C BGA292 Search Results

Contextual Info: Package outline BGA292: plastic ball grid array package; 292 balls; body 27 x 27 x 1.75 mm SOT489-1 B D A D1 ball A1 index area A A2 E1 E A1 detail X C e1 b 1/2 e e ∅v M C A B y y1 C ∅w M C Y W V U T R P N M L K J H G F E D C B A e e2 1/2 e shape optional 4x

BGA-292

Abstract: BGA292 C BGA292 MS-034
Contextual Info: PDF: 2003 Jan 23 Philips Semiconductors Package outline BGA292: plastic ball grid array package; 292 balls; body 27 x 27 x 1.75 mm SOT489-1 B D A D1 ball A1 index area A A2 E1 E A1 detail X C e1 ∅v M C A B b 1/2 e e y y1 C ∅w M C Y W V U T R P N M L K

C BGA292

Abstract: BGA292 MS-034 BGA-292 sot881
Contextual Info: Package outline Philips Semiconductors BGA292: plastic ball grid array package; 292 balls; body 27 x 27 x 1.55 mm D SOT881-1 B A D1 ball A1 index area A A2 A1 E1 E detail X C e1 e ∅v ∅w b 1/2 e y1 C C A B C M M y Y W e V U T R P N M L e2 K J H 1/2 e G

MO-151

Abstract: BGA292 transistor t 04 27 C BGA292
Contextual Info: PDF: 2000 Mar 07 Philips Semiconductors Package outline BGA292: plastic ball grid array package; 292 balls; body 27 x 27 x 1.75 mm SOT489-1 B D A D1 ball A1 index area A E1 E A2 A1 detail X k k C e1 v M B b e ∅w M y y1 C v M A Y W V U e T R P N M L e1 K

Contextual Info: Package outline BGA292: plastic ball grid array package; 292 balls; body 27 x 27 x 1.55 mm D SOT881-1 B A D1 ball A1 index area A A2 A1 E1 E detail X C e1 e Y V W T P M K H F D B ∅v ∅w b 1/2 e e U R N L e2 J 1/2 e G E C A shape optional 4x 1 2 3 4 5

FD-235HF jumper

Abstract: Senstron SQH-4154 chicony keyboard pinout chicony schematic lcd inverter ibm PSA-2054C ISA S20 teac fd-235hf gtc6r-1 teac fd 235hf
Contextual Info: ÉlanSC400 Microcontroller Evaluation Board User’s Manual Release 2.0 A D V A N C E D M I C R O D E V I C E S frt Page ii Thursday, January 29, 1998 1:34 PM Élan SC400 Microcontroller Evaluation Board User’s Manual, Release 2.0 1998 by Advanced Micro Devices, Inc.

BGA292

Abstract: SF-BGA292B-B-11
Contextual Info: D Package Code: BGA292B C 22.86mm [0.900"] 0.71mm [0.028"] See BGA pattern code to the right for actual pattern layout Y 0.58mm [0.023"] X 22.86mm [0.900"] Top View reference only 1.27mm [0.050"] 2 0.36mm [0.014"] dia. 0.71mm [0.028"] 5.33mm 3.74mm [0.147"]

BGA292-P-2727

Abstract: MLGA100-L-1010 005MAX
Contextual Info: Unit:mm FLGA424-C-1717 MLGA100-L-1010 MLGA239-C-1111 ± ± ± 9.00max 11.00±0.15 0.05 ± 0.40 0.625±0.2 0.65 T R P N M L K J H G F E D C B A ± 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 4- φ1.05 0.625±0.2 ± 16.00 φ 1 2 3 4 5 6 7 8 9 101112131415161718192021

Contextual Info: AM33 MN103E Series The AM33 (MN103E) series is a group of 32-bit microprocessors suitable for multimedia uses such as movie, voice, graphics and communication. Its C-language-oriented architecture and C compiler which optimizes and outputs instruction code realize high performance with minimum

SF-BGA292A-B-11

Contextual Info: D Package Code: BGA292A C 24.13mm [0.950"] 0.64mm [0.025"] See BGA pattern code to the right for actual pattern layout Y 0.89mm [0.035"] 1.27 mm [0.050"] X Top View reference only 24.13mm [0.950"] 2 0.36mm [0.014"] dia. 0.64mm [0.025"] 5.33mm 3.74mm [0.147"]

Contextual Info: AM33 MN103E Series AM33 (MN103E) Series The AM33 (MN103E) series is a group of 32-bit microprocessors suitable for multimedia uses such as movie, voice, graphics and communication. Its C-language-oriented architecture and C compiler which optimizes and outputs instruction code realize high performance with minimum

VDD18

Abstract: CLK48
Contextual Info: MN103E010HRA, MN103E040HYB Type MN103E010HRA MN103E040HYB Instruction Cache 16 K-byte 4-way, set-associative Data Cashe 16 K-byte (4-way, set-associative) SRAM Used by Both Instructions and Data Package 16 K-byte BGA292-P-2727 *Lead-free FLGA424-C-1717 *Lead-free

SD2608

Abstract: IEEE754 MN103E010HRA MN103E040HYB
Contextual Info: MN103E010HRA, MN103E040HYB Type MN103E010HRA MN103E040HYB Command Cache 16 K-byte 4-way, set-associative Data Cashe 16 K-byte (4-way, set-associative) SRAM Used by Both Instructions and Data Package 16 K-byte BGA292-P-2727 *Lead-free FLGA424-C-1717 *Lead-free

sd2608

Abstract: 9801 nec IEEE754 MN103E010HRA MN103E040HYB pc9801 nec c bus
Contextual Info: MN103E010HRA, MN103E040HYB Type MN103E010HRA MN103E040HYB Instruction Cache 16 K-byte 4-way, set-associative Data Cashe 16 K-byte (4-way, set-associative) SRAM Used by Both Instructions and Data Package 16 K-byte BGA292-P-2727 *Lead-free FLGA424-C-1717 *Lead-free

0.3mm pitch BGA

Abstract: micro pitch BGA SF-BGA292D-B-11 1mm pitch BGA BGA 20x20
Contextual Info: C BGA292D D Ø 0.396mm x2 See BGA pattern code to the right for actual pattern layout Y (optional alignment hole) 1mm pitch typ. 19mm X Top View (reference only) Ø 0.508mm pad 3.48mm [0.137"] 2 0.5mm 0.3mm [0.012"] dia. 5.32mm [0.210"] 0.635mm 19mm B 1

MD-001A

Contextual Info: MN103E010HRA, MN103E040HYB Type MN103E010HRA MN103E040HYB Command Cache 16 K-byte 4-way, set-associative Data Cashe 16 K-byte (4-way, set-associative) SRAM Used by Both Instructions and Data Package 16 K-byte BGA292-P-2727 FLGA424-C-1717 7.5 ns (at 1.8 V tolerance = ± 5%, 133 MHz)

BGA292

Abstract: sot489 C BGA292
Contextual Info: PDF: 1999 Apr 16 Philips Semiconductors Package outline BGA292: plastic ball grid array package; 292 balls; body 27 x 27 x 1.75 mm SOT489-1 D D1 ball A1 corner A2 A A1 E1 E detail X k k A ZD b e ∅w M y v A ZE Y W V U T R P e N M L K J H G F E D C B A 2 1

panasonic WM-54BT

Abstract: C143 led 10w TC51V18160AFTS-70 SMT18 WM-54BT PANASONIC WM 403A-03 TC51V18160AFTS toshiba SS24 motorola MC33174
Contextual Info: UFORCE20 uforCE Demo Board Revised: Tuesday, October 14, 1997 uforCE.SCH Revision: 2.0 C Advanced Micro Devices, Inc. (800) 222-9323 5204 E. Ben White Blvd. Austin, TX 78741 AMD Proprietary/All Rights Reserved Bill Of Materials Oct. 14,1997 Item Quantity Reference

Contextual Info: BGA, HBGA, LFBGA & TFBGA FOOTPRINT REFLOW SOLDERING Philips Semiconductors F Prow ∅C Pball G Prow Pball MBL179 Reflow soldering(1) FOOTPRINT DIMENSIONS (mm) Prow Pball dia C F G PLACEMENT ACCURACY BGA156 SOT472-1 1.00 1.00 0.50 0.45 15.30 15.30 ±0.10

panasonic WM-54BT

Abstract: toshiba SS24 TC51V18160AFTS-70 tpo610 TPO610T 53556-6810 WM-54BT 1UF 50V SMT CASE C 47UF 50V SMT CASE C Switchcraft 712
Contextual Info: UFORCE20 uforCE Demo Board Revised: Tuesday, June 24, 1997 uforCE.SCH Revision: 2.0 C Advanced Micro Devices, Inc. (800) 222-9323 5204 E. Ben White Blvd. Austin, TX 78741 AMD Proprietary/All Rights Reserved Bill Of Materials July 16,1997 15:50:00 Item Quantity

BGA-169

Abstract: TQFP112 BGA169 PQFP144 BGA-421 BQFP-84 qfp132 BGA196 PLCC18 BGA-256
Contextual Info: НАКОНЕЧНИКИ Изображения наконечников Наименование/размер A/B/C/D Наконечники для монтажа (для паяльника PS90) PS, 0.4 мм, конический PS, 0.8 мм, конический

12x16 font

Abstract: transistor SMD .v05
Contextual Info: INTEGRATED CIRCUITS o y e W M M Vm W M : SAA6721E SXGA RGB to TFT graphics engine Preliminary specification File under Integrated Circuits, IC02 Philips Semiconductors 1999 May 11 PHILIPS PHILIPS Philips Semiconductors Preliminary specification SXGA RGB to TFT graphics engine

LGA 1156 PIN OUT diagram

Abstract: QFP11T144-002 LGA 1156 Socket diagram 216-LQFP Wells-CTI 36 lead Flat Pack smd AAAS Wells-CTI LCC socket Wells-CTI 880 020 BGA136 Enplas drawings
Contextual Info: Preface Thank you for your continuing loyalty to Fujitsu's semiconductor products. Electronic equipment is continually becoming smaller, lighter, and less expensive while also growing more advanced in terms of function and performance. As a result, applications for semiconductor devices such as IC and

LGA 1155 Socket PIN diagram

Abstract: marking code smd fujitsu Yamaichi ic354 marking code smd semiconductor fujitsu pitch 0.4 QFP 256p SMD transistor M05 YAMAICHI ic234 smd code 38P fpq-144-0.5-03 smd p08
Contextual Info: Preface Thank you for your continuing loyalty to Fujitsu's semiconductor products. Electronic equipment is continually becoming smaller, lighter, and less expensive while also growing more advanced in terms of function and performance. As a result, applications for semiconductor devices such as IC and