27514 Search Results

101490

Abstract: 33797 B57875S0212F000 B57875S0212H000 k 3569 81 718990 3567 EPCOS
Contextual Info: NTC thermistors for temperature measurement Leaded NTCs, lead spacing 5 mm Series/Type: Date: B57875 March 2006 EPCOS AG 2006. Reproduction, publication and dissemination of this publication, enclosures hereto and the information contained therein without EPCOS' prior express consent is prohibited.

101490

Abstract: 40409 Transistor 20417 33797 40409 73006 B57885S0103 001 Epcos 2908 EPCOS 800 376 B57885S0212
Contextual Info: NTC thermistors for temperature measurement Leaded NTCs, lead spacing 5 mm Series/Type: Date: B57885 March 2006 EPCOS AG 2006. Reproduction, publication and dissemination of this publication, enclosures hereto and the information contained therein without EPCOS' prior express consent is prohibited.

merlin gerin NS100N

Abstract: merlin gerin catalogue Merlin Gerin shunt trip mx merlin gerin C60 multi 9 Merlin Gerin ns160n merlin gerin C60n Merlin Gerin CIRCUIT BREAKER merlin gerin NS250h C60H Circuit Breakers Catalogue merlin gerin C60n - 24338
Contextual Info: Catalogue 2004 Merlin Gerin Miniature circuit-breakers and earth leakage circuit-breakers MCBs/ELCBs contents page Miniature circuit-breakers RCCB / ELCB Technical information Mini pragma din kit Merlin Gerin C60a 2 C60N 3 C60H 4 C60N UL489 - DC circuit breaker

256kx8 sram 5v

Abstract: 50-PIN
Contextual Info: DENSE-PAC 2 Megabit High Speed CM OS SRAM MICROSYSTEMS DPS128X16Cn3/DPSl 28X16Bn3 D E S C R IP T IO N : The DPS128X16Cn3/DPS128X16Bn3 High Speed SRAM "S T A C K " modules area revolutionary new memory subsystem using Dense-Pac Microsystems' ceram ic Stackable Leadless Chip Carriers SLCC .

DPS128C32BV3

Contextual Info: DENSE-PAC MICROSYSTEMS 4 Megabit High Speed CMOS SRAM DPS128C32BV3 DESCRIPTION: T he D P S 128C 32B V 3 "VERSA-STACK" module is a revolutionary new high speed memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCQ mounted on a co-fired ceramic

bma 023

Abstract: DPZ128X32IV3
Contextual Info: DENSE-PAC MICROSYSTEMS 4 M E G A B IT FLASH E EP R O M DPZ128X32IV3 D E S C R IP T IO N : The D PZ 1 2 8X 3 2 IV 3 "V E R S A - S T A C K " module ¡s a revolutionary new memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers

050I

Contextual Info: DENSE-PAC 4 MEGABIT FLASH EEPROM DPZ256X16ln3 M I C R O S Y S T E M S D E S C R IP T IO N : The DPZ256X16ln3 "STA C K" modules are a revolutionary new memory subsystem using D ense-Pac M icrosystem s' ceram ic Stackable Leadless Chip Carriers SLCC . Available in straight

KA3213

Abstract: KA32 KS5112 30A10 3A29
Contextual Info: DENSE-PAC 32 Megabit CMOS DRAM DPD2MX16M2H3 M I C R O S Y S T E M S PRELIMINARY DESCRIPTION: The DPD2MX16M2H3 "STA C K" module is a revolutionary new memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCC stacked and leaded for

lem HA

Abstract: 50-PIN dps128m8bny
Contextual Info: DENSE-PAC 1 Megabit High Speed CMOS SRAM M I C R O S Y S T E M S DPS128M8CnY/BnY, DPS128X8CA3/BA3 DESCRIPTION: The DPS 128M8CnY/BnY, DPS128X8CA3/BA3 H igh Speed SRAM devices are a revolutionary new m em ory subsystem using Dense-Pac Microsystems' ceram ic Stackable Leadless C hip Carriers SLCC .

OL80m

Abstract: DPS128X32BV3 DPS128X32CV3
Contextual Info: DENSE-PAC 4 Megabit High Speed CMOS SRAM DPS128X32CV3/DPS128X32BV3 M I C R O S Y S T E M S D ESCRIPTIO N : The D PS128X32CV 3/D PS128X32EV3 "V ER S A - S T A C K " m odule is a revolutionary new high speed m em ory subsystem using Dense-Pac Microsystems' ceram ic Stackable Leadless Chip Carriers SLCC

DPS512S8AP

Abstract: 165001
Contextual Info: DENSE PAC 4 Megabit High Speed CMOS SRAM M I C R O S Y S T E M S DPS512S8AP DESC RIPTIO N: The DPS512S8AP is a high speed 5 1 2K x 8 high-density, lo w -p o w e r static RAM m odule comprised of four high speed ceramic 128K x 8 monolithic SRAM's, an advanced high-speed CMOS

pico fuse color code

Abstract: picofuse 5000 2750500000 2751250000 Marking code WMP 275110C pico fuse marking WMP 2751250005 PICOFUSE 275
Contextual Info: REV. c o m m u n ica tio n s PART SPECIFICATION SHEET Security & Detection Systems O R IG IN A T O R : T o d d H e in o d e s c r ip tio n : 5A PCB Mount Axial Pico Fuse f | u | S | e | , | I 3 I 1 I 2 Il - l . . ! ! o | P 1I | C | 0 | •| I 5 Ia| | a | x | i | a | l |

Contextual Info: 16 14 15 13 12 11 10 8 SYMBOL DEFINITION A DIMENSION WITHOUT AN INSPECTION REPORT SYMBOL DOES NOT REQUIRE INSPECTION. IT MAY BE CONTROLLED ON THE INDIVIDUAL COMPONENT DRAWING. GD (4 9 . 1 ) M MISSING SYMBOLS TOTAL NO OF INSPECTIONS REQUIRED NO T E S 1.

mj 13002

Abstract: transistor 40409 101490 40409 Transistor 62552 42003 75282 40409 NTC Thermistor 301 B57885S0103 001
Contextual Info: NTC thermistors for temperature measurement Leaded NTC thermistors, lead spacing 5 mm Series/Type: B57885S Date: February 2009 EPCOS AG 2009. Reproduction, publication and dissemination of this publication, enclosures hereto and the information contained therein without EPCOS' prior express consent is prohibited.

Contextual Info: DENSE-PAC 12 Megabit High Speed CMOS SRAM MICROSYSTEMS DPS512X24MFn3 ADVANCED INFORMATION DESCRIPTION : The DPS512X24MFn3 High Speed SRAM "S T A C K " modules are a revolutionary new memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCC .

4kx16 sram

Contextual Info: DENSE-PAC m C R O S Y S T E M S D7E D | 275^415 DGDGIDD 1 | 4KX4 BASED Dense-Pac 7^ Microsystems, Inc. DESCRIPTION: CMOS SRAM FAMILY - DIPS DPS88H04 - 7 V i/ * - P 3 - / Z- The 4KX4 Based Family is part of a new line of high speed static RAM modules developed by Dense-Pac Microsys­

Contextual Info: DENSE-PAC MICROSYSTEMS 9 Megabit CMOS SRAM DPS256X36L PRELIM INARY DESCRIPTION: The DPS256X36L is a 256K X 36 high-density, low-power static RAM module comprised of eight 256K X 4 and four 256K x 1 monolithic SRAM's and decoupling capacitors surface mounted on a FR-4

54HC30

Abstract: M38bl 1M38510
Contextual Info: REVISIONS LTR DATE VR-MO-M DESCRIPTION Inactivate case outline 01AX for new design. Add vendor CAGE 27014 to case outline 01DX. Editorial changes throughout APPROVED 88 APR. 7 Device type 01, case outline 2 inactive for new design as of 11 Sept 87 Device type 01, case outline C

82305

Abstract: CMOS 4066 B3560 BAR63 BBY39 PIC16C56 HP MASTER SELECTION GUIDE RF 89552 dsp lsb modulation demodulation HP 4066 15k
Contextual Info: Gran-Jansen AS GJRF USER GUIDE 2nd issue User tips Applications Preliminary test reports GRAN-JANSEN AS Slemdalsveien 70 * PO Box 187 Vinderen * 0319 Oslo * Norway Tel: +47 22 49 48 01 * Fax :+47 22 49 59 03 granjan@sn.no * http//www.sn.no/granjansen GJRF USER GUIDE

IEC-1169-1

Abstract: connector N for RG 213 coaxial cable 133NE RG 393 cable sm 141 cable crimp tools suhner 32NPC EF142 RG-213 cable QN-50-7-1
Contextual Info: SERIES QN, COAXIAL CONNECTORS DESCRIPTION CONTENT HUBER+SUHNER QN coaxial connectors are available with 50 8 impedance. The frequency range extends to 11 GHz, depending on the connector and cable type, however most of the QN connectors are Return Loss optimised for frequencies up to 6 GHz. The interface is based on the inner dimensions of the N connector, but, instead of a threaded coupling mechanism,

Contextual Info: 16 14 15 13 12 11 10 8 SYMBOL DEFINITION A DIMENSION WITHOUT AN INSPECTION REPORT SYMBOL DOES NOT REQUIRE INSPECTION. IT MAY BE CONTROLLED ON THE INDIVIDUAL COMPONENT DRAWING. ( 6X 24 ) M — 6X 1.2 ±0,1 TYP TOTAL NO OF INSPECTIONS REQUI RED LU <> 0. 3

Contextual Info: DENSE-PAC 8 Megabit CM OS SRAM DPS256S32AW MICROSYSTEMS ADVANCED INFORMATION DESCRIPTION: The D P S 2 5 6 S 3 2 A W is a 2 5 6 K x 32 high-density, static RAM module comprised of eight 1 2 8 K x 8 m o nolithicSRA M 's,an advanced high-speed CM O S decoder,

CERAMIC FLATPACK

Abstract: cerdip 28- brazed ceramic
Contextual Info: SENSE-PAC HICROSYSTEMS C Î3 P M BSE I • 275^15 ODD037M S H D P C DPS128M8 Dense-Pac Microsystems, Inc. ^ CERAMIC 128K X 8 CM OS SRAM MONOLITHIC T -4 C -2 1 -J4 DESCRIPTION: The DPS128M8 is a monolithic 128K X 8 Static Random Access Memory SRAM fabricated using

DPV12832V

Abstract: 4-00J1 Dense-Pac Microsystems
Contextual Info: DENSE-PAC MICR OSY STEMS 2ÔE D • £75=1415 OOQQIBb ? «] >PC DPV12832V Dense-Pac Microsystems, Inc. ^ 128K X 32 UVEPROM VERSAPAC X 4 ¿ ,- / 3 '2 9 DESCRIPTION: The DPV12832V is a 66-pin Pin Grid Array PGA consisting of four 128K X 8 UVEPROM devices in