8X13 Search Results

8X13

Contextual Info: SANYO Semiconductor Thin Small Outline Package 28Pin Plastic TSOP28A 8X13.4 Precautions concerning information given on package drawings Basically, SANYO Semiconductor Company’s packages are named and coded in compliance with JEITA regulations (ED-7303A), which stipulate the names and codes for integrated circuit packages. However, the

IC63LV1024

Abstract: IC63LV1024-10B IC63LV1024-8B IC63LV1024-8J IC63LV1024-8K IC63LV1024-8T IS63LV1024
Contextual Info: IC63LV1024 Document Title 128K x 8 Hight Speed SRAM with 3.3V Central Power Revision History Revision No History Draft Date 0A 0B Initial Draft Add B 36-pin TF-BGA 6x8mm and H (32-pin TSOP-1 8x13.4mm) package type To correct the TYPO error Obsolete "H" type

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 Figure 12: 28-Lead 8x13.4mm Plastic Thin Small Outline Package TSOP Type I (E) Table 13: Plastic Thin Small Outline Package (TSOP) Type I (E) Dimensions INCHES Min Nom Max Min Nom Max
 

ZR28

Contextual Info: Package Diagram Reverse Thin Small Outline Package 28-Lead Reverse Type 1 Thin Small Outline Package 8x13.4 mm ZR28 51-85074-*F 1 Package Diagram 32-Lead Reverse Thin Small Outline Package ZR32 51-85089-*C 2

P28GW-55-9JL-2

Contextual Info: 28-PIN PLASTIC TSOP I (8x13.4) 1 28 detail of lead end S R 14 Q 15 P A J I G S L B C H N S D M M K NOTES 1. Each lead centerline is located within 0.08 mm of its true position (T.P.) at maximum material condition. 2. "A" excludes mold flash. (Includes mold flash : 8.4mm MAX.)

32-PIN

Contextual Info: 32-PIN PLASTIC TSOP I (8x13.4) detail of lead end 1 32 S T R L 16 17 U Q P I J A G S H K B C N S NOTES D M M ITEM MILLIMETERS 1. Each lead centerline is located within 0.08 mm of its true position (T.P.) at maximum material condition. A B 8.0±0.1 0.45 MAX.

8x13

Abstract: 32-PIN
Contextual Info: 32-PIN PLASTIC TSOP I (8x13.4) detail of lead end 1 32 U Q L R T 16 17 N K S D S M M C H B S G I J A P NOTES 1. Each lead centerline is located within 0.08 mm of its true position (T.P.) at maximum material condition. 2. "A" excludes mold flash. (Includes mold flash : 8.3 mm MAX.)

32PIN

Contextual Info: 32PIN PLASTIC TSOP I (8x13.4) detail of lead end 1 32 S T R L 16 17 U Q P I A J G H K B C N NOTE (1) Each lead centerline is located within 0.08 mm (0.003 inch) of its true position (T.P.) at maximum material condition. (2) "A" excludes mold flash. (Includes mold flash : 8.3 mm MAX.

Contextual Info: High Speed SRAM 32K-Word By 8 Bit CS18HS02565 Revision History Rev. No. 1.3 1.4 1.5 History Add green code in part no. Add in 28L TSOP 1-8x13.4mm Remove 28L TSOP 1-8x13.4mm Issue Date Jul. 22, 2005 Mar. 10,2006 Jun. 12,2006 Remark P1 Rev. 1.5 Chiplus reserves the right to change product or specification without notice.

IC63LV1024-8BI

Contextual Info: IC63LV1024 Document Title 128K x 8 Hight Speed SRAM with 3.3V Central Power Revision History Revision No History Draft Date 0A 0B Initial Draft Add B 36-pin TF-BGA 6x8mm and H (32-pin TSOP-1 8x13.4mm) package type To correct the TYPO error September 12,2001

IC63LV1024

Abstract: IC63LV1024-10T IC63LV1024-8B IC63LV1024-8J IC63LV1024-8K IC63LV1024-8T IC63L
Contextual Info: IC63LV1024 Document Title 128K x 8 Hight Speed SRAM with 3.3V Central Power Revision History Revision No History Draft Date Remark 0A 0B Initial Draft Add B 36-pin TF-BGA 6x8mm and H (32-pin TSOP-1 8x13.4mm) package type September 12,2001 June 20,2002 The attached datasheets are provided by ICSI. Integrated Circuit Solution Inc reserve the right to change the specifications and

Contextual Info: High Speed SRAM 32K-Word By 8 Bit CS18HS02565 Revision History Rev. No. 1.3 1.4 History Add green code in part no. Add in 28L TSOP 1-8x13.4mm Issue Date Jul. 22, 2005 Mar. 10,2006 P1 Rev. 1.4 Chiplus reserves the right to change product or specification without notice.

TSOP32 Package

Abstract: TSOP32
Contextual Info: ZMD-Standard February 2004 MDS 768 Package TSOP32 I/8x13,4 Dimensions in millimetres 1 Dimensions Detail Z bp e 0,1 M E 32 1 A1 LP D HD Dimensions of Sub-Group B1 Dimensions of Sub-Group C1 − Amax 1,20 Amin bPmin 0,17 A1min 0,05 bPmax 0,27 A1max 0,15 enom

Contextual Info: High Speed SRAM 32K-Word By 8 Bit CS18HS02565 Revision History Rev. No. 1.3 1.4 1.5 1.6 1.7 History Add green code in part no. Add in 28L TSOP 1-8x13.4mm Remove 28L TSOP 1-8x13.4mm Revise speed option and DC/AC Characteristics. Remove 28L PDIP 300mil Issue Date

Contextual Info: HY62UF08401C Series 512K x8bit full CMOS SRAM DESCRIPTION FEATURES Fully static operation and Tri-state output TTL compatible inputs and outputs Battery backup 1.2V min data retention Standard pin configuration -. 32 - sTSOP - 8X13.4(Standard) The HY62UF08401C is a high speed, super low

K4X56323PN-8G

Abstract: K4X56323PN
Contextual Info: Rev. 1.0, Mar. 2010 K4X56323PN 256Mb N-die Mobile DDR SDRAM 8x13, 90FBGA, 8M x32 VDD / VDDQ = 1.8V / 1.8V datasheet SAMSUNG ELECTRONICS RESERVES THE RIGHT TO CHANGE PRODUCTS, INFORMATION AND SPECIFICATIONS WITHOUT NOTICE. Products and specifications discussed herein are for reference purposes only. All information discussed

ZA32

Contextual Info: Package Diagram Shrunk Thin Small Outline Package 32-Lead Shrunk Thin Small Outline Package 8x13.4 mm ZA32 51-85094-*D 1

8X13

Contextual Info: MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS TSOP 28, 8x13.4 CASE 318AE−01 ISSUE O DATE 19 DEC 2008 D1 A PIN 1 b E1 e A1 A2 D TOP VIEW END VIEW q1 c q L2 L L1 SIDE VIEW SYMBOL MIN NOM MAX A 1.00 1.10 1.20 A1 0.05 A2 0.90 1.00 1.05 b 0.17 0.22 0.27 c 0.10 0.15

a634

Contextual Info:
  
   for ChipCorder Products
                   Table 1: ISD Device Package Options Package Options1 E ISD Series G P S T X W Z 8x13.4mm 0.350 inch 0.600 inch 0.300 inch 8x20mm Die Wafer Chip Scale

Contextual Info: HY57V283220T/ HY5V22F 4 Banks x 1M x 32Bit Synchronous DRAM Revision History Revision No. History 0.1 Defined Preliminary Specification 0.2 1 2) 3) 4) 5) 6) 0.3 Defined IDD Spec. 0.4 Delited Preliminary. 0.5 Changed IDD Spec. 0.6 133MHz Speed Added 0.7 Changed FBGA Package Size from 11x13 to 8x13.

Contextual Info: High Speed SRAM 32K-Word By 8 Bit CS18HS02565 Revision History Rev. No. 1.3 1.4 1.5 1.6 History Add green code in part no. Add in 28L TSOP 1-8x13.4mm Remove 28L TSOP 1-8x13.4mm Revise speed option and DC/AC Characteristics. Issue Date Jul. 22, 2005 Mar. 10,2006

CS18HS02565

Contextual Info: High Speed SRAM 32K-Word By 8 Bit CS18HS02565 Revision History Rev. No. History Issue Date 1.3 Add green code in part no. Jul. 22, 2005 1.4 Add in 28L TSOP 1-8x13.4mm Mar. 10,2006 1.5 Remove 28L TSOP 1-8x13.4mm Jun. 12,2006 1.6 Revise speed option and DC/AC Characteristics.

32PIN

Contextual Info: 32PIN PLASTIC TSOP I (8x13.4) detail of lead end 1 32 U Q L R T 16 17 S D N K M M C H B G I A J P NOTE (1) Each lead centerline is located within 0.08 mm (0.003 inch) of its true position (T.P.) at maximum material condition. (2) "A" excludes mold flash. (Includes mold flash : 8.3 mm MAX.

Contextual Info: 28-PIN PLASTIC TSOP I (8x13.4) 1 28 detail of lead end Q R 14 15 S K N H D S L M M C B S G I J A P NOTE 1. Each lead centerline is located within 0.08 mm of its true position (T.P.) at maximum material condition. 2. "A" excludes mold flash. (Includes mold flash : 8.4mm MAX.)