YAMAICHI IC TEST SOCKET Search Results

Contextual Info: IC160 Series | YAMAICHI ELECTRONICS Page 1 of 4 Home | Site Map | Japanese | Our News & Events Products & Services About Us Contact Us Products & Services Connectors PLCC Flexible Printed Boards 1.27mm pitch IC Sockets Test & Burn-in Sockets Production IC Sockets

MO-069

Contextual Info: OPEN TOP TYPE TEST & BURN-IN IC SOCKETS B.Q.F.P. Bumpered Quad Flat Pack YAMAICHI 211 Series • ORDERING CODE IC211 - 084 4 - 001 N - K Protection Key K: With Protection Key No Mark: Without Protection Key Positioning Pin N: Without Positioning Pin _No Mark: With Positioning Pin

WA51-0442-1709

Contextual Info: 1.5 in 0.95 in 0.6 in 1.5 in 0.2 in 0.2 in 0.1 in 0.1 in 44 pin TSOP Clamshell Type II to 0.1" Square Matrix Through Board Part Number WA51-0442-1709 Product Group IC Test Sockets & Mating Prototyping Adapters Pin Count 44 Yamaichi Socket Number IC51-0442-1709

54B5

Abstract: ICP-144-1 ICP-044-2 61B5 IC148 05-B5 ctvps qfp 100 SOCKET
Contextual Info: IC149 Series QFP 0.4~1.OmmPitch (@e£CTTONIC5^ Features h m ñ r m u ^ Q F P i M i c y 'r 7 k z h t c s v j ic t m - 7 'y ^ J W - x D t c t b s s z m m a m t t o (ICP) b z r 'C y f 'y ? QFP-test socket developed using Yamaichi Electronics expertise in Test & Burn-in IC socket production

IC51-2084-1509

Contextual Info: 3.1 in 0.8 in 0.063 in 3.1 in 0.1 in 0.2 in 208 pin MQUAD Clamshell to 0.1" Square Matrix Through Board Part Number WA51-2084-1509 Product Group IC Test Sockets & Mating Prototyping Adapters Pin Count 208 Yamaichi Socket Number IC51-2084-1509 All information contained in this document remains the interllectual property of Winslow Adaptics

5- pin smd IC 358

Abstract: P-MQFP-80-1 yamaichi IC Test Socket DK55 TSOP 54 SOCKETS smt mount C176CR C513 HR 7058 IC51-0804-956-2 P-MQFP-44
Contextual Info: YAMAICHI - Product Information page 1 of 6 Karl-Schmid-Straße 9 D-81829 München Telefon 0 89 / 45 10 21-0 Telefax 0 89 / 45 10 21-10 E-mail: sales@yamaichi.de Internet: http://www.yamaichi.de IC149 Production Use Socket for following Siemens IC`s: • C511 / C513

IN49

Contextual Info: YAMAICHI TCP TAB Test &Bum-In Socket Body M a te n a J: © © Polyethersulphone (PES) glass filled C ontact M a te ria l: © -(0 ) Beryllium Copper (BeCu) C ontact P lating: Gold over N ickel Specifications: Insulation Resistance W ithstanding Voltage

Contextual Info: IC 275 Series IC275-16S 05 •i.-"'rr — Socket Series No. of Leads 3— 1 Design N o | j^raderisti^ Insulation Resistance: Withstanding Voltage: 1,OOOMQminimum at 700 VDC Contact Resistance: 700 VAC for 1 Minute 2mQ or less at 10mA/20mV (Initial) Operating Temperature:

28 PIN lcc socket

Contextual Info: CMOS EPROM Surface Mount Programming Adapter Manufacturers As the market for nonvolatile memory parts in surface mount packages increases, so does the interest in simple, low cost pro­ gramming socket adapters. These adapters allow users of standard programming equip­

yamaichi IC Test Socket

Abstract: IC299 testing of diode SOP socket socket Yamaichi IC299 8 pin lead sop TSOP 50 socket contactor SSOP SOCKET
Contextual Info: IC299 Series Test Contactor HF Socket / Handler - (Y Shaped SMT Contacts) Specifications 1,000M Ω min. at 500V DC Insulation Resistance: Dielectric Withstanding Voltage: 500V AC for 1 minute Contact Resistance: 30mΩ max. at 10m /20mV max. Operating Temperature Range: –20°C to +125°C

Contextual Info: YAMAICHI Interstitial P.G.A. Test &Burn-In Socket 78.0 74.0 NP178 Series 7 0 RfF SO0 11 1? 1 13.2 INITIAL POSITION Of COVER REFERENCE PRESSED DO»N POSITION OF COVER (REFERENCE) 4-D1A. 2 .2THRU HO LE/ 64.0 ±0.2 INITIAL po sition of cover Body Material:

IC26-0803-GG4

Abstract: MSP88LV020 MSP88LV ic160z-0444-24" msp88 IC26-1403-GG4 fujitsu device NVPROM cross reference IC26-0803 30-B5
Contextual Info: YAMAICHI ELECTRONICS Production 1C Sockets IC26 S /y - X SIP IC 140$/'J-X (DIP) IC26Series(SIP) IC140Series(DIP) ►P02 1 I »-P09' IC30 î / ' J - X (SIP) IC1602/U—X(PLCC) IC30Series(SIP) IC160 Series(PLCC) IC140 $ /'J -X (SIP) IC 149S/U -X (QFP) IC140Series(SIP)

IC51-1004-809

Abstract: socket Yamaichi ic51 PCA4989 80p6n 80P6S IC51-0804-819-6 IC51-0804-808 IC51-0644-1329
Contextual Info: PCA4979 Converter from 80-pin 0.65mm-pitch QFP 80P6S-A to 40-pin DIL Standard Pitch Function The PCA4979 is a board that converts an 80-pin 0.65mm-pitch QFP (80P6S-A) to the standard pitch. Pin No. 1 corresponds to pin No. 1. Application Use the PCA4979 as a test board to connect an 80P6S-A MCU

lcd pm 128 bl

Abstract: FPS009-2700-0 Yamaichi Electronics ic197 FMS006-2600-0 IC149 CN048S-1002-0 socket Yamaichi IC149 - 064 FLS007-3003-0 ICP-064-2 FPS009-230
Contextual Info: IC149 Series | YAMAICHI ELECTRONICS Skip the Header Menu and the body text, and get to the Main Menu. Skip the Header Menu and get to the body text. Japanese | Our Worldwide Sites Search Skip the body text and get to the Main Menu. QFP 1 of 11 6/23/2005 2:02:35 PM

IC189

Abstract: IC189-0562-067 Layouts IC189 Series SOP 56 socket IC189-0562-078 IC189-0482-077 IC189-0702-074 IC189-0482-094 yamaichi IC Test Socket
Contextual Info: SOPP / SOIC TyOpyppeenI To&&opII IC189 Series Socket Series Insulation Resistance: Withstanding Voltage: Contact Resistance: Operating Temperature: No. of Leads No. of Sides with Contacts Design No. Inline Memory Modules Positioning Pin N: Without Positioning Pin

IC A 103 GF

Abstract: IC189 yamaichi IC Test Socket
Contextual Info: Yamaichi's IC189 SOP/SOIC Socket for Test & Burn-In Specifications: Insulation Resistance: 1,000M ohms minimum @ 500VDC Withstanding Voltage: 700 VAC for one minute Contact Resistance: 30 ohms max. @ 10mA/20mV Operating Temperature: -40 to +150C Body Material: PEI GF UL94V-0

Contextual Info: IC299 S e rie s IC299-100 30 Socket Series No. of Leads H Design N a } - Insulation Resistance: I.OOOMQminimum at 500 VDC W ithstanding Voltage: 500 VAC for 1 Minute Contact Resistance: Operating Temperature: 30mQ max. at 10mA/20mV Initial -30"C - +125‘C

SMD MARKING CODE 071 A01

Abstract: smd code 38P LGA 1155 PIN diagram MARKING CODE SMD IC A08 L QUAD Aluminum nitride smd marking m05 LGA 1155 Socket PIN diagram pitch 0.4 QFP 256p marking code smd fujitsu Texas Instruments epoxy Sumitomo
Contextual Info: To Top Contents Safety Precautions 1 Introduction to Packages 1.1 Overview 1.2 Package Lineup 1.3 Package Forms 1.4 Package Structures 1.5 How Package Dimensions Are Indicated 1.6 Package Codes 1.7 Marking 1.8 Future Trends in Packages 2 Package Mounting Methods

LGA 1155 Socket PIN diagram

Abstract: marking code smd fujitsu Yamaichi ic354 marking code smd semiconductor fujitsu pitch 0.4 QFP 256p SMD transistor M05 YAMAICHI ic234 smd code 38P fpq-144-0.5-03 smd p08
Contextual Info: Preface Thank you for your continuing loyalty to Fujitsu's semiconductor products. Electronic equipment is continually becoming smaller, lighter, and less expensive while also growing more advanced in terms of function and performance. As a result, applications for semiconductor devices such as IC and

Contextual Info: PR51 Series CiwarterlsBcs Insulation Resistance: Contact Resistance: <100MQ 10MQ at 500 VD C Operating Temperature: -40'C - +140'C (Material) Base Material: Contact: Natural or Black Ultem Fully Hardened BeCu Plating: Gold over Nickel (Description} Socket test probes are used in conjunction with your board tester to ensure reliability of your bum-in or test board prior

Yamaichi ic354

Abstract: IC354 IC51-2084-1052-36 IC51-0484-806 Enplas OTS-32-0.5-01 sumitomo 3m Enplas fpq 352 IC235-0442 fpq-64-0.5-06 Enplas fpq 240
Contextual Info: This version: Apr. 2001 Previous version: Jun. 1997 PACKAGE INFORMATION 8. RELATED INFORMATION This document is Chapter 8 of the package information document consisting of 8 chapters in total. PACKAGE INFORMATION 8. RELATED INFORMATION 8. RELATED INFORMATION

80P6S

Abstract: IC51-0804-808 80D0 Universal Electronics
Contextual Info: To our customers, Old Company Name in Catalogs and Other Documents On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology Corporation, and Renesas Electronics Corporation took over all the business of both companies. Therefore, although the old company name remains in this document, it is a valid

NP89-44111-G4

Abstract: NP89-21004-G4 11X11 10X10 NP89-44111 yamaichi IC Test Socket NP89-28906-G4
Contextual Info: Yamaichi's NP89 Socket for Test & Burn-In Specifications: Insulation Resistance: 1,000M ohms minimum @ 500VDC Withstanding Voltage: 700 VAC for one minute Contact Resistance: 30 ohms max. @ 10mA/20mV Operating Temperature: -55 to +170C Body Material: PEI GF UL94V-0

NEC semiconductor land pattern dimensions

Abstract: renesas 64 QFP
Contextual Info: To our customers, Old Company Name in Catalogs and Other Documents On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology Corporation, and Renesas Electronics Corporation took over all the business of both companies. Therefore, although the old company name remains in this document, it is a valid