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    BGA-64 PAD Search Results

    BGA-64 PAD Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    54S189J/C
    Rochester Electronics LLC 54S189 - 64-Bit Random Access Memory PDF Buy
    V36BEZ02307000T
    Amphenol Communications Solutions ExtremePort QSFP-DD 112G stacked SMT connector, Glue pad version PDF
    NDHN3B2
    Amphenol Communications Solutions Rectangular Push Pull IP67 Industrial Ethernet Connector, NDH, Ix Industrial, Hood + Plug Kit, B Key, Plug with Solder Pad Termination, 8u\\ Gold plating PDF
    NDHN6B2
    Amphenol Communications Solutions Rectangular Push Pull IP67 Industrial Ethernet Connector, NDH, Ix Industrial, Bulkhead, Hood + Plug Kit, B Key, Plug with Solder Pad Termination, 8u\\ Gold plating PDF
    MSPEP6P22A0
    Amphenol Communications Solutions SPE IP67 Plug, Push Pull Lock, Solder Pad, 28 to 18 AWG, Cable OD 0.138in to 0.252in, 3 Grommets PDF

    BGA-64 PAD Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    PC28F256P30BF

    Abstract: PC48F4400P0VB0E JS28F256P30 RC28F256P30TF Numonyx TE28F256P30BF PC28F256P30 JS28F256P30tf PC48F PF48F
    Contextual Info: NumonyxTM StrataFlash Embedded Memory P30-65nm 256-Mbit, 512-Mbit (256M/256M) Datasheet Product Features „ High performance „ Security — 100 ns initial access for Easy BGA — One-Time Programmable Register: • 64 unique factory device identifier bits


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    P30-65nm) 256-Mbit, 512-Mbit 256M/256M) 16-word 512-word 512-word 130nm. 40MHz P30-65nm PC28F256P30BF PC48F4400P0VB0E JS28F256P30 RC28F256P30TF Numonyx TE28F256P30BF PC28F256P30 JS28F256P30tf PC48F PF48F PDF

    Dow Corning 6811

    Abstract: 78 L033 TDR-90 sr61 hv25 k2 1 HV49 l033 sr61 tot transistor SR62 HV10
    Contextual Info: HV512 HV512 64-Channel Serial To Parallel Converter With Temperature Sense and High Voltage Push-Pull Outputs Ordering Information Package Option Device Micro-BGA Die HV512 HV512GA HV512X Features General Description ❏ High voltage HVCMOS output ❏ Output voltages from 0V to 50V-200V


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    HV512 64-Channel HV512GA HV512X 0V-200V HV512 25MHz Dow Corning 6811 78 L033 TDR-90 sr61 hv25 k2 1 HV49 l033 sr61 tot transistor SR62 HV10 PDF

    JS28F256P30

    Abstract: JS28F256P30T JS28F256P30BF PC28F256P3 RC48F4400P0VB0
    Contextual Info: Numonyx AxcellTM Flash Memory P3065nm 256-Mbit, 512-Mbit (256M/256M) Datasheet Product Features „ High performance „ Security — 100 ns initial access for Easy BGA — One-Time Programmable Register: • 64 OTP bits, programmed with unique — 110 ns initial access for TSOP


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    P3065nm) 256-Mbit, 512-Mbit 256M/256M) 16-word 256Mb, 512Mb 256Mb 64-ball PC28F256P30TFE JS28F256P30 JS28F256P30T JS28F256P30BF PC28F256P3 RC48F4400P0VB0 PDF

    free circuit diagram of USB modem

    Abstract: BGA-64 pad LOG RX 2 1301 16 pin IC R01A SiW1602 latest bluetooth circuits diagrams free circuit diagram of bluetooth modem SiW1701 MC145481 SiW1502
    Contextual Info: SiW1760 Baseband Processor Data Sheet 2 FEATURES • Small footprint 64-pin BGA packag9 6 x 6 mm . CLOCK and RESET LOGIC PWR1_EN PWR2_EN ENABLE_RM VSS_PLL VSS_USB VSS_C VSS_P VDD_S VDD_P VDD_C VDD_RM VDD_PLL VDD_USB VDD_UART CLK32K_OUT CLK32K_IN The SiW1760 Baseband Processor is part of Silicon


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    SiW1760 64-pin CLK32K SiW1701 SiW1502 free circuit diagram of USB modem BGA-64 pad LOG RX 2 1301 16 pin IC R01A SiW1602 latest bluetooth circuits diagrams free circuit diagram of bluetooth modem MC145481 PDF

    JS28F256P30

    Abstract: PC48F4400 PC28F256P30BFE RC48F4400P PC28F256P30B JS28F256P30T PC48F4400P0 PC28F256P30 js28f256p RC28F256P30TF
    Contextual Info: Numonyx Flash Memory P30-65nm 256-Mbit, 512-Mbit (256M/256M) Datasheet Product Features „ High performance „ Security — 100 ns initial access for Easy BGA — One-Time Programmable Register: • 64 OTP bits, programmed with unique — 110 ns initial access for TSOP


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    P30-65nm) 256-Mbit, 512-Mbit 256M/256M) 16-word 256Mb 64-ball 100ns 02-Dec-2011 JS28F256P30 PC48F4400 PC28F256P30BFE RC48F4400P PC28F256P30B JS28F256P30T PC48F4400P0 PC28F256P30 js28f256p RC28F256P30TF PDF

    DS3802

    Abstract: DS3816C-512
    Contextual Info: DS3816C-512 16Mb Advanced NV SRAM with Clock www.maxim-ic.com FEATURES § § § § § § § § § § § PACKAGE OUTLINE 5V operation ±10% Surface-mount NV RAM BGA module construction 512k x 32 NV SRAM memory space and separate 64 x 8 real-time clock memory


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    DS3816C-512 150ns DS3816C-512 50mil DS3802 PDF

    datasheet of BGA Staggered pins

    Abstract: NEC-V850 VHDL CODE FOR HDLC controller vhdl code for 4 channel dma controller clock tree balancing serdes transceiver 1999 verilog code for i2c vhdl code download for memory in cam vhdl code for watchdog timer of ATM vhdl coding for analog to digital converter
    Contextual Info: GS30 0.15-µm CMOS Standard Cell/Gate Array High-Value ASIC ❑ 0.15-µm Leff process 0.18-µm drawn with Shallow Trench Isolation (STI) Inline bond pads Minimum height I/Os Minimum width I/O ❑ 4 and 5 levels of metal ❑ 6 million random logic gates plus 6 million


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    337 BGA

    Abstract: AA23 AC25 EP20K160E
    Contextual Info: EP20K160E I/O Pins ver. 1.2 I/O & VREF Bank 8 8 8 8 – – 8 8 8 8 8 – 8 8 8 8 8 – 8 8 8 8 8 – 8 8 8 8 8 – 8 8 8 8 8 – 8 8 8 8 8 – 8 8 8 8 8 Pad Number Orientation Pin/Pad Function 144-Pin TQFP 208-Pin PQFP 240-Pin PQFP 356-Pin BGA 1 (1) (1)


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    EP20K160E 144-Pin 208-Pin 240-Pin 356-Pin 484-Pin 337 BGA AA23 AC25 PDF

    PQFP-144

    Abstract: EP20K30E
    Contextual Info: EP20K30E I/O Pins ver. 1.1 I/O & VREF Bank Pad Number Orientation Pin/Pad Function 144-Pin TQFP 208-Pin PQFP 144-Pin 1 (1) FineLine BGA 324-Pin FineLine BGA 8 8 8 8 8 8 8 8 1 2 3 4 5 6 7 8 9 10 11 12 13 14 8 8 8 8 7 7 15 16 17 18 19 20 21 22 23 24 25 26


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    EP20K30E 144-Pin 208-Pin 144-Pin 324-Pin PQFP-144 PDF

    T25 4 h5

    Abstract: AE23 AF23 EP20K60E 356-pin 215 bga BGA128
    Contextual Info: EP20K60E I/O Pins ver. 1.1 I/O & VREF Bank 8 8 8 8 – 8 8 8 8 8 – 8 – Pad Number Orientation Pin/Pad Function 144-Pin TQFP 1 208-Pin PQFP (1) 240-Pin PQFP (1) 144-Pin 324-Pin 356-Pin FineLine BGA FineLine BGA BGA 1 2 3 4 5 6 7 8 9 10 11 12 13 – –


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    EP20K60E 144-Pin 208-Pin 240-Pin 324-Pin 356-Pin T25 4 h5 AE23 AF23 356-pin 215 bga BGA128 PDF

    LQFP-48 thermal pad

    Abstract: exposed QFP 144 CQFP 240 QFP-128 20 x 14 pad exposed QFP 128 BGA-64 pad LQFP-64 thermal pad 2-CQFP SOT23-6 1152 BGA 144
    Contextual Info: Thermal Characteristics of IC Assembly method for using this board is specified by the SEMI standard G38-87. These standards are available in the SEMI International Standards book, Volume 4, for packaging. INTRODUCTION The purpose of this document is to provide a centralized


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    G38-87. LQFP-48 thermal pad exposed QFP 144 CQFP 240 QFP-128 20 x 14 pad exposed QFP 128 BGA-64 pad LQFP-64 thermal pad 2-CQFP SOT23-6 1152 BGA 144 PDF

    UA42

    Abstract: VFBGA-48 bga rework aa56 yamaichi socket
    Contextual Info: Design Summary for 56GQL 48- and 56-pin functions MicroStar Junior TM BGA PCB Design Guidelines Package Via to Board Land Area Configuration Trace Width/Spacing Dimensions (mm [in.]) Non-Solder Mask Defined Pad MicroStar Junior Package Package ball via 0.2±0.05mm


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    56GQL 56-pin 65-mm SCET004 UA42 VFBGA-48 bga rework aa56 yamaichi socket PDF

    Recommended land pattern smd-0.5

    Abstract: "x-ray machine" Lattice Semiconductor Package Diagrams 256-Ball fpBGA pcb fabrication process ultra fine pitch BGA LC4064ZE package dimension 256-FTBGA nomenclature pcb hdi of BGA Staggered Pins package BN256
    Contextual Info: PCB Layout Recommendations for BGA Packages September 2010 Technical Note TN1074 Introduction As Ball Grid Array BGA packages become increasingly popular and become more populated across the array with higher pin count and smaller pitch, it is important to understand how they are affected by various board layout


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    TN1074 Recommended land pattern smd-0.5 "x-ray machine" Lattice Semiconductor Package Diagrams 256-Ball fpBGA pcb fabrication process ultra fine pitch BGA LC4064ZE package dimension 256-FTBGA nomenclature pcb hdi of BGA Staggered Pins package BN256 PDF

    smd transistor mark E13

    Abstract: Modified Coffin-Manson Equation Calculations senju solder paste m10 f12 A10D10 P6K6 BGA reflow guide Senju metal flux T5 k5m6 K793 T4V4
    Contextual Info: MicroStar BGAt Packaging Reference Guide Literature Number: SSYZ015B Third Edition – September 2000 MicroStar BGA is a trademark of Texas Instruments Incorporated. Printed on Recycled Paper IMPORTANT NOTICE Texas Instruments and its subsidiaries TI reserve the right to make changes to their products or to discontinue


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    SSYZ015B smd transistor mark E13 Modified Coffin-Manson Equation Calculations senju solder paste m10 f12 A10D10 P6K6 BGA reflow guide Senju metal flux T5 k5m6 K793 T4V4 PDF

    VSP6244

    Abstract: hp laptop ac adapter schematics diagram 3 phase dc converter afe circuit diagram igbt omap3530 GPMC NORFLASH klixon 8-S msp430F5438 usart examples ir remote control transmitter ABC T2 vsp6822 STB 2300 HD Streaming IP Set Top Box UCC28070
    Contextual Info: 2 Introduction and Table of Contents TI’s Solutions Cover the Entire Video Chain TI has been involved in the video market for more than 25 years. The steps in the video chain span everything from the creation of the original content to the final viewing


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    TTL pin outs

    Abstract: 30J341 CMOS TTL Logic Family Specifications BGA and QFP Package BITBLASTER footprint tqfp 208 v16 248 337 BGA footprint N12110 74 series pin outs
    Contextual Info: MAX 7000A Includes MAX 7000AE Programmable Logic Device Family September 1999, ver. 2.03 Data Sheet Features. • ■ Preliminary Information ■ ■ ■ ■ ■ f High-performance CMOS EEPROM-based programmable logic devices PLDs built on second-generation Multiple Array MatriX


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    7000AE EPM7128A EPM7256A 256-pin TTL pin outs 30J341 CMOS TTL Logic Family Specifications BGA and QFP Package BITBLASTER footprint tqfp 208 v16 248 337 BGA footprint N12110 74 series pin outs PDF

    C732B

    Abstract: 337 BGA 337 BGA footprint EPM7032AE EPM7064AE EPM7128A EPM7128AE EPM7256A EPM7256AE EPM7512AE
    Contextual Info: MAX 7000A Includes MAX 7000AE Programmable Logic Device Family August 2000, ver. 3.1 Data Sheet • Features. ■ ■ ■ ■ ■ ■ ■ f High-performance 3.3-V EEPROM-based programmable logic devices PLDs built on second-generation Multiple Array MatriX


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    7000AE JESD-71 EPM7128A EPM7256A 49-pin 169-pin C732B 337 BGA 337 BGA footprint EPM7032AE EPM7064AE EPM7128AE EPM7256AE EPM7512AE PDF

    AA10

    Abstract: AE10 AF10 AG10 AJ10 AK10 EP20K600C AF31
    Contextual Info: EP20K600C I/O Pin-Outs ver. 1.0 I/O & VREF Pad Number Bank Orientation Pin/Pad Function 652-Pin BGA 672-Pin FineLine BGA 1,020-Pin FineLine BGA 1 1 – – 1 1 1 – – 8 8 8 8 – – 8 8 8 8 8 – 8 8 8 8 8 – – 8 8 8 8 8 – 8 8 8 8 8 – – 8 8 8


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    EP20K600C 652-Pin 672-Pin 020-Pin AA10 AE10 AF10 AG10 AJ10 AK10 AF31 PDF

    t25 4 k8

    Abstract: 513 b14 337 BGA M4-T1 N10 398 w2 i 87 w30 160 AA10 BGA-F17 AF10
    Contextual Info: EP20K600E I/O Pins ver. 1.1 I/O & VREF Bank 1 1 – – 1 1 1 – – 8 8 8 8 – – 8 8 8 8 8 – 8 8 8 8 8 – – 8 8 8 8 8 – 8 8 8 8 8 – – 8 8 8 8 8 – 8 Pad Number Orientation 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26


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    EP20K600E 652-Pin t25 4 k8 513 b14 337 BGA M4-T1 N10 398 w2 i 87 w30 160 AA10 BGA-F17 AF10 PDF

    e200z3 PowerPC core Reference manual

    Abstract: 2620 dynamic ram program pwm simulink matlab code mpc5554 ebi mpc5561 NEXUS CONNECTOR MPC500 MPC5500 MPC5533 MPC5534
    Contextual Info: Freescale Semiconductor Product Brief Document Number: MPC5567PB Rev. 0, 11/2007 MPC5567 Microcontroller Product Brief Designed for engine management and high temperature industrial applications, the MPC5567 32-bit embedded controller is a device from Freescale Semiconductor’s


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    MPC5567PB MPC5567 32-bit MPC5500 MPC500 e200z3 PowerPC core Reference manual 2620 dynamic ram program pwm simulink matlab code mpc5554 ebi mpc5561 NEXUS CONNECTOR MPC500 MPC5533 MPC5534 PDF

    F33 1067

    Abstract: 1010 817 f15 AA10 AM11 AN10 EP20K1500C 837 B34 AM3 940
    Contextual Info: EP20K1500C I/O Pin-Outs ver. 1.0 I/O & VREF Bank Pad Number Orientation Pin/Pad Function 652-Pin BGA 1,020-Pin FineLine BGA 1 1 1 – 1 1 1 – – 1 1 1 1 – 8 8 8 8 – – 8 8 8 8 – 8 8 8 8 – – 8 8 8 8 – 8 8 8 8 – – 8 8 8 8 – 1 2 3 4 5 6


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    EP20K1500C 652-Pin 020-Pin F33 1067 1010 817 f15 AA10 AM11 AN10 837 B34 AM3 940 PDF

    5000VA

    Abstract: A09 N03 b20 p03 5256VA 5384VA 5512VA 234 N02 5384VA-70L T14 N03 283 g23
    Contextual Info: ispLSI 5384VA In-System Programmable 3.3V SuperWIDE High Density PLD — Superior Quality of Results — Tightly Integrated with Leading CAE Vendor Tools — Productivity Enhancing Timing Analyzer, Explore Tools, Timing Simulator and ispANALYZER™ — PC and UNIX Platforms


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    5384VA 5384VA-125LB208 208-Ball 5384VA-125LB272 272-Ball 5384VA-125LB388 388-Ball 5384VA-100LQ208 208-Pin 5384VA-100LB208 5000VA A09 N03 b20 p03 5256VA 5384VA 5512VA 234 N02 5384VA-70L T14 N03 283 g23 PDF

    verilog code for UART with BIST capability

    Abstract: VHDL CODE FOR HDLC controller ARM dual port SRAM compiler DesignWare SPI vhdl code for watchdog timer of ATM vhdl coding for analog to digital converter Sun Enterprise 250 static SRAM single-port verilog code for 16 bit risc processor verilog code arm processor
    Contextual Info: GS30 0.15-µm CMOS Standard Cell/Gate Array Version 0.2 May 16, 2000 Copyright  Texas Instruments Incorporated, 2000 The information and/or drawings set forth in this document and all rights in and to inventions disclosed herein and patents which might be granted thereon disclosing or employing the


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    K366E

    Abstract: N8223N ael 322 ATF1502AE ATF1504AE ATF1508AE ATF1516AE ATF1532AE ATF1504AE-4AC100 306T
    Contextual Info: Features • 2nd Generation EE Complex Programmable Logic Devices • • • • • • • • • • – 3.0V to 3.6V Operating Range with 5V Tolerant I/Os – 32 - 512 Macrocells with Enhanced Features – Pin-compatible with Industry-standard Devices


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    2398E 12/01/0M K366E N8223N ael 322 ATF1502AE ATF1504AE ATF1508AE ATF1516AE ATF1532AE ATF1504AE-4AC100 306T PDF