BGA492 Search Results

SOT514

Abstract: MS-034
Contextual Info: PDF: 2003 Jan 23 Philips Semiconductors Package outline BGA492: plastic ball grid array package; 492 balls; body 35 x 35 x 1.75 mm B D D1 SOT514-1 A ball A1 index area E1 E A A2 A1 detail X C e1 y1 C ∅v M C A B b 1/2 e e y ∅w M C AF AE e AD AC AB AA Y

sot514

Contextual Info: PDF: 1999 Apr 16 Philips Semiconductors Package outline BGA492: plastic ball grid array package; 492 balls; body 35 x 35 x 1.75 mm SOT514-1 D D1 ball A1 index A2 A A1 E1 E detail X k A k b e ZD ∅w M ZE AF AE AD AC AB AA Y W V U T R P N M L K J H G F E D

BGA492

Abstract: SOT514
Contextual Info: Philips Semiconductors Package outlines BGA492: plastic ball grid array package; 492 balls; body 35 x 35 x 1.75 mm 1998 Apr 08 641 SOT514-1

SF-BGA492A-B-11

Contextual Info: D Package Code: BGA492A C 32.004mm See BGA pattern code to the right for actual pattern layout Y Ø 0.635mm Pad 32.004mm X Top View reference only 1.27mm [0.050"] 2 0.36mm [0.014"] dia. 5.33mm 3.74mm [0.147"] [0.210"] 31.75mm sq. B 1 3 Top View: Recommended PCB Layout

SOT514

Abstract: MO-151
Contextual Info: PDF: 2000 Mar 07 Philips Semiconductors Package outline BGA492: plastic ball grid array package; 492 balls; body 35 x 35 x 1.75 mm B D D1 SOT514-1 A ball A1 index area E1 E A A2 A1 detail X k k e1 b e C v M B ∅w M v M A AF AE AD AC AB AA Y W V U T R P N

Contextual Info: BGA, HBGA, LFBGA & TFBGA FOOTPRINT REFLOW SOLDERING Philips Semiconductors F Prow ∅C Pball G Prow Pball MBL179 Reflow soldering(1) FOOTPRINT DIMENSIONS (mm) Prow Pball dia C F G PLACEMENT ACCURACY BGA156 SOT472-1 1.00 1.00 0.50 0.45 15.30 15.30 ±0.10

13001 s 8d

Abstract: WM-034BY NEC c157 13001 8d Zener C249 LP141X5 isuzu 13001 B 8D FUSE 3A 125V SMT mhd2032at
Contextual Info: 1999/3/15 * NBX;6120/TGAA/32A/1EN1/N1DN1 Spare Parts List * 6120 A .1 .3 .3 .3 .4 .4 .4 .4 .4 .4 .4 .4 .3 .4 .4 .4 .4 .4 .3 .4 .4 .4 .4 .4 .4 .4 .4 .4 .4 .4 .4 .4

BGA676

Abstract: BGA665 BGA-1156 156 QFN 12X12 LGA240 BGA-783 BGA441 BGA1024 BGA1521 7286X
Contextual Info: Ironwood Electronics Appendix A AP-A.1 APPENDIX A • BGA Chip Package Specification Tables . . . . . . . .page AP.2 thru AP.16 • LGA Chip Package Specification Table . . . . . . . . . . . . . . . . .page AP.17 • MLF Package Specification Table . . . . . . . . . . . . . . . . . . . . .page AP.18

f9222

Abstract: philips F2110 F8222 f7326 f9223 F11216 f8113 F9328 F7328 IEC C13 pinout
Contextual Info: INTEGRATED CIRCUITS PZ3960C/PZ3960N 960 macrocell SRAM CPLD Product specification Supersedes data of 1998 Sep 01 IC27 Data Handbook Philips Semiconductors 1998 Sep 28 Philips Semiconductors Product specification 960 macrocell SRAM CPLD PZ3960C/PZ3960N FEATURES

F1022

Abstract: f1031 MC19 PZ3960C7EB PZ3960N8EB sot514 F929 F926 Philips F423 f811
Contextual Info: INTEGRATED CIRCUITS PZ3960C/PZ3960N 960 macrocell SRAM CPLD Preliminary specification Supersedes data of 1998 Jan 21 IC27 Data Handbook Philips Semiconductors 1998 Jul 21 Philips Semiconductors Preliminary specification 960 macrocell SRAM CPLD PZ3960C/PZ3960N

121C-2

Abstract: XC1765D XC95108 XL mp8000ch4 p103 pot datasheet reliability report PQFP240 XC95xxx 17256d D1 PGA 478
Contextual Info: The Reliability Data Program Expanded Version Jan. 1, 2000 Cover P1 TABLE OF CONTENTS Introduction .…4 The Reliability Program. .…4

Contextual Info: INTEGRATED CIRCUITS l y i E I TI im m Xilinx has acquired the entire Philips CoolRurtner Low Power CPLD Product Family, For more technical or sales information^ please see; 8 £«& ^S l 8 ft « »0» X ft »« www.xillnx.com XCR3960 960 macrocell SRAM CPLD

manchester verilog decoder

Abstract: Philips Semiconductors Selection Guide pzlcp AN057
Contextual Info: Philips Semiconductors CONTENTS IC27: Complex Programmable Logic Devices CPLDs Preface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

XC95XXXL

Abstract: XC95XXX XC1765D PQFP240 C17S xc9536 A9903 XCV1000E FG HT 12E APPLICATION Reliability Test Methods for Packaged Devices
Contextual Info: The Reliability Data Program Expanded Version July 1, 2000 Cover P1 TABLE OF CONTENTS Introduction .…4 The Reliability Program. .…4

Motherboard Intel fw82443bx

Abstract: WM034B MAX3234 lcd screen hyundai LVDS connector 20 pins 442-665 p4 motherboard fan track rout sb3052 ht13x mother board lcd tv block diagram fw82443bx
Contextual Info: 6120 N/B MAINTENANCE 1. DEFINITION & LOCATION CONNECTORS/ SWITCHES… … ….… P.2 2. DEFINITION & LOCATION MAJOR COMPONENTS… … … … . …P.4… 3. PIN DESCRIPTIONS OF MAJOR COMPONENTS … … … … … …P.5… … 4. 6120 BLOCK DIAGRAM … … … … … … ….…

kbc 1070 nu

Abstract: toshiba c850 JRC 386 amp LYNXEM4 D5024 hosiden DC motor 12V DFWP0125WA R5C475 Matsua inverter MID manual B9017
Contextual Info: ORDER NO. CPD0102001C0 Notebook Computer CF-28 This is the Service Manual for the following areas. M .for U.S.A. and Canada E .for U.K. G .for Germany F .for France S .for Sweden When this product is repaired, the Access Key is necessary to release security of electrical and mechanical.

LM-JK63-22NTR

Abstract: Video capture card location in PC MOTHERBOARD intel 845 circuit diagram with problem location TM41PDG220-2 lt 7233 AA121SJ03 Intel 82371MB USER GUIDE FW82443BX MOTHERBOARD mitac 8 lmjk6322ntr INTEL PENTIUM PROCESSOR MOBILE MODULE
Contextual Info: 7233 N/B MAINTENANCE 0. Introduction … … … … … … … … … … … … … … … … … … … … … … … … … … … . . P. 2 1. Definition & Location Connectors/ Switches … … … … … … … … … … … … … … . . P.20

f7326

Abstract: f9114 F6222
Contextual Info: [M m SlnlEET PZ3960C/PZ3960N 960 macrocell SRAM CPLD Product specification Supersedes data of 1998 Jul 21 IC27 Data Handbook Philips Semiconductors 1998 Sep 01 PHILIPS Philips Semiconductors Product specification 960 macrocell SRAM CPLD PZ3960C/PZ3960N FEATURES

F9222

Abstract: 05464 MC19 PZ3960C7EB PZ3960N8EB F9328 F9221 f9114 F6222 F9220
Contextual Info: INTEGRATED CIRCUITS PZ3960C/PZ3960N 960 macrocell SRAM CPLD Product specification Supersedes data of 1998 Sep 28 IC27 Data Handbook Philips Semiconductors 1999 Mar 18 Philips Semiconductors Product specification 960 macrocell SRAM CPLD PZ3960C/PZ3960N FEATURES

SOT411

Abstract: SnAg25Sb10 zirconium acetate AgCu28 Transistors smd mark code CuZn15 QFP100 Quad Flat Pack dimensions 271 Ceramic Disc Capacitors SOT538 smd led 5050
Contextual Info: Environmental Information ENVIRONMENTAL SAFETY Offering maximum benefit – minimum impact New technologies result in shared benefits for you our customers, balancing maximum technological benefits with minimum environmental impact. This starts with clever chip designs, which

diode c649 ST

Abstract: C526 Zener KE45WS RMA-010-FP 904251 TM121SV-02L01 6133 diode u34 schottky diode ST HDK632 h8 sot23 diode zener
Contextual Info: 1999/3/15 * NBX;6133/T2XA/XXA/3FR7/NXCN1 Spare Parts List * 6133 Spare Parts List Reference A PART_NO 526266610038 .2 416266610004 .4 411666100001 .5 225665500001 .5 242600000001 .5 242600000145 .5 242600000364 .5 242600000170

USER GUIDE FW82443BX MOTHERBOARD

Abstract: Mainboard Schematics mitac 6120 Transistor U503 insyde debug card code PD510 mosfet 716 FW82371EB pci set intel pci set fw82371eb mitac 8
Contextual Info: 7020 MAINTENANCE CONTENTS 1. Definition and Location of Connectors & Jumpers. … . … … . … … … … … … … . … … … . 2~4 2. Location of Major Components. … . … . … … … … … … … . … … . 5~7

f1031

Abstract: f422 f931 F918
Contextual Info: INTEGRATED CIRCUITS Xilinx has acquired the entire Philips CoolRunner Low Power CPLD Product Family. For more technical or sales information, please see: www.xilinx.com XCR3960 960 macrocell SRAM CPLD Preliminary specification Supersedes data of 1998 Jan 21

handbook philips ic26 packaging

Abstract: AN01026 BGA304 land pattern BGA 0.75 BGA OUTLINE DRAWING BGA and QFP Package LFBGA80 LR-735 stencil tension land pattern BGA 0,50
Contextual Info: APPLICATION INFORMATION AN01026 LF BGA APPLICATION NOTE ATO INNOVATION, PHILIPS SEMICONDUCTORS MARCH 2000 Philips Semiconductors BGA Application Note CONTENTS 1 INTRODUCTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3