AE51 Search Results

60465

Abstract: AE51 smd mmic transistor E5 AE514 60465A 702 smd 37dBmV
Contextual Info: AE514 Preliminary E-pHEMT MMIC Product Features Application 0B 1B • Small size • Higher Gain • Higher linearity • SOIC-8 SMD Type package • Higher productivity • Lower manufacturing cost • -70dBc CSO 79 Channels @ +39dBmV/ch • -63dBc CTB 79 Channels @ +39dBmV/ch

AE512

Abstract: AE312 mmic transistor E5 smd mmic transistor E5
Contextual Info: E-pHEMT MMIC AE512 Preliminary Product Features Application • Small size • 30MHz-2150MHz • Higher Gain • Higher linearity • SOIC-8 SMD Type package • Higher productivity • Lower manufacturing cost • Low Noise Figure • -65dBc CSO 79 Channels @ +30dBmV/ch

Contextual Info: 6235 POWER INDUCTORS Outgassing Compliant Power Inductors AE512PJB • High temperature materials allow operation in ambient temperatures up to 155°C. ■ Passes NASA low outgassing specifications ■ Special construction allows it to pass vibration testing to

AE512PYA

Contextual Info: 6030 POWER INDUCTORS Outgassing Compliant Power Inductors AE512PYA • High temperature materials allow operation in ambient temperatures up to 155°C ■ Passes NASA low outgassing specifications ■ Tin-lead Sn-Pb termination for the best possible board

EMTS Intel core i7

Abstract: AE61 AE76 core t1400 AE82 T2300E AE44 cpu T2400 AE80 Marking AE57
Contextual Info: Intel CoreTM Duo Processor and Intel® CoreTM Solo Processor on 65 nm Process Specification Update June 2009 Revision 020 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT

g41 motherboard repair

Abstract: TOM - 2088 - BH AF 82801 IBM TOM 2088 BH gm45 intel intel chipset g33 motherboard repair 2088 rgb matrix 320123 laptop lcd cable 30 pin diagram intel g31 motherboard repair
Contextual Info: Mobile Intel 4 Series Express Chipset Family Datasheet August 2008 Document Number: 320122-002 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS

lenovo

Abstract: TP8370 TP8107 TP8117 TP8111 C9041 C9045 TP8116 lenovo t42 TP8109
Contextual Info: A B C D E F G H I J K L M N O DC-IN PAGE 75 9 9 ITP CONNECTOR PAGE 6 CLK GEN Merom SFF PAGE 3,4,5 THERMAL SENSEER 8 VCC3_EC/VCC5M TI51220 PAGE 19 ICS954309 PAGE 81 AGTL+ FSB 800/667MHz 4X Data 2X Address PAGE 69 1R25AMT (BD3508) PAGE 88 LVDS SO-DIMM DRAM

SLB9635TT12

Abstract: SLB9635TT1.2 32 inch TV samsung lcd Schematic fairchild diode smd code aa35 SC454 slb9635 BA41-00905A 20B3 diode BA09-00009A B503 F
Contextual Info: SENS X360 A B C D 4 SAMSUNG PROPRIETARY 3 4 HJ KIM Jun PARK T.R. Date 3 JS EUH APPROVAL : Dev. Step Revision CHECK BA41-00906A GCE : PR/MP : 1.1 DRAW Page. Page. Page. Page. Page. Page. Page. Page. Page. Page. Page. Page. Page. Page. Page. Page. Page. Page.

WPCE773LA0DG

Abstract: G5285T11U-GP ICS9LPRS365B g31 crb WPCE773LA intel g41 crb Realtek ALC269Q High Definition Audio g41 crb WPCE773LA0DG, ALC269 diode af52
Contextual Info: 5 4 3 JM41 Block Diagram Intel D CLK GEN. 1 Project code: 91.4CQ01.001 PCB P/N : 48.4CQ01.011 REVISION : 08266-1 SYSTEM DC/DC 36 TPS51125 INPUTS OUTPUTS 5V_S5 6A 3D3V_S5(5A) DCBATOUT 5V_AUX_S5 PCB STACKUP 3D3V_AUX_S5 Thermal Sensor CPU TOP L1 S L2 32 EMC2103

WPCE773LA0DG

Abstract: WISTRON power sequence intel g41 crb winbond wpce773la0dg Realtek ALC269Q High Definition Audio transistor BC33 g31 crb diode AH44 transistor bc47 TRANSISTOR BL41
Contextual Info: 5 4 3 2 1 Project code: 91.4CQ01.001 PCB P/N : 48.4CQ01.021 REVISION : 08266-2 JM41/JM51 UMA Block Diagram SYSTEM DC/DC 36 TPS51125 INPUTS OUTPUTS 5V_S5 6A 3D3V_S5(5A) DCBATOUT 5V_AUX_S5 PCB STACKUP D D 3D3V_AUX_S5 Thermal Sensor Intel CPU CLK GEN. L1 S L2

WPCE773LA0DG

Abstract: TPS51125 Atheros AR8131 WISTRON power sequence RT8202 Realtek ALC269Q High Definition Audio NDS0610-NL-GP X-14D31818M-35GP Wistron Corporation winbond wpce773la0dg
Contextual Info: 5 4 3 JM41 Block Diagram Intel D CLK GEN. 1 SYSTEM DC/DC Project code: 91.4CQ01.001 PCB P/N : 48.4CQ01.0SA REVISION : 08266-SA 36 TPS51125 INPUTS OUTPUTS 5V_S5 6A 3D3V_S5(5A) DCBATOUT 5V_AUX_S5 PCB STACKUP 3D3V_AUX_S5 Thermal Sensor CPU TOP L1 S L2 32 EMC2103

PS8101T

Abstract: J3303 j3305 AR8121 P2003EVG ASM1442T AU-6433 RT8206 AR8131 UP7711U8
Contextual Info: 5 D 4 3 Penryn SFF BLOCK DIAGRAM ULV 2 CPU DUAL CORE: SU9400 1.4 GHz SU9300 1.3 GHz SINGLE CORE: SU3300 1.2GHz 1 CLOCK GENERATOR FAN & THERMAL SENSOR D 956 uFCBGA FSB 800MHz LVDS DDR2 667 GS45 Express CRT ON BOARD DDR2 2Gb X 8 HDMI LEVEL SHIFTER Parade PS8101T

RTM875T-336

Abstract: J6801 J6806 Q4819 M51VA 8796G IT8502 RTM875T c2335 r RT8206
Contextual Info: 5 4 3 2 UX50 CLOCK GENERATOR RTM875T-336 Penryn SFF D 1 FAN & THERMAL SENSOR 956 uFCBGA D FSB 800MHz LVDS DDR2 SDRAM 800 MHz nVIDIA NB9M-GS CRT PCIE * 16 GS45 Express 1363 uFCBGA HDMI STANDARD DDR2 DIMM STANDARD DDR2 DIMM DMI 100MHz C C SATA 2.5" HDD USB CARD READER

WPCE773LA0DG

Abstract: DIODE C502 TPS51125 winbond wpce773la0dg RT8202 Realtek ALC269Q High Definition Audio P8022 NDS0610-NL-GP SC1U6D3V2KX-GP M92A
Contextual Info: 5 4 3 2 1 SYSTEM DC/DC Project code: 91.4CQ01.001 PCB P/N : 48.4CQ01.0SA REVISION : 08274-SA JM41 Discrete Block Diagram 36 TPS51125 INPUTS OUTPUTS 5V_S5 6A 3D3V_S5(5A) DCBATOUT 5V_AUX_S5 D Thermal Sensor Intel CPU CLK GEN. SMSC Penryn SFF ICS9LPRS365B 4,5,6

intel PC MOTHERBOARD CIRCUIT diagram x86 family 6 model 7 stepping 3

Abstract: MSI G41 MOTHERBOARD CIRCUIT diagram STR 6757 OF equivalent MSI G31 Motherboard g41 msi motherboard circuit diagram INTEL 845 MOTHERBOARD CIRCUIT diagram xeon e5 cpuid philips semiconductor data handbook JESD-A103 LGA-2011
Contextual Info: Intel Xeon® Processor E5-1600/ E5-2600/E5-4600 Product Families Datasheet - Volume One May 2012 Reference Number: 326508, Revision: 002 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS

Contextual Info: 7030 POWER INDUCTORS Outgassing Compliant Power Inductors AE514PYA • High temperature materials allow operation in ambient temperatures up to 155°C ■ Passes NASA low outgassing specifications ■ Passes vibration testing to 80 G and shock testing to 1000 G

g41 motherboard repair

Abstract: vrm pentium 4 MSI chipset g31 motherboard repair intel management engine lvds to eDP connector intel g41 motherboard repair
Contextual Info: Mobile Intel 4 Series Express Chipset Family Datasheet June 2009 Document Number: 320122-006 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS

7400

Abstract: FCBGA 407 MTS controller circuit diagram gm45
Contextual Info: Mobile Intel 4 Series Express Chipset Family Datasheet January 2009 Document Number: 320122-004 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS

asus motherboard circuit diagram

Abstract: SuperSpeed USB 3.0 to Serial ATA Bridge P1263 intel MOTHERBOARD SERVICE MANUAL
Contextual Info: Intel Atom Processor E3800 Product Family Datasheet October 2013 Revision 1.0 Reference Number: 538136 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS

Contextual Info: 6235 POWER INDUCTORS Outgassing Compliant Power Inductors AE512PJB • High temperature materials allow operation in ambient temperatures up to 155°C. ■ Passes NASA low outgassing specifications ■ Special construction allows it to pass vibration testing to

WPCE775LA0DG

Abstract: RT8206B RT8207A winbond wpce775 wpce775la winbond wpce775la0dg ALC269X alcor au6433 IC WPCE775LA0DG WPCE775 AU-6433
Contextual Info: 5 4 3 2 1 JM11_MS ZH7 BLOCK DIAGRAM PCB STACK UP 8L HDI XTAL Y2 14.318MHZ LAYER 1 : TOP LAYER 2 : GND LAYER 3 : IN1 LAYER 4 : VCC LAYER 5 : IN2 LAYER 6 : IN3 LAYER 7 : GND LAYER 8 : BOT D POWER SYSTEM 5V/3V RT8206B P24 CLOCK CK505 (QFN-64) PG2 FAN & THERMAL

CX20585

Abstract: lenovo CX20585-10Z CX2058 ADP3209 R9118 K34 mosfet TP8117 1J23A lenovo battery
Contextual Info: 5 4 3 2 1 ITP CONNECTOR PAGE 6 Penryn SFF PAGE 3,4,5 D THERMAL SENSEER CLK GEN DC-IN PAGE 18 ICS9LPRS393AKLFT PAGE 76 AGTL+ FSB 1067/800MHz 4X Data 2X Address PAGE 74 PAGE 82 LVDS SO-DIMM DRAM DIMMS*2 LCD VCC1R05AMT MAX1993 PAGE 29 PAGE 87 Dual Channel DDR3

ITE8502E

Abstract: ITE8502E-L RTM875T-606 TPS51610 IT8502E ISL6251 INVENTEC ITE8502 alc269 SOT223 w27
Contextual Info: 5 4 3 2 1 D D ACER C C BAP41/BAP51/SJM52 UMA+Discrete SW Gfx MAIN BOARD B B 2009.04.23 A A EE DATE POWER DATE DRAWER DESIGN CHECK RESPONSIBLE Thursday, April 23, 2009 DATE CHANGE NO. 5 SIZE= FILE NAME: XXXX-XXXXXX-XX P/N XXXXXXXXXXXX X01 REV 4 3 2 TITLE INVENTEC

RT8152B

Abstract: rt8152 G995P1U 95A hall effect sensor UP6111AQDD RT9025 ic AH44 95A sensor hall VSS210 Atheros ar9
Contextual Info: 1 2 3 PCB STACK UP 4 5 6 7 8 BU3 Block Diagram LAYER 1 : TOP LAYER 2 : GND1 LAYER 3 : IN1 A LAYER 4 : GND PENRYN-SFF LAYER 5 : VCC 478P uFCPGA LAYER 6 : IN2 A P3,4 FSB LAYER 7 : GND2 FSB 667/800/1066MHZ DDR SYSTEM MEMORY LAYER 8 : BOT DDRIII-SODIMM1 DDRIII-SODIMM2