U8439-1
Abstract: AUS703 NAU-8 namics underfill ABF-GX3 Ablestik underfill DCL5 X23-7772-4 DCL4 X23-7772
Contextual Info: Integrated Device Technology, Inc. 6024 Silver Creek Valley Road, San Jose, CA - 95138 PRODUCT/PROCESS CHANGE NOTICE PCN PCN #: A1006-03 DATE: 23-Jul-2010 Product Affected: MEANS OF DISTINGUISHING CHANGED DEVICES: 35.0mm x 35.0mm x 3.42mm FCBGA-1156 (RoHS & Standard)
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a1006-0323-jul-2010fcbga-1156fcbga-900+1523-oct-201089hpes16t16zabl89hpes16t16zabr89hpes22t16zabl89hpes22t16zabliu8439-1aus703nau-8namics underfillabf-gx3ablestik underfilldcl5x23-7772-4dcl4x23-7772
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X23-7772-4
Abstract: U8439-1 DCL5 AUS703 namics underfill X23-7772 NAU-8 ABF-GX3 namics U8439-1 X2377
Contextual Info: Integrated Device Technology, Inc. 6024 Silver Creek Valley Road, San Jose, CA - 95138 PRODUCT/PROCESS CHANGE NOTICE PCN PCN #: A0904-03 DATE: 22-May-2009 MEANS OF DISTINGUISHING CHANGED DEVICES: Product Affected: 19mm x 19mm FCBGA-324 (RoHS) Refer to Attachment II for the affected part numbers
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a0904-0322-may-2009fcbga-32422-aug-2009+15jesd22-a104jesd22-a118jesd22-a103jesd22-a11380ksw0001arx23-7772-4u8439-1dcl5aus703namics underfillx23-7772nau-8abf-gx3namics u8439-1x2377
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underfill
Abstract: SILICON CONTROL RECTIFIER DETAILS AN-1050 Aluminum alloys physical properties Ablestik underfill SN62 PB36 ag2 Copper SN62 PB36 ag2 alsic 105 alsic
Contextual Info: AN-1050 DirectFET TM Technology Materials and Practices Application Note page Factors causing thermal fatigue 2 Summarized test results 2 Use of underfill beneath devices 3 Use of lead-free solder alloys 3 Use of insulated metal substrates 4 Use of conformal coatings
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an-1050an-1035underfillsilicon control rectifier details+6aluminum alloys physical propertiesablestik underfillsn62 pb36 ag2 coppersn62 pb36 ag2alsic 105alsic
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underfill
Abstract: Aluminum alloys physical properties AN-1050 SILICON CONTROL RECTIFIER DETAILS alsic 105 SN62 PB36 ag2 International Power Devices silicon carbide LED lead-free solder joint reliability thermal cycle alsic
Contextual Info: Application Note AN-1050 DirectFETTM Technology Materials and Practices Application Note Table of Contents Page Factors Causing Thermal Fatigue .2 Summarized Test Results .2
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an-1050underfillaluminum alloys physical propertiessilicon control rectifier details+6alsic 105sn62 pb36 ag2international power devicessilicon carbide ledlead-free solder joint reliability thermal cyclealsic
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PPC970FX
Abstract: ablestik 8360 Ablestik underfill PPC970 PPC-970FX Thermacore
Contextual Info: Application Note Thermal Considerations: PPC970FX Abstract The 64-bit IBM PowerPC 970FX PPC970FX enters a new era of processing power and thermal dissipation over earlier PowerPC products. The processor can operate at multiple GHz clock speeds and can dissipate relatively high levels of power through a very small processor die. The high power
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ppc970fx64-bit970fxablestik 8360+4ablestik underfillppc970ppc-970fxthermacore
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2088AB* led matrix
Abstract: led matrix 2088ab 2088AB led matrix led matrix 8x8 mini circuits 2088AB matrix 2088ab Ultrasonic humidifier circuit torque settings for metric cap head screws TRANSISTOR C 6090 EQUIVALENT CV 7311
Contextual Info: Soldering and Mounting Techniques Reference Manual SOLDERRM/D Rev. 3, May−2006 SCILLC, 2006 “All Rights Reserved” SOLDERRM FULLPAK, ICePAK, MicroIntegration, MicroLeadless, MOSORB, MiniMOSORB, and POWERTAP are trademarks of Semiconductor Components Industries, LLC SCILLC . Cho−Therm is a registered trademark of Chromerics, Inc. Grafoil is a registered trademark of
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may-20062088ab* led matrixled matrix 2088ab2088ab led matrix+7led matrix 8x8 mini circuits2088abmatrix 2088abultrasonic humidifier circuittorque settings for metric cap head screwstransistor c 6090 equivalentcv 7311
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matrix 2088ab
Abstract: 2088AB led matrix torque settings chart for metric stainless bolts led matrix 2088ab 2088AB* led matrix PHASE CONTROL THYRISTOR MODULE TT 56 N SIL-PAD to-247 Ultrasonic humidifier circuit full wave BRIDGE RECTIFIER 1044 2088AB
Contextual Info: Soldering and Mounting Techniques Reference Manual SOLDERRM/D Rev. 5, January−2007 SCILLC, 2007 “All Rights Reserved” SOLDERRM FULLPAK, ICePAK, MicroIntegration, MicroLeadless, MOSORB, MiniMOSORB, and POWERTAP are trademarks of Semiconductor Components Industries, LLC SCILLC . Cho−Therm is a registered trademark of Chromerics, Inc. Grafoil is a registered trademark of
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january-2007matrix 2088ab2088ab led matrixtorque settings chart for metric stainless bolts+7led matrix 2088ab2088ab* led matrixphase control thyristor module tt 56 nsil-pad to-247ultrasonic humidifier circuitfull wave bridge rectifier 10442088ab
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