525MII Search Results

32 PIN

Contextual Info: Low Power SR A M Selection Guide 1/ 2 Maximum supply current Access time Capacity Organization Version Part number Operating Standby |mA| (j/A) Data14”*“1 retention (/»A) 70 (70 ns. 85 ns. 100 ns) 100 15 CZ: 32-pin DIP (600mil). GW: 32-pin SOP <525mii)

Contextual Info: Prelimianry CMOS SRAM KM684000AL / AL-L 512Kx8 Bit High Speed CMOS Static RAM FEATURES GENERAL DESCRIPTION • Fast Access Time : 55,70 ns Max. • Low power dissipation - Standby(CMOS) : 550nW (Max.) L Version : 110|iW(Max.) L-L Version - Operating : 385mW /MHz(Max.)

2183A

Contextual Info: KM68V1000C, KM68U1000C Family CMOS SRAM 128Kx8 bit Low Power & Low Vcc CMOS Static RAM FEATURE SUMMARY GENERAL DESCRIPTION • Process Technology : 0.4|jm CMOS • Organization : 128K x 8 • Power Supply Voltage KM68V1000C family : 3.3V ± 0.3V KM68U1000C family : 3.0V ± 0.3V

Contextual Info: SOP — XX C XX — SMT — TT Plating Position:. 28, 32 C = .450" Row Spacing Blank = Tube Pack TP = Tape and Reel body only ‘ Frames are packaged in vinyl bags T00S371 DD0D3tj7 PC Doara oattern 2 B 37T WWW 1. 271Q. 05 32 B A 2 1.85 24. B 16.51 19. 0 5

94v-0 m02

Abstract: ATMEL 32P
Contextual Info: SOCKETS SOP — 32 D XX — SMT — TT n Position:. 32 D = .525" Row Spacing Plating Blank = Tube Pack TP = Tape and Reel body only ‘ Frames are packaged in vinyl bags ^005371 00003bfl D HGb PC board pattern j j P S ' ± 0.3 General Tolerance ALL DIMENSIONS

Robinson Nugent IC SOCKET

Contextual Info: SOCKETS SOP — XX B XX — SMT — TT Plating Position:. 20, 28 . Blank = Tube Pack TP = Tape and Reel body only ‘ Frames are packaged in vinyl bags ‘nEOOOO TiESOOb B = .375" Row Spacing EEh s' PC board 1 = Body 2 = Frame 3 = SO Package IC oattern 1. 2 7 ± Q. Q5

P20GT-50-375B-2

Abstract: 945080
Contextual Info: SOCKETS SOP — 44 E XX — SMT — TT Plating Position:. 44 Blank = Tube Pack TP = Tape and Reel body only ‘ Frames are packaged in vinyl bags E = .600" Row Spacing T005371 000D370 I I I I I I Ijl I I I I I I I =lb4 am1 34 1= Body 2 = Frame 3 = SO Package IC

23C1011

Abstract: ay 5 1011
Contextual Info: KM23C1Û01/1011 G CMOS MASK ROM 1M-Bit (128Kx8) CMOS MASK ROM FEATURES GENERAL DESCRIPTION • • • • The KM23C1001/1011 is a fu lly s ta tic m ask program ­ m able ROM organized 1 3 1 ,0 7 2 x8 b it. It is fabricated using silicon-gate CMOS process technology.

ATMEL 32P

Abstract: toshiba 94V-0
Contextual Info: SOP— 40 D XX — SMT — TT .Plating Position:. 40 Blank = Tube Pack TP = Tape and Reel body only ‘ Frames are packaged in vinyl bags D = .525" Row Spacing. m E h T falEOOOO TiEBDDb a FF na 3 65 1 = Body 2 = Frame 3 = SO Package IC R e c o m m e n d e d PC b o a r d

Contextual Info: Preliminary KM68V4000B, KM68U4000B Family CMOS SRAM 512Kx8 bit Low Pow er & Low Vcc CMOS Static RAM FEATURE SUMMARY GENERAL DESCRIPTION • Process Technology : 0.4pm CMOS T he K M 68V 4000B and K M 68U 4000B fam ily are • Organization : 512K x 8 fabricated by SAMSUNG’S advanced CM O S process

Contextual Info: LH5P864 FEATURES • 65,536 x C M O S 512K 64K x 8 Pseudo-Static RAM DESCRIPTION 8 bit organization • Access time: 80 ns (MAX.) • Cycle time: 140 ns (MIN.) • Power supply: 5 V ± 10% • Power consumption: 440 mW (MAX.) • Operating temperature: 0 to 70°C

Contextual Info: KM68FV1000, KM68FS1000, KM68FR1000 Family CMOS SRAM 128Kx8 bit Super Low Vcc High Speed CMOS Static RAM FEATURE SUMMARY GENERAL DESCRIPTION • Process Technology : 0.4 um Full CMOS The KM68FV1000, KM68FS1000and KM68FR1000 • Organization : 128K x 8 family are fabricated by SAMSUNG'S advanced Full

004II

Abstract: a1215 KM68U512ALE-L KM68U512ALTGE-8L
Contextual Info: KM68V512A, KM68U512A Family_ CMOS SRAM 64Kx8 bit Low Power & Low Vcc CMOS Static RAM FEATURE SUMMARY GENERAL DESCRIPTION • Process Technology : 0.6 um CMOS • Organization : 64 K x 8 • Power Supply Voltage KM68V512A family : 3.3V +/- 0.3V

P20GT-50-375B-2

Contextual Info: SMT — TT SOP — XX A XX Plating Position:_ 8, 14, 20, 24 A = .300" Row Spacing .Blank = Tube Pack TP = Tape and Reel body only *Frames are packaged in vinyl bags •Ì00S371 G0003fc>5 O CD lO t ST7 t 1 = Body 2 = Frame 3 = SO Package IC

10C2

Abstract: 144PFB-A 48P4B 16P2S-A 240mil hssop Package tray dimension 12P9 16P2Z-A 18P4G
Contextual Info: MITSUBISHI INTEGRATED CIRCUIT PACKAGES PACKAGE SPECIFICATIONS 3.1 INDIVIDUAL PACKS Each type of package is used to carry individually packed products as listed below: PACKAGE AND INDIVIDUAL PACK LIST Package Type SIP HSIP ZIP DIP SDIP Package Name Standard Dimension

132SA

Abstract: km681000a
Contextual Info: SAMSUNG ELECTRONICS INC b4E D • 7'ìt.mMS 0 0 1 4 G 1 5 Ü61 ■ SMGK KM681OOOALI/ALI-L CMOS SRAM 131,072 WORD x 8 Bit CMOS Static RAM FEATURES GENERAL DESCRIPTION • Industrial Temperature Range: - 40 to 85°C • Fast Access Time: 70, 100ns Max. • Low Power Dissipation