57AND Search Results

A06E

Contextual Info: FPC Connector FP-03U Series 0.3mm Spacing SMT ● CFP75 50F - No. of Pins 0.6 G 2.5 0.125 02 03 4.3 0.3 A A 0.5 C only 39, 51, 57and 65P 1.65 3.1 0.8 0.2 0.65 0.55 C D E F 4.8 6.0 7.8 9.6 11.4 13.2 15.0 16.8 19.2 5.45 6.65 8.45 10.25 12.05 13.85 15.65 17.45

A06E

Abstract: X03A A50F FPC CONNECTOR
Contextual Info: FPC Connector FP-03U Series 0.3mm Spacing SMT ● CFP75 50F - No. of Pins 極数 0.6 2.5 G 0.125 02 03 4.3 0.3 A A 0.5 C 3951、57、65Pのみ only 39、51、57and 65P 0.65 0.8 17 21 27 33 39 45 51 57 65 0.55 A B C D E F 4.8 6.0 7.8 9.6 11.4 13.2 15.0

K4J10324KE-HC1A

Abstract: K4J10324KE-HC14 T21N K4J10324KE k4j10324 K4J10324KE-HC12
Contextual Info: Target 1Gb GDDR3 SDRAM K4J10324KE 1Gbit GDDR3 SDRAM 136FBGA with Halogen-Free & Lead-Free RoHS compliant Revision 0.1 December 2008 INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS, AND IS SUBJECT TO CHANGE WITHOUT NOTICE. NOTHING IN THIS DOCUMENT SHALL BE CONSTRUED AS GRANTING ANY LICENSE,

k4j52324ki-hc1a

Abstract: K4J52324KI-HC08 K4J52324K K4J52324KI-HC14
Contextual Info: Rev. 1.2, Mar. 2010 K4J52324KI 512Mb GDDR3 SGRAM I-die 136 FBGA with Halogen-Free & Lead-Free RoHS compliant datasheet SAMSUNG ELECTRONICS RESERVES THE RIGHT TO CHANGE PRODUCTS, INFORMATION AND SPECIFICATIONS WITHOUT NOTICE. Products and specifications discussed herein are for reference purposes only. All information discussed

DDR2 x32

Contextual Info: 512M GDDR3 SDRAM K4J52324QC-B 512Mbit GDDR3 SDRAM Revision 1.2 September 2005 INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS, AND IS SUBJECT TO CHANGE WITHOUT NOTICE. NOTHING IN THIS DOCUMENT SHALL BE CONSTRUED AS GRANTING ANY LICENSE,

Contextual Info: 512M GDDR3 SDRAM K4J52324QC-B 512Mbit GDDR3 SDRAM Revision 1.4 March 2006 INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS, AND IS SUBJECT TO CHANGE WITHOUT NOTICE. NOTHING IN THIS DOCUMENT SHALL BE CONSTRUED AS GRANTING ANY LICENSE,

K4J52324Qc

Contextual Info: 512M GDDR3 SDRAM K4J52324QC 512Mbit GDDR3 SDRAM Revision 1.5 June 2006 INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS, AND IS SUBJECT TO CHANGE WITHOUT NOTICE. NOTHING IN THIS DOCUMENT SHALL BE CONSTRUED AS GRANTING ANY LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE,

fpc0

Contextual Info: FPC Connector FP-03U Series 0.3mm Spacing SMT ● CFP75 No. of Pins 極数 Finish 0.125 3951、57、65Pのみ only 39、51、57and 65P 3.2 B A 0.65 G • Features 17 21 27 33 39 45 51 57 65 B C D E F 5.45 6.65 8.45 10.25 12.05 13.85 15.65 17.45 19.85

DDR RAM 512M

Abstract: K4J52324QC-BC14 Hynix Cross Reference hynix memory h9 ddr2 K4J52324Q K4J52324QC-BJ12 mark t5n gddr3 K4J52324QC-BC20 K4J52324QC-A
Contextual Info: 512M GDDR3 SDRAM K4J52324QC-B 512Mbit GDDR3 SDRAM Revision 1.0 March 2005 INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS, AND IS SUBJECT TO CHANGE WITHOUT NOTICE. NOTHING IN THIS DOCUMENT SHALL BE CONSTRUED AS GRANTING ANY LICENSE,

BT 9843

Contextual Info: 7 T H IS DRAWING 15 UNPUBLISHED. JÊL COPYRIGHT 19 RELEASED FOR PUBLICATION BY AMP INCORPORATED. , 4 5 6 2 3 19 DI ST LOC REVISIONS AA 22 ALL RIGHTS RESERVED. DESCRIPTION N 00.79-0.89 [0.031 - .0 3 5 ] 64 H O L E S NAXINDM PANED 2.08-2.24 [ . 085±.003] 2 . 16 [ . 0 8 5 ]

K4j52324qh-hj1a

Abstract: K4J52324QH-HJ08 K4J52324QH K4J52324QH-HC14 K4J52324QH-HJ K4J52324QH-HC12 GDDR3 SDRAM 256Mb K4J52324Q K4J52324QH-HC K4j52324qh-hj0
Contextual Info: 512M GDDR3 SDRAM K4J52324QH 512Mbit GDDR3 SDRAM 136FBGA with Halogen-Free & Lead-Free RoHS compliant May 2008 Revision 1.0 INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS, AND IS SUBJECT TO CHANGE WITHOUT NOTICE. NOTHING IN THIS DOCUMENT SHALL BE CONSTRUED AS GRANTING ANY LICENSE,

Contextual Info: FPC Connector FP-03U Series 0.3mm Spacing SMT CFP75 No. of Pins 0.6 2.5 0.125 02 03 01 50 50 01 4.3 0.3 A A 0.5 C Finish G Au Au Sn-Pb 1.8 1.9 1.8 F F 51 1.65 3.1 0.8 0.55 No. of Pins 17 21 27 33 39 45 51 57 65 0.55 A B C D E F 4.8 6.0 7.8 9.6 11.4 13.2

K4j52324qh-hj1a

Abstract: K4J52324QH-HJ08 K4J52324QH K4J52324QH-HC12 K4J52324Q
Contextual Info: Preliminary 512M GDDR3 SDRAM K4J52324QH 512Mbit GDDR3 SDRAM 136FBGA with Halogen-Free & Lead-Free RoHS compliant March 2008 Revision 0.8 INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS, AND IS SUBJECT TO CHANGE WITHOUT NOTICE. NOTHING IN THIS DOCUMENT SHALL BE CONSTRUED AS GRANTING ANY LICENSE,

K4J52324QE-BJ1A

Abstract: K4J52324QE-BC14
Contextual Info: 512M GDDR3 SDRAM K4J52324QE 512Mbit GDDR3 SDRAM Revision 1.3 Feb 2008 INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS, AND IS SUBJECT TO CHANGE WITHOUT NOTICE. NOTHING IN THIS DOCUMENT SHALL BE CONSTRUED AS GRANTING ANY LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE,

AN045

Abstract: multiplexer 8bit to1 bit 3bit to 8 Multiplexer A22V10
Contextual Info: Philips Semiconductors Programmable Logic Devices Application Note High speed 8-bit parallel to serial converter INTRODUCTION A common function in many systems is to convert parallel data into a serial data stream. A microcontroller may be programmed to shift

Contextual Info: Freescale Semiconductor MPC8349EEC Rev. 3, 8/2005 Advance Information MPC8349E PowerQUICC II Pro Integrated Host Processor Hardware Specifications The MPC8349E contains a PowerPC processor core with system logic required for networking, storage, and general-purpose embedded applications. For functional

Contextual Info: 7 TH IS JÊ L DRAWING CO PYRIGHT 15 U N P U B L I S H E D . 19 RELEASED BY AMP INCORPORATED. FOR P U B L I C A T I O N ALL , 4 5 6 3 2 19 DI ST LOC REVISIONS AA 22 R IG H T S R E S E R V E D . D ESCRIPTION 5 00.79-0.89 [0.031 - .0 3 5 ] 36 H O L E S 03.15-3.25

H2570

Contextual Info: M ITSUBISHI LSIs MH25708TNA-85L,-10L,-12L,-15L/ MH25708TNA-85H,-10H,-12H,-15H i> 2 0 9 7 1 5 2 - B I T 2 6 2 1 4 4 - WORD BY 8-B IT C M O S STATIC RAM MODULE DESCRIPTION The M H 2 5 7 0 8 T N A is a 20 97152-b its C M OS static R A M PIN CONFIGURATION {TOP VIEW)

CCL-HL832HS

Abstract: 0100D-10 EMEG-770L CCL-HL-832 PXA250 and PXA210 manual 27864 EME-G770 ARM Version 5TE instruction set 0b1101011
Contextual Info: Intel PXA26x Processor Family Electrical, Mechanical, and Thermal Specification Data Sheet Product Features • ■ ■ ■ ■ ■ ■ ■ High Performance Processor — Intel® XScale Microarchitecture — 7 stage pipeline — 32 KB instruction cache

K4J52324QE-BC12

Abstract: K4J52324QE-BC14 K4J52324QE-BJ1A k4j52324qe K4J52324QEBC14 DDR2 x32 K4J52324Q samsung K4 ddr BJ11 WL02
Contextual Info: 512M GDDR3 SDRAM K4J52324QE 512Mbit GDDR3 SDRAM Revision 1.2 May 2007 INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS, AND IS SUBJECT TO CHANGE WITHOUT NOTICE. NOTHING IN THIS DOCUMENT SHALL BE CONSTRUED AS GRANTING ANY LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE,

K4J52324QC

Abstract: K4J52324QC-bj11
Contextual Info: 512M GDDR3 SDRAM K4J52324QC 512Mbit GDDR3 SDRAM Revision 1.5 June 2006 INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS, AND IS SUBJECT TO CHANGE WITHOUT NOTICE. NOTHING IN THIS DOCUMENT SHALL BE CONSTRUED AS GRANTING ANY LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE,

K4J10324QD

Abstract: k4j10324qd-hj1a K4J10324QD-HC14 K4J10324QD-HC12 GDDR3 SDRAM 256Mb T21N 32MX32 k4j10324qdhj1a gddr3
Contextual Info: 1Gb GDDR3 SDRAM K4J10324QD 1Gbit GDDR3 SDRAM 136FBGA with Halogen-Free & Lead-Free RoHS compliant Revision 1.2 May 2008 INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS, AND IS SUBJECT TO CHANGE WITHOUT NOTICE. NOTHING IN THIS DOCUMENT SHALL BE CONSTRUED AS GRANTING ANY LICENSE,

K4J52324QE-BC12

Contextual Info: 512M GDDR3 SDRAM K4J52324QE 512Mbit GDDR3 SDRAM Revision 1.1 January 2007 INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS, AND IS SUBJECT TO CHANGE WITHOUT NOTICE. NOTHING IN THIS DOCUMENT SHALL BE CONSTRUED AS GRANTING ANY LICENSE,