN4900GC CEL9220 DS-7409HG
    Contextual Info: PCN No: PCN1-110704 Qualification of selected products at additional assembly and test sites Initial Change Notification Date: 7/04/2011 This is an initial announcement of change to a device that is currently offered by Energy Micro. The details of this change are on the following pages.


    Original     		pcn1-110704efm32g890f128j-std-020djesd22-a113+15jesd22-a104c/125jesd22-a103jesd22-a102jesd22-a110en4900gcnc7720cel9220hf10eme-g760leme-g760hl832nxayizbondhitachi en4900gccel9220ds-7409hg PDF