A12S Search Results

DTS-430

Contextual Info: PCM5310 PC M5 310 Burr-Brown Audio www.ti.com . SLES244 – FEBRUARY 2009

Contextual Info: Integrator Series FPGAs - 1200XL and 3200DX Famüies Features Cadence, Escalade, Exemplar, 1ST, M entor Graphics, Synopsys and Viewlogic High C a p a c ity • JTAG1149.1 Boundary Scan Testing • 2,500 to 40,000 logic gates • Up to 4 Kbits configurable dual-port SRAM

BA102

Abstract: diode ba102 diode ba103 TH50VSF3680AASB A12F TH50VSF3681AASB BA41 BA96
Contextual Info: TH50VSF3680/3681AASB TENTATIVE TOSHIBA MULTI-CHIP INTEGRATED CIRCUIT SILICON GATE CMOS SRAM AND FLASH MEMORY MIXED MULTI-CHIP PACKAGE DESCRIPTION The TH50VSF3680/3681AASB is a mixed multi-chip package containing a 8,388,608-bit Full CMOS SRAM and a 67,108,864-bit flash memory. The CIOS and CIOF inputs can be used to select the optimal memory configuration.

8a21

Abstract: ba1s F2480 A12F TH50VSF2480AASB TH50VSF2481AASB a19t
Contextual Info: SFP- TOSHIBA Multi Chip Package SRAM & FLASH Memory 4M BIT SRAM X 8/ X16 16M BIT FLASH ( X 8/X 16) Data Sheet TOSHIBA TH50VSF2480/2481AASB TENTATIVE TOSHIBA MULTI CHIP INTEGRATED CIRCUIT SILICON GATE CMOS SRAM AND FLASH MEMORY MIXED MULTI CHIP PACKAGE DESCRIPTION

bv228

Abstract: S1C33210 S1C33L01 MF1517-01 CP4D
Contextual Info: MF1517-01 CMOS 32-BIT SINGLE CHIP MICROCOMPUTER S1C33210 Technical Manual S1C33210 PRODUCT PART S1C33210 FUNCTION PART NOTICE No part of this material may be reproduced or duplicated in any form or by any means without the written permission of Seiko Epson. Seiko Epson reserves the right to make changes to this material without notice.

TH50VSF3581AASB

Abstract: A12F TH50VSF3580AASB
Contextual Info: TH50VSF3580/3581AASB TENTATIVE TOSHIBA MULTI-CHIP INTEGRATED CIRCUIT SILICON GATE CMOS SRAM AND FLASH MEMORY MIXED MULTI-CHIP PACKAGE DESCRIPTION The TH50VSF3580/3581AASB is a mixed multi-chip package containing a 8,388,608-bit Full CMOS SRAM and a 33,554,432-bit flash memory. The CIOS and CIOF inputs can be used to select the optimal memory configuration.

EATON CM20A

Abstract: A5 GNE mosfet Hall sensor 44e 402 2N8491 FTG 1087 S TRIAC BCR 10km FEB3T smd transistor marking 352a sharp EIA 577 sharp color tv schematic diagram MP-130 M mh-ce 10268
Contextual Info: Table of Contents N E W A R K E L E C T R O N IC S “Where serving you begins even before you call” Newark Electronics is a UNIQUE broadline distributor of electronic components, dedicated to provid­ ing complete service, fast delivery and in-depth inventory. Our main

Contextual Info: CMOS 32-BIT SINGLE CHIP MICROCOMPUTER S1C33301 Technical Manual NOTICE No part of this material may be reproduced or duplicated in any form or by any means without the written permission of Seiko Epson. Seiko Epson reserves the right to make changes to this material without notice. Seiko Epson does not assume any

Contextual Info: PICO ELECTRONICS INC S3E D • 7111130 0G0GT03 7bD « P E I Series SW -Single Output-AC-DC Sw itching Pow er Suppiies P S -?- 0 5 Hi Reliability Terminal Strips " O neat Sink Available Industrial Grade D e r% E /e c tr i< » i ^ r a t,n 9 f í e q U tr e d

J32CG

Abstract: 61a3 mosfet BCM5461KFB 61a3 58A6 bcm5461 60F10 L32SD DQ27152 A26B4
Contextual Info: 1 2 4 3 5 6 7 TABLE OF CONTENTS F F PAGE 02 - BLOCK DIAGRAM PAGE 03 - 750GX ADDRESS/DATA BUSSES PAGE 04 - 750GX CONTROLS AND GROUND PAGE 05 - 750GX POWER AND DECOUPLING PAGE 06 - TSI108 PROCESSOR BUS INTERFACE PAGE 07 - TSI108 MEMORY INTERFACE PAGE 08 - DDR2 DIMM CONNECTOR SLOT 0

M62352AGP

Abstract: AO11 M62352GP A11018 VTR precision voltage reference
Contextual Info: MITSUBISHI <Standard Linear IC> M62352AGP 8BIT 12CH D-A CONVERTER WITH BUFFER AMPLIFIERS DESCRIPTION M62352A is a CMOS structured semiconductor integrated ciruict integrating 12 channels of built-in D-A converters with high performance buffer operational amplifierf or each channel output.

A12F

Abstract: TH50VSF2580AASB TH50VSF2581AASB TH50VSF2580
Contextual Info: TH50VSF2580/2581AASB TENTATIVE TOSHIBA MULTI-CHIP INTEGRATED CIRCUIT SILICON GATE CMOS SRAM AND FLASH MEMORY MIXED MULTI-CHIP PACKAGE DESCRIPTION The TH50VSF2580/2581AASB is a mixed multi-chip package containing a 4,194,304-bit full CMOS SRAM and a 33,554,432-bit flash memory. The CIOS and CIOF inputs can be used to select the optimal memory configuration.

t2g memory

Abstract: 140U -i6
Contextual Info: AMDÌ1 PRELIMINARY Élan SC300 Highly Integrateci, Low -Power, 32-B it M icrocontroller DISTINCTIVE CHARACTERISTICS • Highly integrated, single-chip CPU and system logic - Optimized for embedded PC applications - Combines 32 bit, x86 compatible, low-voltage

A5G1

Abstract: k11r R1A11 E12A K12B .7J10 J12A L11-R8 d10e1 S11C1
Contextual Info: tb_fnnm e_C_P_AM _T Rev. D 2 0 0 4 /0 6 / 2 8 13 12 10 M ATERIAL NUMBER « OF COLUMNS 77.55 # OF DIFF PAIR DIM P PTH 0 7 6 7 3 5 -9 2 0 4 12 72 4.90 0.46±0.05 7 6 7 3 5 -9 2 0 5 12 72 5.50 0.46±0.05 7 6 7 3 5 -9 2 0 7 12 72 4.90 0.39±0.05 7 6 7 3 5 -9 2 0 8

A12sc

Abstract: A12S scs220
Contextual Info: PCM5310 PC M5 310 Burr-Brown Audio www.ti.com . SLES244 – FEBRUARY 2009

D12DT

Abstract: D12DT 10 HF34 PGA-L01R A12E DR96 DTS530 ZR12 DMS12 DUC3
Contextual Info: PCM5310 PC M5 310 Burr-Brown Audio www.ti.com SLES244A – FEBRUARY 2009 – REVISED JANUARY 2010 24-Bit, 96-/192-kHz, Asynchronous, 4-Channel/4-Channel Audio Codec with 2-VRMS Driver, Headphone Driver, and 6 Audio Interface Ports Check for Samples: PCM5310

A04g

Abstract: A05G M62352AGP
Contextual Info: To all our customers Regarding the change of names mentioned in the document, such as Mitsubishi Electric and Mitsubishi XX, to Renesas Technology Corp. The semiconductor operations of Hitachi and Mitsubishi Electric were transferred to Renesas Technology Corporation on April 1st 2003. These operations include microcomputer, logic, analog

pj86

Abstract: GP136 GP134 A1111P pj74 avk6 F66T18HC AP1616 C924B pj2016
Contextual Info: To be used as guide only. User responsible for reviewing critical variables. Hoffman Part Number A10086CH A10086CHFL A10086CHNF A1008CH A1008CHFL A1008CHNF A1008CHNFSS A1008CHNFSS6 A1008CHS A1008LP A1008NF A1008NFAL A1008NFSS A1008SC A10106CH A10106CHFL A1066JFGQRPWR

rca thyristor manual

Abstract: S1C33L01 a12b 014-698
Contextual Info: CMOS 32-BIT SINGLE CHIP MICROCOMPUTER S1C33301 Technical Manual NOTICE No part of this material may be reproduced or duplicated in any form or by any means without the written permission of Seiko Epson. Seiko Epson reserves the right to make changes to this material without notice. Seiko Epson does not assume any

A18I

Abstract: RELE RAS 1210 S1C33L01 K53D
Contextual Info: MF1552-01 CMOS 32-BIT SINGLE CHIP MICROCOMPUTER S1C33205 Technical Manual S1C33205 PRODUCT PART S1C33205 FUNCTION PART NOTICE No part of this material may be reproduced or duplicated in any form or by any means without the written permission of Seiko Epson. Seiko Epson reserves the right to make changes to this material without notice. Seiko Epson does not assume any

tc35

Abstract: A18E P26D S1C33000 S1C33L01 S1C33S01 8255A ic details CFP10
Contextual Info: MF1399-01 CMOS 32-BIT SINGLE CHIP MICROCOMPUTER S1C33S01 Technical Manual S1C33S01 PRODUCT PART S1C33S01 FUNCTION PART NOTICE No part of this material may be reproduced or duplicated in any form or by any means without the written permission of Seiko Epson. Seiko Epson reserves the right to make changes to this material without notice.

A7260

Abstract: pj86 pj74 diode cross reference A3020 A72XM6618FTC csd483610 A1008CHNFSS6 A1111P GP136
Contextual Info: This Cross Reference is a guide only. Products may not be exactly the same and it is user’s responsibility to verify details for acceptable subsitution. Hammond is not responsibile for cross reference errors. Panel = Part No. Hammond Part No. A10086CH A10086CHFL

a12s

Abstract: TH50VSF1480AASB A12F TH50VSF1481AASB
Contextual Info: TH50VSF1480/1481AASB TOSHIBA MULTI-CHIP INTEGRATED CIRCUIT SILICON GATE CMOS SRAM AND FLASH MEMORY MIXED MULTI-CHIP PACKAGE DESCRIPTION The TH50VSF1480/1481AASB is a mixed multi-chip package containing a 2,097,152-bit Full CMOS SRAM and a 16,777,216-bit flash memory. The CIOS and CIOF inputs can be used to select the optimal memory configuration.

090Q

Contextual Info: RoHS compliant 1.25mm .049" Pitch Housing Features: * Available in 2 through 15 Circuits * Material: Ny1on66 UL94V-0 * Accepts YY-0900-T Crimp Temiinal « Mates with YY-0S00-WXXS or YY-090Q-WXXR Series Wafer A±0.20 1.25±0.10 _ E3 E] g q Specifications: