TSOP TYPE II Search Results

ZS32

Contextual Info: Package Diagram Thin Small Outline Packages, Type II 32-Lead TSOP II ZS32 1

MT28F004B5

Abstract: MT28F400B5 Micron 4Mb NOR FLASH MT28F400B5SG-8B
Contextual Info: 4Mb SMART 5 BOOT BLOCK FLASH MEMORY FLASH MEMORY MT28F004B5 MT28F400B5 5V Only, Dual Supply Smart 5 0.3µm Process Technology FEATURES 40-Pin TSOP Type I 48-Pin TSOP Type I • Seven erase blocks: 16KB/8K-word boot block (protected) Two 8KB/4K-word parameter blocks

Contextual Info: 4Mb SMART 3 BOOT BLOCK FLASH MEMORY FLASH MEMORY MT28F004B3 MT28F400B3 3V Only, Dual Supply Smart 3 FEATURES 40-Pin TSOP Type I 48-Pin TSOP Type I • Seven erase blocks: 16KB/8K-word boot block (protected) Two 8KB/4K-word parameter blocks Four main memory blocks

Contextual Info: 8Mb SMART 3 BOOT BLOCK FLASH MEMORY FLASH MEMORY MT28F008B3 MT28F800B3 3V Only, Dual Supply Smart 3 FEATURES 40-Pin TSOP Type I 48-Pin TSOP Type I • Eleven erase blocks: 16KB/8K-word boot block (protected) Two 8KB/4K-word parameter blocks Eight main memory blocks

MT28F008B3

Abstract: MT28F800B3
Contextual Info: 8Mb SMART 3 BOOT BLOCK FLASH MEMORY FLASH MEMORY MT28F008B3 MT28F800B3 3V Only, Dual Supply Smart 3 FEATURES 40-Pin TSOP Type I 48-Pin TSOP Type I • Eleven erase blocks: 16KB/8K-word boot block (protected) Two 8KB/4K-word parameter blocks Eight main memory blocks

MT28F002B3

Abstract: MT28F200B3
Contextual Info: 2Mb SMART 3 BOOT BLOCK FLASH MEMORY FLASH MEMORY MT28F002B3 MT28F200B3 3V Only, Dual Supply Smart 3 FEATURES 40-Pin TSOP Type I 48-Pin TSOP Type I • Five erase blocks: 16KB/8K-word boot block (protected) Two 8KB/4K-word parameter blocks Two main memory blocks

Contextual Info: 4Mb SMART 5 BOOT BLOCK FLASH MEMORY FLASH MEMORY MT28F004B5 MT28F400B5 5V Only, Dual Supply Smart 5 FEATURES 40-Pin TSOP Type I 48-Pin TSOP Type I • Seven erase blocks: 16KB/8K-word boot block (protected) Two 8KB/4K-word parameter blocks Four main memory blocks

MT28F002

Abstract: MT28F200B5SG-6B MT28F002B5 MT28F200B5
Contextual Info: 2Mb SMART 5 BOOT BLOCK FLASH MEMORY FLASH MEMORY MT28F002B5 MT28F200B5 5V Only, Dual Supply Smart 5 FEATURES 40-Pin TSOP Type I 48-Pin TSOP Type I • Five erase blocks: 16KB/8K-word boot block (protected) Two 8KB/4K-word parameter blocks Two main memory blocks

051C

Contextual Info: ISSI PACKAGING INFORMATION Plastic TSOP - 24/28-pins Package Code: T Type II N N/2+1 E 1 N/2 D SEATING PLANE H A e B L A1 α C Plastic TSOP (T—Type II) Millimeters Inches Min Max Min Max Symbol Ref. Std. No. Leads 24/28 A 1.00 1.20 A1 0.05 0.20 B 0.36

IC369

Abstract: socket Yamaichi IC 2267
Contextual Info: IC369 Series Open Top Thin Small Outline Package (TSOP - Type II) Part Number (Details) Specifications Insulation Resistance: Dielectric Withstanding Voltage: Contact Resistance: Operating Temperature Range: Mating Cycles: Contact Force: 1,000M Ω min. at 500V DC

Contextual Info: Cypress Semiconductor Qualification Report QTP# 98109 VERSION 1.1 June, 2000 44 Ld TSOP Type II Package Cypress Philippines Assembly CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA: Ed Russell Reliability Director 408 432-7069 Cypress Semiconductor Assembly: Cypress Philippines

IC51-0242-1006-1

Abstract: TSOP 44 socket IC51-0482-2018 TSOP 48 socket ic 4008 0262 IC51-0322-1207-1 IC51-0282-1032-1 IC51-0322-1031-1 IC51-0322-1219
Contextual Info: IC51 - Clamshell Thin Small Outline Package TSOP Type I and II Part Number (Details) Specifications 1,000M Ω min. at 500V DC Insulation Resistance: Dielectric Withstanding Voltage: 700V AC for 1 minute 30m Ω max. at 10mA/20mV max. Contact Resistance:

TSOP 50 socket

Abstract: IC51-0442-1709 IC51-0262-1339 IC51-0502-1708
Contextual Info: IC51 - Clam shel l Thi n Sm all Out line Package TSOP Type II Part Number (Details) Specifications Insulation Resistance: Dielectric Withstanding Voltage: Contact Resistance: Operating Temperature Range: Mating Cycles: 1,000MΩ min. at 500V DC 700V AC for 1 minute

IC51-0202-347

Abstract: IC51-0202-1026 CLAMSHELL socket Yamaichi ic51 IC51-0202-932-1 IC51 IC51-0202-714 IC51-0222-803 IC51-0242-308 IC51-0242-310-1
Contextual Info: IC51 Series Clamshell SOP, SSOP and TSOP (Type I and II) Part Number (Details) Specifications 1,000M Ω min. at 500V DC Insulation Resistance: Dielectric Withstanding Voltage: 700V AC for 1 minute 30m Ω max. at 10mA/20mV max. Contact Resistance: Operating Temperature Range: –40°C to +150°C (type PSF)

Contextual Info:
     
 
 

 Figure 12: 28-Lead 8x13.4mm Plastic Thin Small Outline Package TSOP Type I (E) Table 13: Plastic Thin Small Outline Package (TSOP) Type I (E) Dimensions INCHES Min Nom Max Min Nom Max
 

Contextual Info: EXTENDED TEMPERATURE BOOT BLOCK FLASH MEMORY MT28F400B1 VET, MT28F800B1 VET, MT28F004B1 VET, MT28F008B1 VET FLASH MEMORY Low Voltage, Extended Temperature FEATURES PIN ASSIGNMENT Top View 40-Pin TSOP Type I (C-2) • Extended temperature range operation:

IC51-0162-150

Abstract: IC51-0082-763 IC51-0242-1341 IC51-0562-1514 IC53-0642-911 IC51-0202-779 IC51-0322-667 IC51-0382-2036 IC51-0482-2018 IC51-0562-2144
Contextual Info: Series Overview *SOP Small Outline Packages, Gullwing Leads SMT Devices *SOP variations e.g. TSSOP. Series IC51 (Clamshell) SOP, TSOP Type I & II 0.4 to 1.27mm Pitch Part Number (Details) Specifications Insulation Resistance: 1,000MΩ min. at 500V DC Dielectric Withstanding Voltage: 700V AC for 1 minute

IC369

Abstract: IC 2267
Contextual Info: IC369 Series Open Top Thin Small Outline Package (TSOP) - Type II Part Number (Details) Specifications 1,000M Ω min. at 500V DC 700V AC for 1 minute 30m Ω max. at 10mA / 20mV max. –40°C to +150°C 10,000 insertions min. 45g ±15g per pin Insulation Resistance:

TSOP 54 PIN

Contextual Info: PACKAGING INFORMATION Plastic TSOP 54–Pin, 86-Pin Package Code: T Type II N N/2+1 Notes: 1. Controlling dimension: millimieters, unless otherwise specified. 2. BSC = Basic lead spacing between centers. 3. Dimensions D and E1 do not include mold flash protrusions and should be

Contextual Info: DISTINCTIVE CHARACTERISTICS • Single 3.0 V read, write, and erase Minimizes system level power requirements • Compatible with JEDEC-standard commands Uses same software commands as E2PROMs • Compatible with JEDEC-standard word-wide pinouts 48-pin TSOP Package suffix: PFTN - Normal Bend Type, PFTR - Reversed Bend Type

29F800TA

Abstract: 29f800ba MBM29F800 29F800T
Contextual Info: • FEATURES • Single 5.0 V read, write, and erase Minimizes system level power requirements • Compatible with JEDEC-standard commands Uses same software commands as E2PROMs • Compatible with JEDEC-standard world-wide pinouts 48-pin TSOP I (Package suffix: PFTN - Normal Bend Type, PFTR - Reversed Bend Type)

66 pin tsop package

Abstract: tsop 66
Contextual Info: ISSI PACKAGING INFORMATION Plastic TSOP 66-pin Package Code: T Type II N N/2+1 E1 E Notes: 1. Controlling dimension: millimieters, unless otherwise specified. 2. BSC = Basic lead spacing between centers. 3. Dimensions D and E1 do not include mold flash protrusions and should be

TSOP 48 thermal resistance

Abstract: 130C 8361H CY62148 CY62148V JESD22 tsop package MSL
Contextual Info: Cypress Semiconductor Package Qualification Report QTP# 000805 VERSION 1.0 October 2000 32 Lead 400 mil TSOP type ll package and Moisture Level 3 Chip Pac Hyundai Korea CYPRESS TECHNICAL CONTACT FOR QUALITFICATION DATA: Ed Russell Reliability Director (408) 432–7069

IC 4407

Abstract: IC235 TSOP 54 socket IC235-0442-207 4407 pin details 4407 TSOP 50 socket IC235-0542-218-2 IC235-0242-202 IC235-0082-236
Contextual Info: IC235 Series Open Top Thin and Small Outline Package (TSOP -Type II / SOP) Part Number (Details) Specifications 1,000M Ω min. at 500V DC 700V AC for 1 minute 30m Ω max. at 10mA/20mV max. –40°C to +150°C 10,000 insertions min. 30g min. per pin at minimum