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    KA3213

    Abstract: KA32 KS5112 30A10 3A29
    Contextual Info: DENSE-PAC 32 Megabit CMOS DRAM DPD2MX16M2H3 M I C R O S Y S T E M S PRELIMINARY DESCRIPTION: The DPD2MX16M2H3 "STA C K" module is a revolutionary new memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCC stacked and leaded for


    OCR Scan     		dpd2mx16m2h3dpd2mx16m232-megabits100ns+940-pin30a106-1s275t4150qq137ka3213ka32ks511230a103a29 PDF

    cb-rj

    Contextual Info: DENSE-PAC ^ _ Me abit CMOSdram 32 8 MICROSYSTEMS DPD2MX16M2H3 PRELIMINARY DESCRIPTION: TheDPD2M X16M 2H3 "STA C K" module is a revolutionary new memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCQ stacked and leaded for


    OCR Scan     		dpd2mx16m2h332-megabits30a108-18100ns+23qa10b-18cb-rj PDF

    DP5Z

    Contextual Info: n INDEX GENERAL PRODUCT INFORMATION Dense-Pac Memory Module and Monolithic E merging T echnology / Products. Quality and R e lia b ilit y . Warranty . . 6 . 7 . 8 14 SRAM PRODUCTS


    OCR Scan     		128kx864kx16256kx8384kx8+1dp5z PDF