B644 Search Results

BL-B6441

Contextual Info: BRIGHT LED ELECTRONICS CORP. BL-B6441Q-LRK-FP6-TBF22A SINCE 1981 ● Features: ● Package dimensions: 1. Chip material: AlGaAs/GaAs 3.1 .122 2. Emitted color : Super Red 3. Lens Appearance : Light Red Trans 1.30(.051) 4.80(.189) 4. Low power consumption.

Contextual Info: PR ELIM IN A R Y DATA SH EET NEC / MOS INTEGRATED CIRCUIT MC-B644 8 M-WORO BY 64-BIT SYNCHRONOUS DYNAMIC RAM MODULE UNBUFFERED TYPE Description The M C -458C B644 is a 8,388,608 words by 64 bits synchronous dynamic R A M module on which 8 pieces of 64 M

cma 10005

Abstract: wn 5461 C458C MC-458CB644
Contextual Info: DATA SHEET_ MOS INTEGRATED CIRCUIT MC-B644 8M-WORD BY 64-BIT SYNCHRONOUS DYNAMIC RAM MODULE UNBUFFERED TYPE Description The MC-B644 is a 8,388,608 words by 64 bits synchronous dynamic RAM module on which 8 pieces of 64M

PEC 4179 DIODE

Abstract: 327879-001US
Contextual Info: Intel Communications Chipset 89xx Series Datasheet October 2012 Order Number: 327879-001US INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS

TSC695f user

Abstract: sparc v7 ERC32 TSC695 TSC695F
Contextual Info: Rad. Hard 32-bit SPARC Embedded Processor User Guide Table of Contents Section 1 Features. 1-1 1.1 1.2 1.3 1.4 Description .1-2

99-213UMC

Abstract: 1A01 B643
Contextual Info: Technical Data Sheet Side View LEDs Height 0.8mm 99-213UMC/XXXXXXX/TR8 Features z z z z z z z Side view white LED. White SMT package. Lead frame package with individual 2 pins. Wide viewing angle. Soldering methods: IR reflow soldering. Pb-free. The product itself will remain within RoHS

A538f

Contextual Info: 123234567898ABCD426EEEEEEF426EEEEEE 123234567898ABCD426EEEEEEF426EEEEEEF 123456789AB8CDEF E 6  8B8 66 RoHS 1324F 111AA 12342562789AB9 B CCCDE2FE25FDF5 서식번호 : SSC- QP- 7- 07- 12 Rev.00 123234567898ABCD426EEEEEEF426EEEEEE

LT829

Abstract: 8085A intel 8080 MCS intel 8295 8041A 8080
Contextual Info: m i e i APPLICATION NOTES AP-90 M ay 1980 An 8741 A/8041 A Digital Cassette Controller I Contents IN T R O D U C T IO N . 1 T H E C M -6 0 0 M IN I- D E K " .

b617

Abstract: b649 b605 transistor b647 B647 b649 transistor transistor b647 bb pressure sensor circuit transistor B633 b63e
Contextual Info: Signal Acquisition and Conditioning With Low Supply Voltages SLAA018 August 1997 Printed on Recycled Paper IMPORTANT NOTICE Texas Instruments TI reserves the right to make changes to its products or to discontinue any semiconductor product or service without notice, and advises its customers to obtain the latest version of relevant information

Contextual Info: 2 3 5 4 Kontaktanordnung contact arrangement L o c h b i Id board drillings i_ n a11e L o c h e r all holes ii 01 0 0 ,0 5 ± 0,1 i_ n 16 — C sl i_ n x OsJ CVJ i_ n Pos i t i on position 3 I O sJ W 5 9 7 I 11 I 13 48 S i g n a l K o n t a k t e 4 8 signal contacts

2SD400

Abstract: 2SB544
Contextual Info: Ordering number:EN 199J SA\YO N0.199J 2 : 2SB544 A bsolute M axim um R atings at Ta = 25c'C Collector to Base Voltage Vcbo Collector to Em itter Voltage VcEo Em itter to Base Voltage VEBO Collector Current

842 317 SO8

Contextual Info: Intel Communications Chipset 89xx Series Datasheet June 2013 Order Number: 327879-002US INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS

burndy Y750

Abstract: burndy Y35 Burndy Y35 hypress IEEE-837 burndy* YA Lug Burndy burndy Y39 STR 5634 kpb 1313 B455 E20
Contextual Info: BURNDY Grounding TABLE OF CONTENTS HYGROUND® IRREVERSIBLE COMPRESSION GROUNDING AND INSTALLATION TOOLING ® HYGROUND Features Type YGIB . . . . . . . . . . E-20 - E-21 and Benefits . . . . . . . . . E-5 - E-6 E-1 Type YGL-C . . . . . . . . . . . . . . . . E-7

Burndy PAT750-18V parts breakdown

Abstract: BURN GI CONDUIT lp 1610 for door bell Burndy Y35 hypress parts breakdown ci an 7591 NEC c317 KPC 45 94V SAE-AS7928 burndy Y35 Hypress owner manual burndy patriot pat750-18v replacement parts
Contextual Info: Master Catalog Solutions for the Electrical Industry Experience. Technology. Answers. TM Customer Service Department 7 Aviation Park Drive Londonderry, NH 03053 1-800-346-4175 1-603-647-5299 International Canada 1-800-361-6975 (Quebec) 1-800-387-6487 (All other provinces)

Contextual Info: 123234567898ABCD426EEEEEEF426EEEEEE 123234567898ABCD426EEEEEEF426EEEEEEF 123456789AB8CDEF E 6  8B8 66 RoHS 1324F 111AA 12342562789AB9 B CCCDE2FE25FDF5 서식번호 : SSC- QP- 7- 07- 12 Rev.00 123234567898ABCD426EEEEEEF426EEEEEE

3365bq

Abstract: SI336
Contextual Info: Si Photodiodes Type No. iDimensional I Outline Package P.40-44 / Window Material* (mm) (UV to IR Range, for Precision Photometry) Active Effective Spectral Area Size Active Response Area Range Peak Sensitivity Wavelength Ap (mm2) (nm) (nm) (mm) Photo Sensitivity S (A/W)

transistor b605

Abstract: b668 transistor b647 B605 B644 B647 microcontroller 8501 transistor b648 transistor b643 B647 transistor
Contextual Info: AN609 Interfacing Microchip Serial EEPROMs to Motorola 68HC11 Microcontroller Author: For Microchip 2-wire devices 24CXXA, 24LCXX, 24LCXXB, 24AAXX devices, excluding 24XX32 and 24XX65 devices , there are three programs to perform some of the basic communication functions.

si8594

Abstract: MAS 10 RCD programming U64D
Contextual Info: O rder this docum ent by 3VEDO U64D/D MOTOROLA SEMICONDUCTOR TECHNICAL DATA 1,2, 4M D R A M D u al-ln -L in e M em ory M odule D IM M 64 3.3 V, EDO, Unbuffered 1M x 64 (8M B), 2M x 64 (16M B) 1 6 8 -L E A D DIMM CASE 1115C-01 BACK FRO NT 8 ,1 6 , and 32 Megabyte

2SD618

Abstract: MOTHERBOARD INTEL G31 ICH7 SCHEMATIC DIAGRAM BC615 DIODE 20B2 samsung u252 20b1 diode TP-107-02 SAMSUNG R60 plus S3F94 SLB9635TT1.2
Contextual Info: 4 3 2 1 SAMSUNG PROPRIETARY THIS DOCUMENT CONTAINS CONFIDENTIAL PROPRIETARY INFORMATION THAT IS SAMSUNG ELECTRONICS CO’S PROPERTY. DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS EXCEPT AS AUTHORIZED BY SAMSUNG. Table of Contents SEDONA_plus Sheet 1. COVER Sheet 2 - 7. DIAGRAM Block/Power & ANNOTATIONS

transistor b605

Abstract: B60100 B605 b643 b643 R microcontroller 8501 b631 transistor transistor B633 b647 68HC11 download
Contextual Info: AN609 Interfacing Microchip Serial EEPROMs to Motorola 68HC11 Microcontroller Author: For Microchip 2-wire devices 24CXXA, 24LCXX, 24LCXXB, 24AAXX devices, excluding 24XX32 and 24XX65 devices , there are three programs to perform some of the basic communication functions.

sRAM 2116

Abstract: 2116 ram
Contextual Info: QS86444, Q QS86449 High-Speed CMOS 64KX4 SRAM with Separate I/O Q S86444 advance in f o r m a t io n FEATURES/BENEFITS • • • • • High Speed Access and Cycle times 15ns/20ns/25ns Commercial 20ns/25ns/35ns Military TTL compatible I/O Low Standby current

everlight 99-216

Abstract: 99-216UMC 2b52 b54b a04L
Contextual Info: Technical Data Sheet Side View LEDs Height 0.6mm 99-216UMC/XXXXXXX/TR8 Features ․Side view white LED ․White SMT package ․Lead frame package with individual 2 pins ․Wide viewing angle ․Soldering methods: IR reflow soldering ․Pb-free ․The product itself will remain within RoHS compliant version.

DHT11

Abstract: BC417143 HM-10 BC417143* commands
Contextual Info: HM Bluetooth module datasheet Condemn the copycat company copied behavior on HM-10!!!!!! If you buy a fake, please apply for a refund guarantee your legitimate rights and interests -Last Version V527 2014-04-12

everlight 50-215

Abstract: B5440
Contextual Info: Technical Data Sheet Side View LEDs Height 1.4mm 50-215UJC/XXXXXXX/TR8 Features ․Side view white LED ․White SMT package ․Lead frame package with individual 2 pins ․Wide viewing angle ․Soldering methods: IR reflow soldering ․Pb-free ․The product itself will remain within RoHS