diode b34
Abstract: diode u2 a54 0.01MF AMD C32 CR0805 surface mount transistor A48 surface mount transistor A61 b34 diode B34 motorola sn74ls574
Contextual Info: P3V VIO P2 P1 3 5 6 INTA# 4 TDO 5 6 INTA# PCI_5V 7 X7 7 X10 X50 8 8 TOOL1 B2 TOOL_130 TOOL_130 B3 B4 C51 B5 0.1 B6 C15 0.1 0.1 CC0805 C19 CC0805 CC0805 B8 A27 A28 A29 A30 A31 A32 A33 A34 A35 A36 A37 A38 A39 A40 A41 A42 A43 A44 A45 A46 A47 A48 A49 A50 A51 A52
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cc0805cr0805rc0805ot223+10ndt452pdiode b34diode u2 a540.01mfamd c32surface mount transistor a48surface mount transistor a61b34 diodeb34 motorolasn74ls574
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LT 7227
Abstract: ON B34 CR0805 rd sot23 sot23 a36 sot23 D501 AD9 SOT23 B14 sot23 sdi BAV70 AD27
Contextual Info: P3V VIO P1 P2 PCI_5V A1 1 P3V +12V_PCI A3 3 TCK TDO A5 5 5 B5 A6 6 6 B6 INTA# X7 1 A8 8 A9 9 X11 A10 10 1 X12 X10 X50 1 AD28 A23 23 AD26 AD20 28 B28 29 B29 AD19 32 B32 A33 33 C_BE2# 33 B33 IRDY# 38 B38 43 B43 AD15 C_BE1# 44 B44 AD14 45 B45 A45 45 A46 46 46 B46
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cc0805amp173979-3lt 7227on b34+8cr0805rd sot23sot23 a36sot23 d501ad9 sot23b14 sot23sdi bav70ad27
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sn74ls574
Abstract: CR0805 MOTOROLA 136 DPAK MOTOROLA LM393M B52 transistor B58 SO8 surface mount transistor A55 AD27 AD29 AD30
Contextual Info: P3V VIO P1 P2 PCI_5V A1 1 P3V +12V_PCI A3 3 TCK TDO A5 5 5 B5 A6 6 6 B6 INTA# X7 1 A8 8 A9 9 X11 1 A10 10 X12 X10 X50 1 AD28 A23 23 AD26 AD20 28 B28 29 B29 AD19 32 B32 A33 33 C_BE2# 33 B33 IRDY# 38 B38 43 B43 AD15 C_BE1# 44 B44 AD14 45 B45 A45 45 A46 46 46 B46
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cc0805lm393mrc0805sn74ls574+9cr0805motorola 136 dpakmotorola lm393mb52 transistorb58 so8surface mount transistor a55ad27ad29ad30
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PLM-96
Abstract: 80c196kb-compatible A45 interface
Contextual Info: Index INDEX # AD.COMMAND, 5-20, 9-1, 9-3, 9-5, C -l, C-2, C-4, C-8, C -ll, C-60 programming for A/D conversions, 9-5 AD.RESULT, 5-20, 5-21, 9-1, 9-3, 9-7, C-l, C-2, C-4, C-9, C-10, C-60, C-61 AD.TIME, 9-1, 9-3, 9-4, C -l, C-2, C-4, C -ll, C-12, C-37 ADO-15, B-2
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80c196kb-compatible10-bitnumber052-8119plm-96+1a45 interface
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DRAM memory
Abstract: NEC Rambus A45 interface
Contextual Info: Part Number Synchronous DRAM 1 X 4/ X 8 /¿PD45 64 4 4 1 G5 - A 80 NEC CMOS-Synchronous DRAM Memory Density-64: 64M bits 16: 16M bits Organization-4: x 4 8 :x 8 No. of Bank-2 : 2 Bank 4 : 4 Bank Interface-1 : LVTTL
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upd4564441g5-a80density-----------64iupd45density-----------16+6organization------------------16time-------10ensity--------------------------------170dram memorynec rambusa45 interface
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CPA4
Abstract: Jumper JP2e LEDTX CPD14 A41 transformer PCD-15 a4510 CPD11 MCS 96 users manual CPA17
Contextual Info: ASSP CMOS DK86967 Users Guide Table of Contents List of Figures Introduction .3 Design Kit DK86967-ISA Schematic .3 Board Configurations .5
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zl58
Abstract: marking 3L2 diode DIODE 3L2 abb CA5-10 AF460 CAL18-11 AF145 WB75-A ABB MCCB 160 VM750H
Contextual Info: 1 e lin e th rs ss acto o r t Ac con 1 Accessories for A/AF/AL & AE contactors Auxiliary contact blocks – Standard Maximum number of contact blocks Positioning 4 blocks: A9 – A26 AE9 – AE26 Front mounting AL9 – AL26 single pole 5 blocks: A30, A40, AE30, AE40, AL30, AL40
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ae110af110cal5-11ca5-10+14a26-40-00a40-30-10al40-30-10ae9-ae45zl58marking 3l2 diodediode 3l2abb ca5-10af460cal18-11af145wb75-aabb mccb 160vm750h
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DRAM memory
Abstract: NEC Rambus A45 interface
Contextual Info: Part Number Synchronous DRAM 1 X 4/ X 8 ¿¿PD45 64 4 4 1 G5 - A 80 NEC CMOS Synchronous DRAM Memory Density-6 4 : 64M bits 16: 16M bits Organization-4:X4 8:X8 No. of B ank-2 : 2 Bank 4 : 4 Bank Interface 1 : LVTTL Package • G5 : TSOP (II) (400 mil)
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upd4564441g5-a80/pd45density------------16organization-------------------16+5--------------------------------------a50e--------------------60dram memorynec rambusa45 interface
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a39 diode
Abstract: 25X2 HONDA REJ11F0003-0100Z semiconductor b46 M3A-ZA53 A37 diode M66291GP M66591GP transistor B42
Contextual Info: REJ11F0003-0100Z < For SuperH Solution Engine > Converter Board for USB ASSP Utility Board M3A-ZA53 Instruction Manual Renesas Technology Corporation Renesas Solutions Corporation Keep safety first in your circuit designs! • Renesas Technology Corporation puts the maximum effort into making semiconductor products better and more reliable, but there is
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rej11f0003-0100zm3a-za5335aza3ma39 diode+725x2hondasemiconductor b46a37 diodem66291gpm66591gptransistor b42
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A29 IC
Abstract: 27C512 CXP82000
Contextual Info: CXP82000 CMOS 8-bit Single Chip Microcomputer Description The CXP82000 is a CMOS 8-bit single chip microcomputer of piggyback/evaluator combined type, which is developed for evaluating the function of the CXP82052/82060. Piggyback/ evaluator type 100 pin PQFP Ceramic
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cxp82000cxp82052/8206016-bit250ns+616mhz32khz27c512100pinpqfp-100c-l01a29 ic
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dap013
Abstract: DAP011 free pdf download P55 MOSFET P55 MOSFET mosfet d38 equivalent am2 SOCKET PIN LAYOUT b30 c250 rp633 LA185 2N3904 A35
Contextual Info: A 4 3 2 B 1 INDEX 2 CPU SOCKET 7 3 CLOCK GENERATOR 4 MTXC HOST INTERFACE 5 MTXC SYSTEM INTERFACE 6 CACHE 1 7 CACHE 2 8 DIMM 1 9 DIMM 2 10 SYSTEM BIOS, TSOP 11 PIIX4 1 12 PIIX4 2 13 IDE INTERFACE 14 ULTRA IO CONTROLLER 15 PARALLEL PORT 16 KB, FLOPPY, & COM PORTS
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memcs16iocs16dap013dap011+8free pdf download p55 mosfetp55 mosfetmosfet d38 equivalentam2 socket pin layoutb30 c250rp633la1852n3904 a35
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SCK-125
Abstract: CXP82832 27C512 CXP82800 A13 MARKING CODE CXP82852 IC MARKING CODE A21 A3664
Contextual Info: CXP82800 CMOS 8-bit Single Chip Microcomputer Description The CXP82800 is a CMOS 8-bit single chip microcomputer of piggyback/evaluator combined type, which is developed for evaluating the function of the CXP82832/82840/82852/82860. Piggyback/evaluator 100 pin PQFP Ceramic
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cxp82800cxp82832/82840/82852/8286016-bit400ns+1110mhz32khz27c512100pinpqfp-100c-l01sck-125cxp82832a13 marking codecxp82852ic marking code a21a3664
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m66596
Abstract: A37 diode a39 diode A34 A44 M66291GP M66591GP M66592FP R8A66597 MS7727PR02 M66596FP
Contextual Info: REJ11F0003-0101Z < For SuperH Solution Engine > Converter Board for USB ASSP Utility Board M3A-ZA53 Instruction Manual Notes regarding these materials 1. This document is provided for reference purposes only so that Renesas customers may select the appropriate
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rej11f0003-0101zm3a-za53m66596fpm3a-0039+11r8a66597fpm3a-0040m66596a37 diodea39 diodea34 a44m66291gpm66591gpm66592fpr8a66597ms7727pr02
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7805CT
Abstract: MOC5010 ip1717 UA741CN op amp TL081P LM3524N LM13080N 7824ct LM7915CK LM7905CK
Contextual Info: Master Designer Version 8.5 Component Library Reference Volume 2 October 1995 All rights reserved. No part of this publication may be reproduced, stored in a retrieval system, or transmitted, in any form or by any means-electronic, mechanical, photocopying, recording, or otherwise-without the prior
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C1490
Contextual Info: PCIE16X-800EVK User Guide PCIe 16X Lane Card Evaluation Kit General Description: The PCIE16X-800EVK is a PCIe add-in riser card for PCIe 16x applications. It provides a complete platform to evaluate 4 - DS80PCI800SQ, 8 channels PCIe repeater for PCIe system protocol and lane
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pcie16x-800evkds80pci800sq4808-3004-cp219-6mst+5219-4mstpcie16x800evkds80pci800c1490
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a36 5pin
Abstract: b38 5pin B52 transistor SL18S88A-845S A29 A44 presence information a40 5pin A45 interface
Contextual Info: SimpleTech SO-RIMM Module 144MB Overview Key Timing Parameters The SO-RIMM™ module is a general purpose high-performance memory subsystem suitable for a broad range of applications including computer memory, mobile “Thin and Light”PCs, networking systems, and other applications where
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Device marking code B12 B13 B14 B15 B16
Abstract: MARKING b56 Device marking code B52 marking A78 a80 marking code marking code B49 a64 marking code A45 interface marking code B38 HS032E02B
Contextual Info: 32MB SO-RIMMTM Module with 128/144 Mb RDRAMs HCD SO-RIMM Memory Module Specification GENERAL DESCRIPTION This document outlines specifications for HCD’s SO-RIMM Module which consists of 128Mb / 144Mb Direct Rambus DRAM devices. HCD supports applications with 600, 700 and 800 MHz speed grades in both ECC and non-ECC
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128mb144mbhs032n02ehs032n02d+15hs032n02chs032n02bhs032e02ehs032e02dhs032e02chs032e02bdevice marking code b12 b13 b14 b15 b16marking b56device marking code b52marking a78a80 marking codemarking code b49a64 marking codea45 interfacemarking code b38
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md7130
Abstract: smd DIODE B34 diode u2 a54 smd a60 B49 diode smd B34 diode smd B45 diode smd smd b38 B34 SMD Transistor DP83816
Contextual Info: 8 7 6 5 4 3 2 1 D D PME Header PCI CLK 33 Mhz Magnetics PCI BUS C AD(31:0) TP RJ45 C MacPHYTERII DP83816 25 MHz XTAL PCI Interface B EEPROM I'face B BIOS ROM These schematics are provided for reference only. For any designs based on these schematics always contact National Semiconductor Corporation BEFORE initiating PCB
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dp8381610/100m001ufc100p-1808+9md7130smd diode b34diode u2 a54smd a60b49 diode smdb34 diode smdb45 diode smdsmd b38b34 smd transistor
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diode u2 a54
Abstract: diode c25 B49 diode smd Diode 133 B34 smd b38 smd DIODE B34 A29 SMD B45 diode smd DP83816 MA6 diode
Contextual Info: 8 7 6 5 4 3 2 1 D D PME Header PCI CLK 33 Mhz Magnetics PCI BUS C AD(31:0) TP C RJ45 MacPHYTERII DP83816 25 MHz XTAL PCI Interface B EEPROM I'face B BIOS ROM SERIAL EEPROM A A National Semiconductor - Wired Communications Group Title 10/100 Mb/s Ethernet MacPHYTERII DP83816 Demo Board (Amber)
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dp8381610/100m001ufc100p-1808+9diode u2 a54diode c25b49 diode smddiode 133 b34smd b38smd diode b34a29 smdb45 diode smdma6 diode
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C65 004
Abstract: A65 SMD W17 SMD transistor SMD w35 Transistor w33 SMD sot 23 w45 SOT A29 SMD epson c87 smd a60 smd transistor a68
Contextual Info: TLV320AIC10 EVM User’s Guide February 2000 AAP Data Converter Group SLWU003 IMPORTANT NOTICE Texas Instruments and its subsidiaries TI reserve the right to make changes to their products or to discontinue any product or service without notice, and advise customers to obtain the latest version of relevant information
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tlv320aic10slwu00312x3xpeg36ts-tbr+124-feb-2000a3\evms\aic10evmc65 004a65 smdw17 smd transistorsmd w35 transistorw33 smd sot 23w45 sota29 smdepson c87smd a60smd transistor a68
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550-100
Contextual Info: MIL-DTL-24308 D-Subminiature 550-100 Non-EMI D-Subminiature Split Backshell 550 T 100 M 2 FO B Basic Part No. Jackscrew Type Page A-4 Cable Entry Style T = Top S = Side E = End Receptacle Mounting (Right Page) CC = Cable-to-Cable Mounting F0 = Front Mounting
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8111DL
Abstract: ALC269 lvds to eDP amd accelerated processor unit apu G-T40N eDP to vga DBFT1-00-E1-EVAL-KT G-T56N embedded display port connector SB-TSI
Contextual Info: AMD DB-FT1 Development Board PRODUCT OVERVIEW COMPREHENSIVE DEVELOPMENT TOOLS The AMD DB-FT1 development board is an evaluation board for the AMD Embedded G-Series platform, a low power processor and advanced GPU integrated into a single embedded Accelerated
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2560x16009286-a8111dlalc269+8lvds to edpamd accelerated processor unit apug-t40nedp to vgadbft1-00-e1-eval-ktg-t56nembedded display port connectorsb-tsi
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hydraulic analog servo controller
Abstract: industrial machine control systems SERVO CONTROL VALVES A45 interface
Contextual Info: Control Systems Many industrial designers are concerned with controlling an entire process. Motion control is one important and influential aspect of complete machine control. The primary elements of machine control include: Fig. 5.1 Primary machine control elements
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hydraulic analog servo controllerindustrial machine control systemsservo control valvesa45 interface |
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marking code B49
Abstract: MARKING b56 marking A71 marking A46 B36 Device marking code B12 B13 B14 B15 B16 a80 marking code a64 marking code marking code B38 A45 interface A77 marking
Contextual Info: 256MB SO-RIMMTM Module with 256/288 Mb RDRAMs HCD SO-RIMM Memory Module Specification GENERAL DESCRIPTION This document outlines specifications for HCD’s SO-RIMM Module which consists of 256Mb / 288Mb Direct Rambus DRAM devices. HCD supports applications with 600, 700 and 800 MHz speed grades in both ECC and non-ECC
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256mb288mbhs256n08ehs256n08d+15hs256n08chs256n08bhs256e08ehs256e08dhs256e08cmarking code b49marking b56marking a71marking a46 b36device marking code b12 b13 b14 b15 b16a80 marking codea64 marking codemarking code b38a45 interfacea77 marking
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