AW7 DIODE Search Results

XQR5VFX130

Abstract: CF1752 XQR5V DIODE BA40 BA5 marking AJ-42 diode Aa42 FF1738 AJ3125 FP1760
Contextual Info: Virtex-5QV FPGA Packaging and Pinout Advance Specification Second Quarter 2009 [optional] UG520 v1.1 September 22, 2010 UG520 (v1.1) September 22, 2010 [optional] Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development

M8260

Abstract: Marking W36 AG34 Frequency detector 31n w6 marking w35 W39 marking AP36
Contextual Info: Hardware Design Guide July 2002 TFEC0410G 2.5/10 Gbits/s Optical Networking Interface with Strong/Weak FEC and Digital Wrapper 1 Document Organization This document is primarily intended for designers and engineers whom require I/O characteristics for board

diode ak38

Abstract: AJ33 AJ34 AJ35 AJ36 AJ37 AJ38 AJ39 AJ40 AJ41 AJ42 ag33 diode DIODE BA40 AB-39 ag37 AG40 AB30 F1517 FF1760
Contextual Info: Pin Information for the Stratix IV GX EP4SGX530 Device Version 1.4 Bank Number 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1C 1C 1C 1C

power supply aps 231

Abstract: au16 tean t1 94 v 0 k1k2 l6 DIN-104 diode ak38 bd l39 G39 T30 motorola STS-192 TDCS4810G
Contextual Info: Advance Data Sheet May 2001 TDCS4810G SONET/SDH 10 Gbits/s APS Port and TSI Features • ■ ■ ■ ■ ■ ■ ■ ■ ■ 10 Gbit bidirectional data path with common frame synchronization and clocking. Versatile IC which supports an aggregate bandwidth of 30 Gbits/s.

diode ak38

Abstract: ae38 AR-23 AH36 9B101
Contextual Info: Advance Data Sheet May 2001 TDCS6440G SONET/SDH 40 Gbits/s Cross Connect Features • ■ ■ ■ ■ ■ ■ ■ ■ Versatile IC which supports an aggregate bandwidth of 40 Gbits/s. Cross Connect Support for line/path switching. ■ Supports up to 768 STS-1 time slots.

diode ak38

Abstract: F1517 AK39 s av36 aw7 diode
Contextual Info: Pin Information for the Stratix IV GT EP4S100G5ES1 Device Version 1.2 Notes 1 , (2), (3), (4) WARNING: For ES1 silicon only Bank Number VREF 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A

intel g31 chipset motherboard

Abstract: FCBGA 956 pin intel 945 90 nm CMOS DIODE AJ13 MOBILE PLATFORM 2008 POWER MANAGEMENT solution for auto shut down of P4 motherboard ST BB6 A110 945GU
Contextual Info: Intel Processor A100 and A110 on 90 nm Process with 512-KB L2 Cache Datasheet January 2008 Document Number: 316908-002 IINFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS

WPCE773LA0DG

Abstract: gfx E3 diode ST330U2D5VDM-13GP GP 823* DIODE 2gp Transistor GFX DIODE 4gp transistor intel g41 crb jm41 TPS51125
Contextual Info: 5 4 3 CLK GEN. 36 TPS51125 INPUTS OUTPUTS 5V_S5 6A 3D3V_S5(5A) DCBATOUT 5V_AUX_S5 PCB STACKUP 3D3V_AUX_S5 Thermal Sensor TOP L1 S L2 VCC/GND 32 EMC2103 3 L3 S L4 D 37 RT8202 SMSC Penryn SFF ICS9LPRS365B 1 SYSTEM DC/DC Project code: 91.4CQ01.001 PCB P/N : 48.4CQ01.0SA

MEC1308-NU

Abstract: ASM1442 R5538 RTL8103 32 inch TV samsung lcd Schematic slb9635 SMD DIODE AA45 data sc472 SC454 BA41-01
Contextual Info: 4 3 2 1 SAMSUNG PROPRIETARY THIS DOCUMENT CONTAINS CONFIDENTIAL PROPRIETARY INFORMATION THAT IS SAMSUNG ELECTRONICS CO’S PROPERTY. DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS EXCEPT AS AUTHORIZED BY SAMSUNG. Table of Contents D Stanford_14/15 C CPU : Chip Set :

CQ12B

Abstract: EP4SE530 DIODE BA40 f1517 H1152 DQS30B AL-36 ag33 diode diode ak38 AL34
Contextual Info: Pin Information for the Stratix IV E EP4SE530 Device Version 1.1 Bank Number 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1B 1B 1B 1B

WPCE773LA0DG

Abstract: G5285T11U-GP ICS9LPRS365B g31 crb WPCE773LA intel g41 crb Realtek ALC269Q High Definition Audio g41 crb WPCE773LA0DG, ALC269 diode af52
Contextual Info: 5 4 3 JM41 Block Diagram Intel D CLK GEN. 1 Project code: 91.4CQ01.001 PCB P/N : 48.4CQ01.011 REVISION : 08266-1 SYSTEM DC/DC 36 TPS51125 INPUTS OUTPUTS 5V_S5 6A 3D3V_S5(5A) DCBATOUT 5V_AUX_S5 PCB STACKUP 3D3V_AUX_S5 Thermal Sensor CPU TOP L1 S L2 32 EMC2103

WPCE773LA0DG

Abstract: TPS51125 Atheros AR8131 WISTRON power sequence RT8202 Realtek ALC269Q High Definition Audio NDS0610-NL-GP X-14D31818M-35GP Wistron Corporation winbond wpce773la0dg
Contextual Info: 5 4 3 JM41 Block Diagram Intel D CLK GEN. 1 SYSTEM DC/DC Project code: 91.4CQ01.001 PCB P/N : 48.4CQ01.0SA REVISION : 08266-SA 36 TPS51125 INPUTS OUTPUTS 5V_S5 6A 3D3V_S5(5A) DCBATOUT 5V_AUX_S5 PCB STACKUP 3D3V_AUX_S5 Thermal Sensor CPU TOP L1 S L2 32 EMC2103

RT8152B

Abstract: rt8152 G995P1U 95A hall effect sensor UP6111AQDD RT9025 ic AH44 95A sensor hall VSS210 Atheros ar9
Contextual Info: 1 2 3 PCB STACK UP 4 5 6 7 8 BU3 Block Diagram LAYER 1 : TOP LAYER 2 : GND1 LAYER 3 : IN1 A LAYER 4 : GND PENRYN-SFF LAYER 5 : VCC 478P uFCPGA LAYER 6 : IN2 A P3,4 FSB LAYER 7 : GND2 FSB 667/800/1066MHZ DDR SYSTEM MEMORY LAYER 8 : BOT DDRIII-SODIMM1 DDRIII-SODIMM2

Contextual Info: Pin Information for the Stratix IV E EP4SE530 Device Version 1.2 Bank Number 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1B 1B 1B 1B

AA30

Abstract: EP2S180 HC240
Contextual Info: Pin Information for HardCopy II HC240 / Stratix® II EP2S180 F1508 Companion Devices Version 1.1 Bank Number VREF Group Pin Name/Function B2 B2 B2 B2 B2 B2 B2 B2 B2 B2 B2 B2 B2 B2 B2 B2 B2 B2 B2 B2 B2 B2 B2 B2 B2 B2 B2 B2 B2 B2 B2 B2 VCCD_PLL7 VCCA_PLL7

diode T25-4

Abstract: T25-4 L9 K363 equivalent T25-4 d92 02 ad254 AF514 A241 AF125 AN214
Contextual Info: Virtex -E 1.8 V Field Programmable Gate Arrays R DS022-4 v2.5 March 14, 2003 Production Product Specification Virtex-E Pin Definitions Pin Name Dedicated Pin Direction GCK0, GCK1, GCK2, GCK3 Yes Input Clock input pins that connect to Global Clock Buffers.

XCV1000E

Abstract: AH273 AF245 diode t25 4 d9 D2641 T25-4 L9 ae3219 DS0224 t2943 T25 4 F8
Contextual Info: Virtex -E 1.8 V Field Programmable Gate Arrays R DS022-4 v2.3 November 15, 2001 Preliminary Product Specification Virtex-E Pin Definitions Pin Name Dedicated Pin Direction GCK0, GCK1, GCK2, GCK3 Yes Input Clock input pins that connect to Global Clock Buffers.

rt8152

Abstract: WPCE775CA0DG UP6111AQDD TPS51116REGR ME2N7002E ah44 hall 4506 gen WPCE775 RT8152B SLG8
Contextual Info: 1 2 3 PCB STACK UP 4 5 6 7 8 BU3 Block Diagram LAYER 1 : TOP LAYER 2 : GND1 LAYER 3 : IN1 A LAYER 4 : GND PENRYN-SFF LAYER 5 : VCC 478P uFCPGA LAYER 6 : IN2 A P3,4 FSB LAYER 7 : GND2 FSB 667/800/1066MHZ DDR SYSTEM MEMORY LAYER 8 : BOT DDRIII-SODIMM1 DDRIII-SODIMM2

AJ33 AJ34 AJ35 AJ36 AJ37 AJ38 AJ39 AJ40 AJ41 AJ42

Abstract: BD37 g-15 EP4S100G5
Contextual Info: Pin Information for the Stratix IV GT EP4S100G5 Device Version 1.1 Note 1 Bank Number 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1C 1C 1C VREF VREFB1AN0

DIODE BA40

Abstract: f1517 QS44 CQ33B H1152 AC22 AF39 AJ33 AJ34 AJ35 AJ36 AJ37 AJ38 AJ39 AJ40 AJ41 AJ42
Contextual Info: Pin Information for the Stratix III EP3SL340 Device Version 1.1 Bank Number 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1B 1B 1B 1B 1B 1B 1B 1B 1B 1B

32 inch TV samsung lcd Schematic

Abstract: MEC1308-NU ASM1442 samsung lcd tv power supply schematic cantiga schematic diagram crt tv samsung ba41-01 schematic Samsung TV led backlight R5538 32 inch TV samsung led Schematic
Contextual Info: - 이 문서는 삼성전자의 기술 자산으로 승인자만이 사용할 수 있습니다 - This Document can not be used without Samsung's authorization - 8. Block Diagram and Schematic D C B A 4 SAMSUNG PROPRIETARY THIS DOCUMENT CONTAINS CONFIDENTIAL

WPCE773LA0DG

Abstract: WISTRON power sequence intel g41 crb winbond wpce773la0dg Realtek ALC269Q High Definition Audio transistor BC33 g31 crb diode AH44 transistor bc47 TRANSISTOR BL41
Contextual Info: 5 4 3 2 1 Project code: 91.4CQ01.001 PCB P/N : 48.4CQ01.021 REVISION : 08266-2 JM41/JM51 UMA Block Diagram SYSTEM DC/DC 36 TPS51125 INPUTS OUTPUTS 5V_S5 6A 3D3V_S5(5A) DCBATOUT 5V_AUX_S5 PCB STACKUP D D 3D3V_AUX_S5 Thermal Sensor Intel CPU CLK GEN. L1 S L2

EP4SE820

Abstract: diode Aa42 CQ35B FD3055 DIODE BA40 H1152 AJ33 AJ34 AJ35 AJ36 AJ37 AJ38 AJ39 AJ40 AJ41 AJ42 ad40 diode 1B 1B Y23 DQS35B/CQ35B
Contextual Info: Pin Information for the Stratix IV E EP4SE820 Device Version 1.0 Bank Number 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1A 1B 1B 1B 1B

WPCE775LA0DG

Abstract: RT8206B RT8207A winbond wpce775 wpce775la winbond wpce775la0dg ALC269X alcor au6433 IC WPCE775LA0DG WPCE775 AU-6433
Contextual Info: 5 4 3 2 1 JM11_MS ZH7 BLOCK DIAGRAM PCB STACK UP 8L HDI XTAL Y2 14.318MHZ LAYER 1 : TOP LAYER 2 : GND LAYER 3 : IN1 LAYER 4 : VCC LAYER 5 : IN2 LAYER 6 : IN3 LAYER 7 : GND LAYER 8 : BOT D POWER SYSTEM 5V/3V RT8206B P24 CLOCK CK505 (QFN-64) PG2 FAN & THERMAL