WAFER MSL Search Results

EPIC-1S

Abstract: WAFER SN74ACT245 wafer fab control plan
Contextual Info: TEXAS INSTRUMENTS Initial Notification for the Planned 150mm Diameter Wafer Qualification of the Sherman, Texas Wafer Fab December 8, 1998 Abstract The Texas Instruments Wafer Fabrication Facility in Sherman, Texas SFAB plans to convert the wafer diameter from 125mm to 150mm for the EPIC-1S wafer fabrication technology. The product

Precon

Abstract: 857916 ACT245 EN-4088Z SN74ACT245N EPIC-1S
Contextual Info: TEXAS INSTRUMENTS Final Notification for the 150mm Diameter Wafer Qualification of the Sherman, Texas Wafer Fab February 19, 1999 Abstract The Texas Instruments Wafer Fabrication Facility in Sherman, Texas SFAB has completed the qualification to convert the wafer diameter from 125mm to 150mm for the EPIC-1S wafer fabrication

508 531 02 48

Abstract: SN74ABT2245
Contextual Info: TEXAS INSTRUMENTS Final Notification for the 200mm Diameter Wafer Qualification of the Freising, Germany Wafer Fab June 27, 1997 Abstract As previously notified in May by PCN 5300, the Texas Instruments Wafer Fabrication Facility in Freising, Germany FFAB has qualified the convertion of the wafer diameter from 150mm to 200mm

SN74LS04N

Abstract: TL04ACN MC3403N SN74F04N UA9636ACP OI Bipolar Logic Qualification
Contextual Info: TEXAS INSTRUMENTS Initial Notification of Mitsubishi Silicon of America MSA Second Source Wafer Qualification for Starting 125mm Substrates in Sherman, Texas Wafer Fab February 5, 1999 Abstract The Texas Instruments Wafer Fabrication Facility in Sherman, Texas (SFAB) plans to qualify

UN-D1400

Abstract: WLCSP stencil design AN10439 EIA541 IEC60286 WLCSP chip mount Service Manual smd rework station Wafer Level Chip Size Package und14
Contextual Info: AN10439 Wafer Level Chip Size Package Rev. 03 — 17 October 2007 Application note Document information Info Content Keywords wafer, level, chip-scale, chip-size, package, WLCSP Abstract This application note provides guidelines for the use of Wafer Level Chip

74LS04D

Abstract: mitsubishi lot code HBM 00-01 74ls04d datasheet TI Ji Bipolar LINEAR TECHNOLOGY date code JI Bipolar 500 mold compound JI Linear Bipolar Products TL 170C
Contextual Info: TEXAS INSTRUMENTS Final Notification of Mitsubishi Silicon of America MSA Second Source Wafer Qualification for Starting 125mm Substrates in Sherman, Texas Wafer Fab July 22, 1999 Abstract The Texas Instruments Wafer Fabrication Facility in Sherman, Texas (SFAB) has qualified Mitsubishi

SN74ACT16245DL

Abstract: act16245 texas cmos SN74ACT16245D EN-4088Z SN74HC00N SN74HC42D TEXAS INSTRUMENTS, Mold Compound TS-095 cmos testing abstract
Contextual Info: TEXAS INSTRUMENTS Notification of Wafer Thickness Reduction from 15 and 13 Mils to 11 Mils December 5, 1996 Abstract Texas Instruments Advanced System Logic is reducing wafer thickness from 15 and 13 mils to 11 mils for all CMOS and BiCMOS technologies in all Wafer Fabrication Sites producing these

IPC-6012

Abstract: IPC-D-279 IPC-6013 IPC-6016 IPC-2223 ipc 7094 IPC-7094 IPC-2226 IPC-6011 IPC-7525
Contextual Info: Maxim > App Notes > General Engineering Topics Prototyping and PC- Board Layout Wireless and RF Keywords: chip scale package, flip chip, CSP, UCSP, U- CSP, BGA, WLCSP May 01, 2008 APPLICATION NOTE 1891 Wafer-level packaging WLP and its applications Abstract: This application note discusses Maxim's wafer-level package (WLP). Topics include: wafer construction, tape-and-reel

Nihon handa rx303-92skho

Abstract: RX303-92SKHO VMMK-125 0402 land pattern INCOMING INSPECTION solder paste recommended land pattern for 0402 cap WLCSP stencil design VMMK-1225 AV02-1078EN land pattern for WLCSP
Contextual Info: VMMK-1225 production assembly process Application Note 5378 Description Package Features Avago Technologies has combined our industry leading EpHEMT technology with a revolutionary wafer level chip scale package design WLCSP . This wafer level chip scale

CARSEM

Abstract: 225E-01 0.5um ICC03290 MP8000C 84-1-lmis-r4 tsmc cmos model tsmc Activation Energy HRS100
Contextual Info: Reliability Engineering Tucson Corporation Analytical Services Qualification Description: Qualify new model. Model: RA: PA: Date: Die Name: Die Size: Mask Revision: Wafer Fab Site: Process: Technology: Metal 1: Metal 2: Metal 3: Passivation: HTOL assem/wafer/lot :

Ablebond 84-1*SR4

Abstract: z9925 EIAJ ED-4701 MARK A48 857L TSMC 0.35um Volt, SPDM, CMOS 98068A 0.6 um cmos process ablebond 84-1lmisr4
Contextual Info: Reliability Summary Report PI6CV857A August 28, 2002 Reliability by Design Page 1 of 20 INDEX: Commitment to Quality: Page 3 Product Family and Wafer Fab Process: Page 4 Wafer Fab Subcontractors and Codes: Page 4 Standard Package Type Code and Dimensions:

Contextual Info: AN-617 Application Note One Technology Way • P.O. Box 9106 • Norwood, MA 02062-9106, U.S.A. • Tel: 781.329.4700 • Fax: 781.461.3113 • www.analog.com Wafer Level Chip Scale Package by the Wafer Level Package Development Team GENERAL DESCRIPTION PURPOSE

TL062p

Abstract: TL084IDR TL084ACDR TL082BCDR TL082BCP TL084ACD TL082ACP TL082BCD TL084IN TL084BCD
Contextual Info: TEXAS INSTRUMENTS Notification of the Excalibur-1 Process in SFAB October 7, 1997 Abstract Texas Instruments Standard Linear and Logic has completed qualification for wafer sourcing of Excalibur-1 Process in the Sherman Wafer Fabrication site SFAB in Sherman, Texas. Reference

201676B

Contextual Info: APPLICATION NOTE Wafer Level Chip Scale Packages: SMT Process Guidelines and Handling Considerations Introduction The Skyworks Wafer Level Chip Scale Package WLCSP is a bumped die solution that can be used for in-module and/or standalone applications. WLCSP packaging technology is applied

SAC1205

Abstract: IPC-A-600G IPC-6012 WLCSP stencil design JESD-B111 AN3846 sac105 IPC 6012 WLCSP smt IPC-6016
Contextual Info: Freescale Semiconductor Application Note AN3846 Rev. 2.0, 8/2009 Wafer Level Chip Scale Package WLCSP 1 Purpose The purpose of this Application Note is to outline the basic guidelines to use the Wafer Level Chip Scale Package (WLCSP) to ensure consistent Printed Circuit Board (PCB)

sn1035

Abstract: TL062P TL082BCDR TL084IN TL082ACP TL082BCD TL082BCP TL084BCD TL084ACDR SN103658DR
Contextual Info: TEXAS INSTRUMENTS Notification of the Excalibur-1 Process in SFAB June 3, 1997 Abstract Texas Instruments Standard Linear and Logic has qualified wafer sourcing of Excalibur-1 Process in the Sherman Wafer Fabrication site SFAB in Sherman, Texas. At present, these wafers are fabricated

EPIC-1ZS

Abstract: texas cmos databook ir 4310 50C24 CBT16211DL EN-4088Z SN74CBT16211DL texas cmos 50C24.1 texas instrument
Contextual Info: TEXAS INSTRUMENTS Notification for the Addition of EPIC-1ZS CMOS Process to the Lubbock Wafer Fabrication Site April 17, 1998 Abstract Texas Instrument’s Lubbock Wafer Fabrication Facility has successfully completed Texas Instrument’s qualification requirements for the manufacture of products using the EPIC-1ZS CMOS

SN75ALS172DW

Abstract: SG3524N SN75ALS172N sn75als174dw TL092CP SN75ALS174DWR TL494CN TL1555P TL1555 285K
Contextual Info: TEXAS INSTRUMENTS Informational Notification of Offload of Product to SFAB from HIJI June 30, 1999 Abstract Texas Instruments Standard Linear and Logic is continuing to move the manufacture of several device types to the Sherman Wafer Fabrication site SFAB in Sherman, Texas from the HIJI Wafer

TSMC 0.35um

Abstract: ED-4701-3-B122A tsmc 0.35 um CMOS gate area PBGA 256 reflow profile Volt, SPDM, CMOS ED-4701-1-C111A ISO-9000 PI7C7300 PI7C8150-33 PI7C8152
Contextual Info: Reliability Summary Report PCI Bridge Products March 20, 2003 Updated Total Life Test Hours Reliability by Design Page 1 of 16 INDEX: Commitment to Quality: Page 3 Product Family and Wafer Fab Process: Page 4 Wafer Fab Subcontractors and Codes: Page 4 Standard Package Type Code and Dimensions:

rdl 117

Abstract: SENJU SOLDER PASTE rdl 117-a wcsp reliability IPC9701 MO-211 solder paste senju snpb wcsp package reliability
Contextual Info: Application Report SBVA016 – September 2003 NanoStar Wafer Chip-Scale Package Design Ray Crampton, Jim Rosson High-Performance Analog Products ABSTRACT To satisfy market demand for an ultra-small, staggered 5-ball wafer-level chip-scale WCSP package, Texas Instruments has introduced the 170µm NanoStar™ YEQ

ASL3C

Abstract: ALVCH16245 151x24
Contextual Info: TEXAS INSTRUMENTS Initial Notification for the ASL3C Process with Retrograde Well to the Freising, Germany Wafer Fabrication Site November 19, 1998 Abstract Texas Instrument’s Friesing, Germany Wafer Fabrication Facility is qualifying the ALS3C process with retrograde well. This process change will affect all products in the ALVCH product family.

TL783CKC

Abstract: QTS06450
Contextual Info: TEXAS INSTRUMENTS Final Notification for the Addition of BIDFET Process to the Sherman Wafer Fabrication Site and Die Revision for TL783CIN July 27, 1998 Abstract Texas Instrument’s Sherman Wafer Fabrication Facility has successfully completed Texas Instrument’s qualification requirements for the manufacture of products using the BIDFET process. The

EPIC-1S

Abstract: 74ACT245 EN-4088Z SN74ACT245N EN4088Z
Contextual Info: TEXAS INSTRUMENTS Notification for the Addition of CMOS Process to the Sherman Wafer Fabrication Site November 26, 1996 Abstract Texas Instrument’s Sherman Wafer Fabrication Facility has qualified the EPIC-1S CMOS process. The HC, AC, ACT, LV, AHCT and AHC product families are produced from this process and may be

4780

Abstract: CDSOD323 material declaration
Contextual Info: MATERIAL DECLARATION SHEET Material Number CDSOD323 Series Product Line Diode Products Compliance Date 1 Jan 2006 RoHS Compliant Yes No. Construction Element subpart MSL Homogeneous Material 1 Material weight [g] 1 Lead Frame Lead Frame 2 Die Silicon Wafer