104004 Search Results

glenair

Abstract: Glenair 06324 1040-03 M.104004 removal tool 104004
Contextual Info: ITH Rigid Insert Connectors Insertion and Removal Tools for Assembly of ITH Connectors INSERTION & REMOVAL TOOLS M.104013 M.104003 M.104004 M.104005 M.104014 M.104006 M.104007 M.104008 Removal tool for #20 contacts Removal tool for #16 contacts Removal tool for #12 contacts

Contextual Info: V58C2128 804/404/164 SB HIGH PERFORMANCE 128 Mbit DDR SDRAM 4 BANKS X 4Mbit X 8 (804) 4 BANKS X 2Mbit X 16 (164) 4 BANKS X 8Mbit X 4 (404) 5 6 DDR400 DDR333 7.5 ns 7.5 ns Clock Cycle Time (tCK2.5) 6ns 6 ns Clock Cycle Time (tCK3) 5ns 6 ns 200 MHz 166 MHz Clock Cycle Time (tCK2)

100MHZ

Abstract: 133MHZ PC200 V827332U04S
Contextual Info: MOSEL VITELIC V827332U04S 2.5 VOLT 32M x 72 HIGH PERFORMANCE REGISTERED ECC DDR SDRAM MODULE PRELIMINARY Features Description • 184 Pin Registered 33,554,432 x 72 bit Organization DDR SDRAM Modules ■ Utilizes High Performance 16M x 8 DDR SDRAM in TSOPII-66 Packages

2N5866

Abstract: 2n4348 semiconductor 212S 2N5675 2N5867 2N5872 NES 2N5672 2n5038 2n3447
Contextual Info: NElil ENGLAND SEMICONDUCTOR bSbM ^a S'ìE D dogooss lc M AX — 2-50 A V ceo(sus) = 3 5-5 00 V fT = 0.2-50 MHz NPN TO-3 Case 803 Case 804 PN P Complé­ ment -r-33 -6( Icev @ V ce (mA @ V) Po @ TC = 25 °C (Watts) 025b@30 025b@30 025 @30 025b@30 75 75 75

USCAR-30

Abstract: Sicma automotive connector 20 pin 2x10, 2.54mm pitch header connectors GMW3191 yazaki clip 1.50mm Size FCI SICMA Male Terminal T32 fuse l 250v FCI sicma ES-40000-5013 Yazaki mounting clip
Contextual Info: Transportation Products Overview. T-2 1.00mm .040" Pitch System – 040 III. T-3 to T-5

Contextual Info: COPYRIGHT TRP connector ALL RIGHTS REVISIONS RESERVED P LTR DESCRIPTION DATE L OGO CHANGE B DWN RL 18 A P R 2 0 13 APVD KZ o BRA. um um c o PHOR FMI c 9 BRONZE um um um S . C ED FENS, CARBON S FRAME um Cum um um WI c um OR PURF BASE IMPFDANCE OPEN 8mADC

Contextual Info: V826616J24SC 16M x 64 HIGH PERFORMANCE UNBUFFERED DDR SDRAM MODULE Features Description • 184 Pin Unbuffered 16,777,216 x 64 bit Organization DDR SDRAM Modules ■ Utilizes High Performance 16M x 16 DDR SDRAM in TSOPII-66 Packages ■ Single +2.5V ± 0.2V Power Supply

dax6

Abstract: Mobile SDRAM
Contextual Info: V55C1256164MG 256Mbit MOBILE SDRAM 1.8 VOLT, TSOP II / FBGA PACKAGE 16M X 16 75 9 10 System Frequency fCK 133 MHz 111 MHz 100MHz Clock Cycle Time (tCK3) 7.5ns 9.0 ns 10 ns Clock Access Time (tAC3) CAS Latency = 3 6.0 ns 7.0 ns 8.0ns • Available in 54-ball FBGA (with 9x6 ball array

100MHZ

Abstract: 133MHZ PC200 V827332K04SATG V827332K04SXXX
Contextual Info: MOSEL VITELIC V827332K04SATG 2.5 VOLT 32M x 72 HIGH PERFORMANCE UNBUFFERED ECC DDR SDRAM MODULE PRELIMINARY Features Description • 184 Pin Unbuffered 33,554,432 x 72 bit Organization DDR SDRAM Modules ■ Utilizes High Performance 16M x 8 DDR SDRAM in TSOPII-66 Packages

V62C2804096

Contextual Info: MOSEL VITELIC PRELIMINARY V62C2804096 512K X 8, CMOS STATIC RAM Features Description • ■ ■ ■ ■ ■ ■ ■ The V62C2804096 is a very low power CMOS static RAM organized as 524,288 words by 8 bits. Easy memory expansion is provided by an active LOW CE1, and active HIGH CE2, an active LOW

PC200

Contextual Info: V826416S04SATG 2.5 VOLT 16M x 64 HIGH PERFORMANCE UNBUFFERED DDR SDRAM MODULE MOSEL VITELIC PRELIMINARY Features Description • 184 Pin Unbuffered 16,777,216 x 64 bit Organization SDRAM Modules ■ Utilizes High Performance 16M x 8 SDRAM in TSOPII-66 Packages

ProMOS ddr2

Abstract: 2rx16 DDR2-400 DDR2-533 DDR2-667 PC2-3200 PC2-5300 V91676
Contextual Info: V916764B24QA 64M x 64 HIGH PERFORMANCE UNBUFFERED DDR2 SDRAM SODIMM Features Description • The V916764B24QA memory module is organized as 67,108,864 x 64 bits in a 200 pin memory module. The 64M x 64 memory module uses 8 ProMOS 32M x 16 DDR2 SDRAMs. The x64 modules

V54C3128164VAT

Contextual Info: V54C3128164VAT HIGH PERFORMANCE 143/133/125MHz 3.3 VOLT 8M X 16 SYNCHRONOUS DRAM 4 BANKS X 2Mbit X 16 MOSEL VITELIC PRELIMINARY 7PC 7 8PC System Frequency fCK 143 MHz 143 MHz 125 MHz Clock Cycle Time (tCK3) 7 ns 7 ns 8 ns Clock Access Time (tAC3) CAS Latency = 3

USCAR-30

Contextual Info: HSAutoLink High Speed In-Vehicle Data Bus FEATURES AND SPECIFICATIONS HSAutoLink™ Interconnect System High-Speed In-Vehicle Databus Leveraging Molex expertise at producing highspeed cable technology and adapting to needs of the emerging segment of the “Connected

V916765K24QA

Contextual Info: V916765K24QA 128M x 64 HIGH PERFORMANCE UNBUFFERED DDR2 SDRAM MODULE Features Description • 240-pin, unbuffered dual in-line memory module • JEDEC standard 1.8V + 0.1V power supply • VDDQ=1.8V + 0.1V • Fast data transfer rate: PC2-3200, PC2-4200, or

g5400

Contextual Info: V916732J24QC 32M x 64 HIGH PERFORMANCE UNBUFFERED DDR2 SDRAM MODULE Features Description • • • • The V916732J24QC memory module is organized as 33,554,432 x 64 bits in a 240 pin memory module. The 32M x 64 memory module uses 4 ProMOS 32M x 16 DDR2 SDRAMs. The x64 modules are ideal for use in high performance computer

Contextual Info: V437432E24VD 3.3 VOLT 32M x 72 HIGH PERFORMANCE REGISTERED SDRAM ECC MODULE Features Description • 168 Pin Registered ECC 33,554,432 x 72 bit Oganization SDRAM Modules ■ Utilizes High Performance 32M x 8 SDRAM in TSOPII-54 Packages ■ Fully PC Board Layout Compatible to INTEL’S

Contextual Info: V917565K24QA 128M x 72 HIGH PERFORMANCE UNBUFFERED DDR2 ECC SDRAM MODULE Features Description • 240-pin, unbuffered dual in-line memory module • JEDEC standard 1.8V + 0.1V power supply • VDDQ=1.8V + 0.1V • Fast data transfer rate: PC2-3200, PC2-4200, or

Contextual Info: V917564U24QA 512M x 72 HIGH PERFORMANCE REGISTERED DDR2 ECC SDRAM MODULE Features Description • 240-pin, registered dual in-line memory module • JEDEC standard 1.8V + 0.1V power supply • VDDQ=1.8V + 0.1V • Fast data transfer rate: PC2-3200, PC2-4200, or

Contextual Info: PRELIMINARY V59C1G01 408/808/168 QA HIGH PERFORMANCE 1Gbit DDR2 SDRAM 8 BANKS X 32Mbit X 4 (408) 8 BANKS X 16Mbit X 8 (808) 8 BANKS X 8Mbit X 16 (168) 3 25A 25 19A DDR2-667 DDR2-800 DDR2-800 DDR2-1066 Clock Cycle Time (tCK3) 5ns 5ns 5ns 5ns Clock Cycle Time (tCK4)

Contextual Info: V58C2256 804/404/164 SA HIGH PERFORMANCE 256 Mbit DDR SDRAM 4 BANKS X 8Mbit X 8 (804) 4 BANKS X 4Mbit X 16 (164) 4 BANKS X 16Mbit X 4 (404) 5B 5 6 7 DDR400 DDR400 DDR333 DDR266 7.5 ns 7.5 ns 7.5 ns 7.5ns Clock Cycle Time (tCK2.5) 5ns 6ns 6 ns 7ns Clock Cycle Time (tCK3)

V54C3128

Contextual Info: V54C3128 16/80/40 4VB 128Mbit SDRAM 3.3 VOLT, TSOP II / FBGA 8M X 16, 16M X 8, 32M X 4 6 7PC 7 8PC System Frequency (fCK) 166 MHz 143 MHz 143 MHz 125 MHz Clock Cycle Time (tCK3) 6 ns 7 ns 7 ns 8 ns Clock Access Time (tAC3) CAS Latency = 3 5.4 ns 5.4 ns 5.4 ns

Contextual Info: V58C2128 804/404/164 SB HIGH PERFORMANCE 128 Mbit DDR SDRAM 4 BANKS X 4Mbit X 8 (804) 4 BANKS X 2Mbit X 16 (164) 4 BANKS X 8Mbit X 4 (404) 5 6 DDR400 DDR333 7.5 ns 7.5 ns Clock Cycle Time (tCK2.5) 6ns 6 ns Clock Cycle Time (tCK3) 5ns 6 ns 200 MHz 166 MHz Clock Cycle Time (tCK2)

Contextual Info: V54C365 16/80/40 4VE 64Mbit SDRAM 3.3 VOLT, TSOP II / FBGA 4M X 16, 8M X 8, 16M X 4 6 7PC 7 8PC System Frequency (fCK) 166 MHz 143 MHz 143 MHz 125 MHz Clock Cycle Time (tCK3) 6 ns 7 ns 7 ns 8 ns Clock Access Time (tAC3) CAS Latency = 3 5.4 ns 5.4 ns 5.4 ns