BA02 Search Results

Contextual Info: 5 3 4 1 2 Global Connector Technology Ltd. - BA025: 0.5mm PITCH BOARD TO BOARD SOCKET, DUAL ROW, SURFACE MOUNT, VERTICAL 6 7 8 A A B C D E L S B N A G T I I S U E S D T O W N NE R GC O F B C D C E E Ordering Grid BA025 A XXX 1 B Packing Options B = Tape and Reel with Cap

D4E180-BA02-25

Abstract: centrifugal blowers dual d4e18
Contextual Info: AC Centrifugal Blowers Dual Inlet, Ø180mm ebm-papst Mulfingen Current Draw Noise Perm. Amb. Temp. Mass D4E180-BA02-25 Power Input Part Number Speed/rpm Nominal Data W A DB A ºC kg 1300 1360 360 460 1.58 2.02 65 66 65 11 Air Flow • • Frequency • Voltage

555i

Contextual Info: OP T O TECHNOLOGY EÖE INC D ba02245 0G00CH4 1 = V/-73 OPTO TECHNOLOGY TYPE OTS 250 OTS 255 r .:• c '- j ! OP-TEC" 0TS255 OPTICAL SWITCH W/.060 APERTURE NOT ACTU AL SIZE DESCRIPTION Non-contact switching is provided by Opto Technology’s OTS 250/OTS 255

Contextual Info: 3 1 2 4 Global Connector Technology Ltd. - BA020: 0.5mm PITCH BOARD TO BOARD PLUG, DUAL ROW, SURFACE MOUNT, VERTICAL 5 6 7 8 A A B B C C D D C E E Ordering Grid BA020 F No. of Contacts 10 to 50, 60, 80, 90, 100, 120 SPECIFICATIONS 规格: G CURRENT RATING 电流额定值 : 0.5 AMP AC/DC

Contextual Info: 5 1 2 3 4 Global Connector Technology Ltd. - BA025: 0.5mm PITCH BOARD TO BOARD SOCKET, DUAL ROW, SURFACE MOUNT, VERTICAL 6 7 8 A A B B C C D D C E E Ordering Grid BA025 A XXX 1 B Packing Options B = Tape and Reel with Cap F No. of Contacts 10 to 50, 60, 80,

Contextual Info: 1 2 3 4 Global Connector Technology Ltd. - BA020: 0.5mm PITCH BOARD TO BOARD PLUG, DUAL ROW, SURFACE MOUNT, VERTICAL 5 6 7 8 A A B C D E L S B N A G T I I S U E S D T O W N NE R GC O F B C D C E E Ordering Grid BA020 F SPECIFICATIONS 规格: G No. of Contacts

Optotek

Abstract: OTL-573 6802662
Contextual Info: OPTOTEK LIMITED ~03 DÌf|bfl[]2bbE Q 0 D D 0 0 1 ^ "|~ 03E 00001 D 6802662 OPTOTEK LIMITED O p to te k T-V/-J7 OTL-573 8 BIT DIGITAL STATUS INDICATOR An 8 element LED Display with integral drive electronics to provide direct indication of logic states. Package Outline

IS46TR

Abstract: IS43TR82560A DDR3 DRAM 2GB 128Mx16 96BALL FBGA "2Gb DDR3 SDRAM"
Contextual Info: IS43/46TR16128A/AL, IS43/46TR82560A/AL 256Mx8, 128Mx16 2Gb DDR3 SDRAM ADVANCED INFORMATION MAY 2012 FEATURES • Standard Voltage: VDD and VDDQ = 1.5V ± 0.075V  Low Voltage L : VDD and VDDQ = 1.35V + 0.1V, -0.067V        

K d998 transistor

Abstract: lz 02 1068 D844 voltage regulator
Contextual Info: OMAP5912 Applications Processor Data Manual Literature Number: SPRS231E December 2003 − Revised December 2005 PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include

Contextual Info: W632GU6KB 16M  8 BANKS  16 BIT DDR3L SDRAM Table of Contents1. GENERAL DESCRIPTION . 5 2. FEATURES . 5

Contextual Info: W631GU6KB 8M  8 BANKS  16 BIT DDR3L SDRAM Table of Contents1. GENERAL DESCRIPTION . 5 2. FEATURES . 5

mvb bus schematics

Abstract: mc88000 DSP56001 users manual IC 7492 real time application and product for fir 32 bit carry select adder code 74 hc 589 DSP96002 fft D1 PGA 478 DSP96002
Contextual Info: DSP96002 32-BIT DIGITAL SIGNAL PROCESSOR USER’S MANUAL Motorola, Inc. Semiconductor Products Sector DSP Division 6501 William Cannon Drive, West Austin, Texas 78735-8598 SECTION 1 DSP96002 INTRODUCTION This manual describes the first member of a family of dual-port IEEE floating point programmable CMOS

W631GG6KB-12

Abstract: W631GG6KB-15 W631GG6KB15A DDR3 DIMM SPD JEDEC 24si 9x13 W631GG6KB15K w631gg6k W631GG6KB12I W631GG6KB-15I
Contextual Info: W631GG6KB 8M  8 BANKS  16 BIT DDR3 SDRAM Table of Contents1. GENERAL DESCRIPTION . 5 2. FEATURES . 5

Contextual Info: T O S H IB A TMPZ84C711A ISDN BASIC RATE INTERFACE CONTROLLER OVERVIEW The LSI chip set for the ISDN basic rate interface supplies the layer 3 protocol control , layer 2 and layer 1 control functions which are part of the basic rate interface (2B + D) call control functions for ISDN terminals.

W632GG6KB

Abstract: W632GG6KB15I
Contextual Info: W632GG6KB 16M  8 BANKS  16 BIT DDR3 SDRAM Table of Contents1. GENERAL DESCRIPTION . 5 2. FEATURES . 5

W3J512M32G

Abstract: M41K256M32
Contextual Info: W3J512M32G-XBX W3J512M32G T -XB2X W3J512M36/40G(T)-XB3X *PRELIMINARY 2GB – 512M x 32/36/40 DDR3 SDRAM 1.5V – 136/204 PBGA Multi-Chip Package FEATURES BENEFITS  DDR3 Data Rate = 800, 1,066, 1333 Mb/s  74% Space savings vs. FBGA  Packages:

Contextual Info: W3J512M64K-XPBX W3J512M64K-XLBX *ADVANCED 4GB – 512M x 64 DDR3 SDRAM 1.35V – 543 PBGA Multi-Chip Package FEATURES  Address/control terminations included  DDR3 Data Rate = 800, 1,066, 1333, 1600* Mb/s  Differential clock terminations included

Contextual Info: W3H264M16E-XBX ADVANCED* 256MB – 2 x 64M x 16 DDR2 SDRAM 79 PBGA FEATURES BENEFITS  Data rate = 400 Mb/s, 533 Mb/s, 667 Mb/s*  Larger ball pitch for higher reliability  Package:  Footprint compatible with W3H64M16E • 79 Plastic Ball Grid Array PBGA , 11 x 14mm

DNU-A13

Contextual Info: W3H64M16E-XBX 128MB – 64M x 16 DDR2 SDRAM 79 PBGA FEATURES BENEFITS  Data rate = 400 Mb/s, 533 Mb/s  Larger ball pitch for higher reliability  Package:  Pinout compatible with 2-Rank Version • 79 Plastic Ball Grid Array PBGA , 11 x 14mm

M41K256M32

Contextual Info: W3J512M32K-XBX W3J512M36K T -XB2X W3J512M36/40K(T)-XB3X *PRELIMINARY 2GB – 512M x 32/36/40 DDR3 SDRAM 1.35V – 136/204 PBGA Multi-Chip Package FEATURES BENEFITS  DDR3 Data Rate = 800, 1,066, 1333 Mb/s  74% Space savings vs. FBGA  Packages:

Contextual Info: W3J512M64G-XPBX W3J512M64G-XLBX 4GB – 512M x 64 DDR3 SDRAM – 1.5V – 543 PBGA Multi-Chip Package FEATURES  Address/control terminations included  DDR3 Data Rate = 800, 1066, 1333, 1600* Mb/s  Differential clock terminations included

Contextual Info: W3J512M64G-XPBX W3J512M64G-XLBX 4GB – 512M x 64 DDR3 SDRAM – 1.5V – 543 PBGA Multi-Chip Package FEATURES  Address/control terminations included  DDR3 Data Rate = 800, 1066, 1333, 1600* Mb/s  Differential clock terminations included

w3j128m72

Abstract: w3j512m72
Contextual Info: W3J512M72G-XPBX W3J512M72G-XLBX 4GB – 512M x 72 DDR3 SDRAM – 1.5V – 543 PBGA Multi-Chip Package FEATURES  Address/control terminations included  DDR3 Data Rate = 800, 1066, 1333, 1600* Mb/s  Differential clock terminations included

Contextual Info: W3J128M72K-XLBX W3J128M72K-XPBX *ADVANCED 1GB – 128M x 72 DDR3 SDRAM – 1.35V – 375 PBGA Multi-Chip Package FEATURES BENEFITS  DDR3 Data Rate = 800; 1,066; 1,333; 1,600* Mb/s  35%* Space savings vs. FBGA  Packages:  Reduced part count