BGA-292
Abstract: BGA292 C BGA292 MS-034
Contextual Info: PDF: 2003 Jan 23 Philips Semiconductors Package outline BGA292: plastic ball grid array package; 292 balls; body 27 x 27 x 1.75 mm SOT489-1 B D A D1 ball A1 index area A A2 E1 E A1 detail X C e1 ∅v M C A B b 1/2 e e y y1 C ∅w M C Y W V U T R P N M L K
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MO-151
Abstract: BGA292 transistor t 04 27 C BGA292
Contextual Info: PDF: 2000 Mar 07 Philips Semiconductors Package outline BGA292: plastic ball grid array package; 292 balls; body 27 x 27 x 1.75 mm SOT489-1 B D A D1 ball A1 index area A E1 E A2 A1 detail X k k C e1 v M B b e ∅w M y y1 C v M A Y W V U e T R P N M L e1 K
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bga292ot489-1mo-151transistor t 04 27+1c bga292
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BGA292
Abstract: sot489 C BGA292
Contextual Info: PDF: 1999 Apr 16 Philips Semiconductors Package outline BGA292: plastic ball grid array package; 292 balls; body 27 x 27 x 1.75 mm SOT489-1 D D1 ball A1 corner A2 A A1 E1 E detail X k k A ZD b e ∅w M y v A ZE Y W V U T R P e N M L K J H G F E D C B A 2 1
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BGA292
Abstract: BGA-292
Contextual Info: Philips Semiconductors Package outlines BGA292: plastic ball grid array package; 292 balls; body 27 x 27 x 1.75 mm 1998 May 06 1 SOT489-1
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Contextual Info: Package outline BGA292: plastic ball grid array package; 292 balls; body 27 x 27 x 1.75 mm SOT489-1 B D A D1 ball A1 index area A A2 E1 E A1 detail X C e1 b 1/2 e e ∅v M C A B y y1 C ∅w M C Y W V U T R P N M L K J H G F E D C B A e e2 1/2 e shape optional 4x
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Contextual Info: BGA, HBGA, LFBGA & TFBGA FOOTPRINT REFLOW SOLDERING Philips Semiconductors F Prow ∅C Pball G Prow Pball MBL179 Reflow soldering(1) FOOTPRINT DIMENSIONS (mm) Prow Pball dia C F G PLACEMENT ACCURACY BGA156 SOT472-1 1.00 1.00 0.50 0.45 15.30 15.30 ±0.10
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mbl179bga156ot472-1bga256+5ot466-1ot471-1bga292ot489-1bga316
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SMD Transistor Y02
Abstract: SAA7113 Application notes SMD Transistor Y13 SAA7113A p87c695 sMD .v05 smd V05 BGA292 SAA6721E SAA7113
Contextual Info: INTEGRATED CIRCUITS DATA SHEET SAA6721E SXGA RGB to TFT graphics engine Preliminary specification File under Integrated Circuits, IC02 1999 May 11 Philips Semiconductors Preliminary specification SXGA RGB to TFT graphics engine SAA6721E CONTENTS 8.4 1 FEATURES
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saa6721e545004/750/01/pp72smd transistor y02saa7113 application notes+7smd transistor y13saa7113ap87c695smd .v05smd v05bga292saa7113
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SOT411
Abstract: SnAg25Sb10 zirconium acetate AgCu28 Transistors smd mark code CuZn15 QFP100 Quad Flat Pack dimensions 271 Ceramic Disc Capacitors SOT538 smd led 5050
Contextual Info: Environmental Information ENVIRONMENTAL SAFETY Offering maximum benefit – minimum impact New technologies result in shared benefits for you our customers, balancing maximum technological benefits with minimum environmental impact. This starts with clever chip designs, which
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sot411snag25sb10zirconium acetateagcu28+6transistors smd mark codecuzn15qfp100 quad flat pack dimensions271 ceramic disc capacitorssot538smd led 5050
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PBG1 smd
Abstract: P87C695
Contextual Info: INTEGRATED CIRCUITS DATA SHEET SAA6712E XGA RGB to TFT graphics engine Preliminary specification File under Integrated Circuits, IC02 1999 Aug 25 Philips Semiconductors Preliminary specification XGA RGB to TFT graphics engine SAA6712E CONTENTS 8.4 1 FEATURES
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P87C695
Abstract: VPC3 C upscaler pab7 SMD Transistor Y02
Contextual Info: INTEGRATED CIRCUITS DATA SHEET SAA6721E SXGA RGB to TFT graphics engine Preliminary specification File under Integrated Circuits, IC02 1999 May 11 Philips Semiconductors Preliminary specification SXGA RGB to TFT graphics engine SAA6721E CONTENTS 8.4 1 FEATURES
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saa6721e11-may-99p87c695vpc3 c+3upscalerpab7smd transistor y02
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handbook philips ic26 packaging
Abstract: AN01026 BGA304 land pattern BGA 0.75 BGA OUTLINE DRAWING BGA and QFP Package LFBGA80 LR-735 stencil tension land pattern BGA 0,50
Contextual Info: APPLICATION INFORMATION AN01026 LF BGA APPLICATION NOTE ATO INNOVATION, PHILIPS SEMICONDUCTORS MARCH 2000 Philips Semiconductors BGA Application Note CONTENTS 1 INTRODUCTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
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an01026bga256ot466-1ot471-1+13bga292ot489-1bga304ot550-1bga316handbook philips ic26 packagingland pattern bga 0.75bga outline drawingbga and qfp packagelfbga80lr-735stencil tensionland pattern bga 0,50
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JEDEC TRAY DIMENSIONS
Abstract: HSSOP20 ic packages TRAY TSSOP20 14 X 35 SO16 package trays BGA304 HLQFP100 MSD504 LQFP64 reel size PLCC84 package
Contextual Info: CHAPTER 7 PACKING METHODS page Introduction 7-2 Glossary of terms 7-2 Drypack for moisture sensitive SMDs 7-3 Survey of IC packing methods 7-5 Packing methods in exploded view 7-6 Packing quantities, box dimensions and carrier shapes 7 - 13 Philips Semiconductors
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manuf86tqfp80ot357tqfp64+12ot543tfbga64jedec tray dimensionshssop20ic packagestray tssop20 14 x 35so16 package traysbga304hlqfp100msd504lqfp64 reel sizeplcc84 package
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SMD TRANSISTOR Y2
Abstract: vpc3 b SMD TRANSISTOR w18 BGA292 p87c695 SAA6721E SAA6712E smd transistor G18 RW203 MHB250
Contextual Info: INTEGRATED CIRCUITS DATA SHEET SAA6712E XGA RGB to TFT graphics engine Preliminary specification File under Integrated Circuits, IC02 1999 Aug 25 Philips Semiconductors Preliminary specification XGA RGB to TFT graphics engine SAA6712E CONTENTS 8.4 1 FEATURES
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saa6712e545004/01/pp64smd transistor y2vpc3 b+7smd transistor w18bga292p87c695saa6721esmd transistor g18rw203mhb250
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12x16 font
Abstract: transistor SMD .v05
Contextual Info: INTEGRATED CIRCUITS o y e W M M Vm W M : SAA6721E SXGA RGB to TFT graphics engine Preliminary specification File under Integrated Circuits, IC02 Philips Semiconductors 1999 May 11 PHILIPS PHILIPS Philips Semiconductors Preliminary specification SXGA RGB to TFT graphics engine
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saa6721e545004/750/01/pp7212x16 fonttransistor smd .v05 |
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