432M Search Results

Contextual Info: N -C H A N N E L J U N C T IO N FET CHIP NUMBER CONTACT METALLIZATION r". Top Contact: > A Aluminum 12,000 017" 0 432mm Backside Contact: 3,000 A Gold ASSEMBLY RECOMMENDATIONS 017" (0 432mm) It is advisable that: a) the die be eutectically mounted with gold silicon preform 98/2%.

Contextual Info: LM158U Linear ICs Dual General Purpose Op Amp status Military/High-RelN Input Bias Current Max. A 300n Unity Gain BW (Hz)1.0M V(io) Max. (V)7.0m I(io) Max. (A)100n Com Mode Inp Range (VICR)30 Input Resistance Typ. (Ohms) Temp Coef. of VIO7.0u P(D) Max. (W)432m

Contextual Info: IBM0165800B 8M x 8 D R A M Features • Low Power Dissipation - Active: 504m W /432m W max - Standby (LVTTL Inputs): 7.2m W (max) - Standby (LVCMOS Inputs): 720m W (max) • 8 ,388,608 word by 8 bit organization • Single 3.3 ± 0.3V power supply • 4096 refresh cycles/64ms

Contextual Info: ISOMETRIC VIEW 13mm 0.5in 432mm 17in TOP VIEW 521mm 20.53in 188mm 7.41in 195mm 7.69in REAR VIEW L.S VIEW FRONT VIEW HPLD26 PART NUMBERS PAINTED TEXTURED BLACK NOTES HPLD Plinth side panels ordered separately to close ends See Hammond Website for Additional Accessories.

Contextual Info: 48A28S Linear ICs dc-to-dc/Charge Pump Voltage Converter status Military/High-RelN Output Voltage Nominal V 28 Load Current Max. (A)45m Drop-Out Volt Max. P(D) Max. (W)432m Nom. Supp (V)48 Minimum Operating Temp (øC)-25 Maximum Operating Temp (øC)70 Package StyleModule

DDR2 x32

Abstract: lpddr FCRAM 256Mb 256MBIT 256-MBIT
Contextual Info: Position of Consumer FCRAM „ High Data Bandwidth & Low Power Consumption Features – 3.5GByte/s with 64-bit I/O and Low Power DDR I/F, without termination resistors 256Mbit FCRAM Data Bandwidth (Byte/s) Low power consumption with CMOS I/F FCRAM x64, 432Mbps

OP295A

Contextual Info: 2003-02-12 PRODUKTINFORMATION Vi reserverar oss mot fel samt förbehåller oss rätten till ändringar utan föregående meddelande ELFA artikelnr 75-006-63 OP295A IR-diod 432mW/sr

Contextual Info: IBM0165400B 16M X 4 DRAM Features • Low Power Dissipation - Active: 504m W /432m W max - Standby (LVTTL Inputs): 7.2m W (max) - Standby (LVCMOS Inputs): 720 W (max) • 16,777,216 word by 4 bit organization • Single 3.3 ± 0.3V power supply • 4096 refresh cycles/64ms

465mm

Contextual Info: .045±.002 1.14±0.05mm .006/.012 REF. ' (,152/.305mm) "C T in ni .087±.003 (2.21±0.08mm) PIN TO A DEPTH OF .183 (4.65mm) .022 (.559mm) .080 MAX. (2.03mm) 'R. _ .0 1 7 MIN. (.432mm) .227 REF. (5.77mm) ,035±.001 (.889±0.025mm) .140±.005 (3.56±0.13mm)

TSOP 54 PIN

Contextual Info: IBM0165160B 4M x 16 DRAM Features • Low Power Dissipation - Active: 504mW/432mW/396mW max - Standby (LVTTL Inputs): 7.2mW (max) - Standby (LVCMOS Inputs): 720mW (max) • 4,194,304 word by 16 bit organization • Single 3.3 ± 0.3V power supply • 4096 refresh cydes/64ms

2n4117 equivalent

Abstract: 2N4117 2n4117a equivalent 2N4771 2N4119A equivalent 2n4119 2n4117a 2N3452 equivalent 2n4118 2n5902-2n5909
Contextual Info: l?[^@[D LD ir ©AITAtL ' IM-CHAIMIMEL J U N C T IO N FET CHIP NUMBER CONTACT METALLIZATION Top Contact: > A Aluminum r * 12,000 017" . (0 432mm) Backside Contact: 3,000 A Gold ASSEMBLY RECOMMENDATIONS 017" (0 432mm) It is advisable that: a) the die be eutectically mounted with gold silicon preform 98/2%.

Contextual Info: ISOMETRIC VIEW 13mm 0.5in 432mm 17in TOP VIEW 521mm 20.53in 88mm 3.47in 95mm 3.75in REAR VIEW L.S VIEW FRONT VIEW HPLD16 PART NUMBERS PAINTED TEXTURED BLACK NOTES HPLD Plinth side panels ordered separately to close ends See Hammond Website for Additional Accessories.

9744

Abstract: 438 j
Contextual Info: SMALL OUTLINE J-LEADED PACKAGE 28 PIN CERAMIC LCC-28C-A04 28-pin ceramic SOJ Lead pitch 50mil Package width 432mil Sealing method Metal seal Lead shape J bend LCC-28C-A04 28-pin ceramic SOJ (LCC-28C-A04) 18.42±0.25 (.725±.010) 10.98±0.25 (.432±.010)

Contextual Info: LTC2195 LTC2194/LTC2193 16-Bit, 125/105/80Msps Low Power Dual ADCs FEATURES n n n n n n n n n n n n DESCRIPTION 2-Channel Simultaneous Sampling ADC Serial LVDS Outputs: 1, 2 or 4 Bits per Channel 76.8dB SNR 90dB SFDR Low Power: 432mW/360mW/249mW Total 216mW/180mW/125mW per Channel

1.4957

Abstract: video splitter circuit diagram
Contextual Info: TRF3750 www.ti.com SLWS146A − MARCH 2004 − REVISED NOVEMBER 2004 HIGH-PERFORMANCE INTEGER-N PLL FREQUENCY SYNTHESIZER D D Lock Detect Output Digital and Analog D Versatile Hardware and Software Power Down D Packaged in a 16-Pin TSSOP Thin Quad FlatPack and a 20-Pin 4 x 4 mm QFN Package

SOIC-16

Abstract: VDE0884 AMC1203 IEC60747-5-2 IEC61010-1
Contextual Info: AMC1203 www.ti.com SBAS427B – FEBRUARY 2008 – REVISED MAY 2010 1-Bit, 10MHz, 2nd-Order, Isolated Delta-Sigma Modulator Check for Samples: AMC1203 FEATURES DESCRIPTION • • • • • • • The AMC1203 is a 1-bit, 10MHz, isolated delta-sigma ΔΣ modulator with an output buffer separated from

Lead Free reflow soldering profile BGA

Abstract: BGA-3591 Metcal BGA-3591 Metcal CSP 3502 CSP-3500 BGA-3590 BGA-3592 CSP-085-102 ceramic rework bga rework
Contextual Info: Worldwide and U.S. Headquarters 1530 O’Brien Drive Menlo Park, CA 94025 USA Phone: + 1-650-325-3291 1-800-776-1778 Fax: + 1-650-325-5932 Europe Headquarters Eagle Close, Chandler’s Ford Eastleigh Hampshire SO53 4NF U.K. Phone: + 44 23 8048 9100 Fax: + 44 23 8048 9109

IS136

Abstract: TRF3750 TRF3750IPW TRF3750IPWR TRF3750IRGP TRF3750IRGPR TSSOP-16 M310
Contextual Info: TRF3750 www.ti.com SLWS146B − MARCH 2004 − REVISED AUGUST 2007 HIGH-PERFORMANCE INTEGER-N PLL FREQUENCY SYNTHESIZER D D Lock Detect Output Digital and Analog D Versatile Hardware and Software Power Down D Packaged in a 16-Pin TSSOP Thin Quad FlatPack and a 20-Pin 4 x 4 mm QFN Package

Contextual Info: OPA551 OPA552 OPA 551 O PA OPA 551 551 SBOS100A – JULY 1999 – REVISED OCTOBER 2003 High-Voltage, High-Current OPERATIONAL AMPLIFIERS FEATURES ● ● ● ● ● ● ● ● ● DESCRIPTION WIDE SUPPLY RANGE: ±4V to ±30V HIGH OUTPUT CURRENT: 200mA Continuous

Contextual Info: TRF3750 www.ti.com SLWS146A − MARCH 2004 − REVISED NOVEMBER 2004 HIGH-PERFORMANCE INTEGER-N PLL FREQUENCY SYNTHESIZER D D Lock Detect Output Digital and Analog D Versatile Hardware and Software Power Down D Packaged in a 16-Pin TSSOP Thin Quad FlatPack and a 20-Pin 4 x 4 mm QFN Package

marking code SS SOT23

Abstract: MARKING CODE R2A marking CODE r1a R2B marking code R1B marking code 432T R2B making AP432 AP432N SOT-23 R2B
Contextual Info: Advanced Power Electronics Corp. AP432 Adjustable Precision Shunt Regulator „ Features „ General Description - Precision reference voltage B : 1.24V ± 1% A : 1.24V ± 0.5% - Sink current capability: 200mA. - Minimum cathode current for regulation: 150µA

mjcp

Abstract: CCIR 656 GIO40
Contextual Info: TMS320DM368 SPRS668C – APRIL 2010 – REVISED JUNE 2011 www.ti.com TMS320DM368 Digital Media System-on-Chip DMSoC Check for Samples: TMS320DM368 1 TMS320DM368 Digital Media System-on-Chip (DMSoC) 1.1 Features 12 • Highlights – High-Performance Digital Media

Contextual Info: AMC1203 SBAS427C – FEBRUARY 2008 – REVISED JUNE 2011 www.ti.com 1-Bit, 10MHz, 2nd-Order, Isolated Delta-Sigma Modulator Check for Samples: AMC1203 FEATURES DESCRIPTION • • • • • • • The AMC1203 is a 1-bit, 10MHz, isolated delta-sigma ΔΣ modulator with an output buffer separated from

bPA20

Contextual Info: •HYUNDAI H Y 5 1 V 1 7 1 0 0 A S e r ie s 16M x 1-bit CMOS DRAM PRELIMINARY DESCRIPTION The HY51V17100Ais the new generation and fast dynamic RAM organized 16,777,216 x 1-bit. The HY51V17100A utilizes Hyundai's CMOS silicon gate process technology as well as advanced circuit techniques to provide wide