SOT514
Abstract: MS-034 
 
Contextual Info: PDF: 2003 Jan 23 Philips Semiconductors Package outline BGA492: plastic ball grid array package; 492 balls; body 35 x 35 x 1.75 mm B D D1 SOT514-1 A ball A1 index area E1 E A A2 A1 detail X C e1 y1 C ∅v M C A B b 1/2 e e y ∅w M C AF AE e AD AC AB AA Y
 
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BGA492:
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sot514
Contextual Info: PDF: 1999 Apr 16 Philips Semiconductors Package outline BGA492: plastic ball grid array package; 492 balls; body 35 x 35 x 1.75 mm SOT514-1 D D1 ball A1 index A2 A A1 E1 E detail X k A k b e ZD ∅w M ZE AF AE AD AC AB AA Y W V U T R P N M L K J H G F E D
 
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BGA492
Abstract: SOT514 
 
Contextual Info: Philips Semiconductors Package outlines BGA492: plastic ball grid array package; 492 balls; body 35 x 35 x 1.75 mm 1998 Apr 08 641 SOT514-1
 
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BGA492:
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SOT514
Abstract: MO-151 
 
Contextual Info: PDF: 2000 Mar 07 Philips Semiconductors Package outline BGA492: plastic ball grid array package; 492 balls; body 35 x 35 x 1.75 mm B D D1 SOT514-1 A ball A1 index area E1 E A A2 A1 detail X k k e1 b e C v M B ∅w M v M A AF AE AD AC AB AA Y W V U T R P N
 
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Contextual Info: BGA, HBGA, LFBGA & TFBGA FOOTPRINT  REFLOW SOLDERING  Philips Semiconductors F Prow ∅C Pball G Prow Pball MBL179 Reflow soldering(1) FOOTPRINT DIMENSIONS (mm) Prow Pball dia C F G PLACEMENT ACCURACY BGA156 SOT472-1 1.00 1.00 0.50 0.45 15.30 15.30 ±0.10
 
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MBL179 
BGA156 
OT472-1 
BGA256 
OT466-1 
OT471-1 
BGA292 
OT489-1 
BGA316 
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f9222
Abstract: philips F2110 F8222 f7326 f9223 F11216 f8113 F9328 F7328 IEC C13 pinout 
 
Contextual Info: INTEGRATED CIRCUITS PZ3960C/PZ3960N 960 macrocell SRAM CPLD Product specification Supersedes data of 1998 Sep 01 IC27 Data Handbook Philips Semiconductors 1998 Sep 28 Philips Semiconductors Product specification 960 macrocell SRAM CPLD PZ3960C/PZ3960N FEATURES
 
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PZ3960C/PZ3960N 
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philips F2110
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IEC C13 pinout
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F1022
Abstract: f1031 MC19 PZ3960C7EB PZ3960N8EB sot514 F929 F926 Philips F423 f811 
 
Contextual Info: INTEGRATED CIRCUITS PZ3960C/PZ3960N 960 macrocell SRAM CPLD Preliminary specification Supersedes data of 1998 Jan 21 IC27 Data Handbook Philips Semiconductors 1998 Jul 21 Philips Semiconductors Preliminary specification 960 macrocell SRAM CPLD PZ3960C/PZ3960N
 
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Contextual Info: INTEGRATED CIRCUITS l y i E I TI im m Xilinx has acquired the entire Philips CoolRurtner Low Power CPLD Product Family, For more technical or sales information^ please see; 8 £«& ^S l 8 ft « »0» X ft »« www.xillnx.com XCR3960 960 macrocell SRAM CPLD
 
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manchester verilog decoder
Abstract: Philips Semiconductors Selection Guide pzlcp AN057 
 
Contextual Info: Philips Semiconductors CONTENTS IC27: Complex Programmable Logic Devices  CPLDs  Preface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
 
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F423
Abstract: Philips F423 10n26 F1021 MC19 PZ3960C7EB PZ3960N8EB 
 
Contextual Info: Philips Sem iconductors Prelim inary specification 960 macrocell SRAM CPLD PZ3960C/PZ3960N FEATURES DESCRIPTION • Industry’s largest CPLD— 960 macrocells The PZ3960 device is a m em ber of the CoolRunner  fam ily of high-density SRAM -based CPLDs  Com plex Program mable Logic
 
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0000-0-9-OOÃ
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f7326
Abstract: f9114 F6222 
 
Contextual Info: [M m SlnlEET PZ3960C/PZ3960N 960 macrocell SRAM CPLD Product specification Supersedes data of 1998 Jul 21 IC27 Data Handbook Philips Semiconductors 1998 Sep 01 PHILIPS Philips Semiconductors Product specification 960 macrocell SRAM CPLD PZ3960C/PZ3960N FEATURES
 
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F9222
Abstract: 05464 MC19 PZ3960C7EB PZ3960N8EB F9328 F9221 f9114 F6222 F9220 
 
Contextual Info: INTEGRATED CIRCUITS PZ3960C/PZ3960N 960 macrocell SRAM CPLD Product specification Supersedes data of 1998 Sep 28 IC27 Data Handbook Philips Semiconductors 1999 Mar 18 Philips Semiconductors Product specification 960 macrocell SRAM CPLD PZ3960C/PZ3960N FEATURES
 
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SOT411
Abstract: SnAg25Sb10 zirconium acetate AgCu28 Transistors smd mark code CuZn15 QFP100 Quad Flat Pack dimensions 271 Ceramic Disc Capacitors SOT538 smd led 5050 
 
Contextual Info: Environmental Information ENVIRONMENTAL SAFETY Offering maximum benefit – minimum impact New technologies result in shared benefits for you our customers, balancing maximum technological benefits with minimum environmental impact. This starts with clever chip designs, which
 
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f1031
Abstract: f422 f931 F918 
 
Contextual Info: INTEGRATED CIRCUITS Xilinx has acquired the entire Philips CoolRunner Low Power CPLD Product Family. For more technical or sales information, please see: www.xilinx.com XCR3960 960 macrocell SRAM CPLD Preliminary specification Supersedes data of 1998 Jan 21
 
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F5311
Abstract: F9222 f9114 
 
Contextual Info: Philips Semiconductors Product specification 960 macrocell SRAM CPLD PZ3960C/PZ3960N FEATURES DESCRIPTION • Industry’s largest CPLD— 960 m acrocells The PZ3960 device is a m em ber of the CoolRunner  fam ily of high-density SRAM -based CPLDs  Com plex Program mable Logic
 
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pla macrocells
Abstract: pz3960 Signal Path designer 
 
Contextual Info: INTEGRATED CIRCUITS PZ3960C/PZ3960N 960 macrocell SRAM CPLD Preliminary specification Supersedes data of 1998 Jan 21 IC27 Data Handbook Philips Semiconductors 1998 May 12 PHILIPS Philips Semiconductors Preliminary specification 960 macrocell SRAM CPLD PZ3960C/PZ3960N
 
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JEDEC TRAY DIMENSIONS
Abstract: HSSOP20 ic packages TRAY TSSOP20 14 X 35 SO16 package trays BGA304 HLQFP100 MSD504 LQFP64 reel size PLCC84 package 
 
Contextual Info: CHAPTER 7 PACKING METHODS page Introduction 7-2 Glossary of terms 7-2 Drypack for moisture sensitive SMDs 7-3 Survey of IC packing methods 7-5 Packing methods in exploded view 7-6 Packing quantities, box dimensions and carrier shapes 7 - 13 Philips Semiconductors
 
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manuf86 
TQFP80 
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SO16 package trays
BGA304
HLQFP100
MSD504
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MC19
Abstract: PZ3960C7EB PZ3960N8EB 07N22 f7326 f9114 
 
Contextual Info: Philips Semiconductors Product specification 960 macrocell SRAM CPLD PZ3960C/PZ3960N FEATURES DESCRIPTION • Industry’s largest CPLD— 960 macrocells The PZ3960 device is a m em ber of the CoolRunner  fam ily of high-density SRAM -based CPLDs  Com plex Program mable Logic
 
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0000-0-9-OOÃ
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F1026V
Abstract: 2F123 
 
Contextual Info: Preliminary specification Philips Semiconductors 960 macrocell SRAM CPLD PZ3960C/PZ3960N FEATURES DESCRIPTION • Industry’s largest CPLD— 960 macrocells The PZ3960 device is a member of the CoolRunner  family of high-density SRAM-based CPLDs  Complex Programmable Logic
 
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1-888-CoolPLD 
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