2N4771 Search Results

Contextual Info: N -C H A N N E L J U N C T IO N FET CHIP NUMBER CONTACT METALLIZATION r". Top Contact: > A Aluminum 12,000 017" 0 432mm Backside Contact: 3,000 A Gold ASSEMBLY RECOMMENDATIONS 017" (0 432mm) It is advisable that: a) the die be eutectically mounted with gold silicon preform 98/2%.

2n4117 equivalent

Abstract: 2N4117 2n4117a equivalent 2N4771 2N4119A equivalent 2n4119 2n4117a 2N3452 equivalent 2n4118 2n5902-2n5909
Contextual Info: l?[^@[D LD ir ©AITAtL ' IM-CHAIMIMEL J U N C T IO N FET CHIP NUMBER CONTACT METALLIZATION Top Contact: > A Aluminum r * 12,000 017" . (0 432mm) Backside Contact: 3,000 A Gold ASSEMBLY RECOMMENDATIONS 017" (0 432mm) It is advisable that: a) the die be eutectically mounted with gold silicon preform 98/2%.