384KX8 Search Results

Contextual Info: DENSE-PAC MICROSYSTEMS MegabiJ High Speed CMOS SRAM DPS128X24Bn3 D ESCRIPTIO N : The DPS128X24Bn3 High Speed SRAM "STACK" modules are a re vo lu tio n a ry new mem ory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCC .

Contextual Info: DENSE-PAC MICROSYSTEMS 3 Megabit High Speed CMOS SRAM DPS128X24Bn3 DESCRIPTION: The DPST28X24Bn3 High Speed SRAM "STACK" modules are a revolutionary new memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCC . Available in straight leaded, "J" leaded or gullwing leaded

HT66F004

Abstract: HT48R002 HT66F002 HT16K33 HT46R002 HT12F application circuit HT66F018 HT46R004 HT46R0042 HT46R066B
Contextual Info: Holtek Company Introduction Introduction Unrelenting growth and the release of a continuous stream of competitive and functionally rich new semiconductor devices onto the global market has been the hallmark of Holtek Semiconductor since the establishment of the company back in 1983 to the present

Contextual Info: 3 Megabit High Speed CMOS SRAM DPS128X24Bn3 DESCRIPTION: The DPS128X24Bn3 High Speed SRAM ‘’STACK’’ modules are a revolutionary new memory subsystem using Dense-Pac Microsystems’ ceramic Stackable Leadless Chip Carriers SLCC . Available in straight leaded, ‘’J’’ leaded or gullwing leaded

Contextual Info: DENSE-PAC 3 Megabit High Speed CM OS SRAM M Í C R O S Ÿ S T H VI S DPS128X24Bn3 DESCRIPTION: The DPS128X24Bn3 High Speed SRAM "STACK" modules are a revolutionary new memory subsystem using Dense-Pac Microsystems' ceramic Stackable Lead less Chip Carriers 5LCQ.

am 332

Contextual Info: DENSE-PAC MICROSYSTEMS 3 Megabit High Speed CMOS SRAM DPS128X24Bn3 DESCRIPTION: The DPS128X24Bn3 High Speed SRAM "STACK" modules are a re vo lu tio n a ry new memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCC . Available in straight leaded, "J" leaded or gullwing leaded

DP5Z

Contextual Info: n INDEX GENERAL PRODUCT INFORMATION Dense-Pac Memory Module and Monolithic E merging T echnology / Products. Quality and R e lia b ilit y . Warranty . . 6 . 7 . 8 14 SRAM PRODUCTS

Contextual Info: DENSE-PAC 3 Megabit High Speed CMOS SRAM M ÍC ROS Y S T E M S DPS128X24Bn3 DESCRIPTION: The DPS128X24Bn3 High Speed SRAM "STACK" modules are a revolutionary new m em ory subsystem using Dense-Pac Microsystems' ceramic Stackable Lead less Chip Carriers SLCC .

48-PIN

Contextual Info: REFERENCE SIZE SRAM 1 M egabit PART NUMBER 3 M egabit SPEED ns PACKAGE 128Kx8 7 0 ", 85, 100, 120, 150 32-Pin D IP 32-Pin F LA T P A C 15 128Kx8, 64Kx16, 32Kx32 25, 35, 45, 55, 70 66-Pin P G A 23 2 0 *, 25, 30, 35, 45 48-Pin SLC C 48-Pin ° r Lead 48-Pin y Lead

A273D

Abstract: 16J3 512X32 48pin
Contextual Info: R E F E R E N C E D R A O RG AN IZA TIO N PART NUMBER SIZE M P R O D 512 M egabit 6 4 0 Megabit 1024 Megabit 1152 Megabit 1152 Megabit S I Î A M P SPEED ns PACKAGE 16M x4 60, 70, 80 26-Pin TStack 19 16M x32 70, 80, 100 72-Pin S IM M 29 DPD16M X32PKW 5 16M x32