DS7409HGB Search Results

DS7409HGB Datasheets Context Search

Catalog Datasheet	Type	Document Tags	PDF
E700G Contextual Info: Data Sheet LAMINATE fcCSP fcCSP Packages Amkor Technology offers the Flip Chip CSP fcCSP package – a flip chip solution in a CSP package format. This package construction utilizes Pb-Free (or Eut. SnPb) flip chip interconnect technology, in either area array or	Original	DS577G E700G	PDF
DS7409HGB Abstract: DS7409HG FCCSP DS-7409HG HL832 nx-a HL832 E700G Contextual Info: Data Sheet LAMINATE FlipStack CSP Features FlipStack® CSP The FlipStack CSP family utilizes Amkor's industry leading ChipArray® Ball Grid Array CABGA manufacturing capabilities, in combination with Amkor's fcCSP technology. This broad high volume infrastructure enables the rapid deployment of	Original	DS820C DS7409HGB DS7409HG FCCSP DS-7409HG HL832 nx-a HL832 E700G	PDF

Catalog Datasheet

Type

Document Tags

PDF

E700G

Contextual Info: Data Sheet LAMINATE fcCSP fcCSP Packages Amkor Technology offers the Flip Chip CSP fcCSP package – a flip chip solution in a CSP package format. This package construction utilizes Pb-Free (or Eut. SnPb) flip chip interconnect technology, in either area array or

Original

DS577G E700G

PDF

DS7409HGB

Abstract: DS7409HG FCCSP DS-7409HG HL832 nx-a HL832 E700G
Contextual Info: Data Sheet LAMINATE FlipStack CSP Features FlipStack® CSP The FlipStack CSP family utilizes Amkor's industry leading ChipArray® Ball Grid Array CABGA manufacturing capabilities, in combination with Amkor's fcCSP technology. This broad high volume infrastructure enables the rapid deployment of

Original

DS820C DS7409HGB DS7409HG FCCSP DS-7409HG HL832 nx-a HL832 E700G

PDF