TECHNICAL DATASHEET DS56 Search Results

Technical DS56

Abstract: DS56 JESD22 PH01 PM01 PR01
Contextual Info: Technical Datasheet DS56 power light source LUXEON Rebel Introduction LUXEON® Rebel is an ultra compact, surface mount, high power LED that delivers elevated standards for light output, flux density and manufacturability. Offering industry leading flux density, lumens per

LUXEON Rebel Cyan Green LED

Abstract: ph01 LUXEON Rebel LED DS56 IEC825 JESD22 PM01 PR01 LED rebel PWN1
Contextual Info: Technical Datasheet DS56 power light source LUXEON Rebel Introduction LUXEON® Rebel is an ultra compact, surface mount, high power LED that delivers elevated standards for light output, flux density and manufacturability. Offering industry leading flux density, lumens per

LUXEON Rebel LED

Abstract: LUXEON Rebel Cyan Green LED Technical Datasheet DS56 Aluminum Base 3 LED emitters PCB luxeon Rebel PC Amber pulse 0030 DS56 IEC825 JESD22 PH01
Contextual Info: Technical Datasheet DS56 power light source LUXEON Rebel Introduction LUXEON® Rebel is an ultra compact, surface mount, high power LED that delivers elevated standards for light output, flux density and manufacturability. Offering industry leading flux density, lumens per

DFM1200FXS12-A000

Abstract: DFM1200FXS12-A fast recovery diode 600v 1200A mj 13005
Contextual Info: DFM1200FXS12-A000 Fast Recovery Diode Module Replaces DS5645-1.1 FEATURES Low Reverse Recovery Charge High Switching Speed Low Forward Volt Drop DS5845-2 April 2010 LN26743 KEY PARAMETERS VRRM VF IF IFM 1200V 1.9V 1200A 2400A (typ) (max) (max) Isolated Cu Base with Al2O3 Substrates

Contextual Info: DFM1200FXS12-A000 Fast Recovery Diode Module Replaces DS5645-1.1 FEATURES Low Reverse Recovery Charge High Switching Speed Low Forward Volt Drop DS5845-2 April 2010 LN26743 KEY PARAMETERS VRRM VF IF IFM 1200V 1.9V 1200A 2400A (typ) (max) (max) Isolated Cu Base with Al2O3 Substrates

DFM1200FXS12-A000

Contextual Info: DFM1200FXS12-A000 Fast Recovery Diode Module DS5645-1.1 June 2007 LN25322 FEATURES • Low Reverse Recovery Charge • High Switching Speed • Low Forward Voltage Drop • Isolated Copper Base plate • Dual Diodes Can be paralleled for 2400A Rating •

Contextual Info: MT92220 Carrier Class VoIP Processor Advance Datasheet DS5659 Introduction ISSUE 1 December 2001 Features The MT92220 is an assembly and disassembly engine that can convert up to 1023 full-duplex TDM voice channels to IP packets or AAL2 cells, according to the H.225 and I.363.2 standards. The device

LAN switch with HDLC

Abstract: hdlc mii to hdlc MT92210 MT92220 RFC1889 RFC768
Contextual Info: MT92220 Carrier Class VoIP Processor Advance Datasheet DS5659 Introduction ISSUE 1 December 2001 Features The MT92220 is an assembly and disassembly engine that can convert up to 1023 full-duplex TDM voice channels to IP packets or AAL2 cells, according to the H.225 and I.363.2 standards. The device

Contextual Info: DIM600DCM17-A000 IGBT Chopper Module DS5607- 4.1 March 2007 FEATURES 10µs Short Circuit Withstand Non Punch Through Silicon Isolated AlSiC Baseplate with AIN substrate High Thermal Cycling Capability KEY PARAMETERS VCES VCE sat * (typ) IC (max) IC(PK) (max)

DIM600DCS17-A000

Contextual Info: DIM600DCS17-A000 IGBT Chopper Module DS5607- 2.1 March 2006 FEATURES • 10µs Short Circuit Withstand • Non Punch Through Silicon • Isolated Copper Baseplate • Lead Free construction KEY PARAMETERS VCES VCE sat * (typ) IC (max) IC(PK) (max) (LN24484)

dynex igbt 1200v

Abstract: DIM400WHS17-A000
Contextual Info: DIM400WHS17-A000 Half Bridge IGBT Module DS5690-1.3 July 2007 LN25359 FEATURES Non Punch Through Silicon Isolated Copper Baseplate 10 s Short Circuit Withstand KEY PARAMETERS VCES VCE (sat) (typ) IC (max) IC(PK) (max) 1700V 2.7 V 400A 800A Lead Free construction

mii to hdlc

Abstract: MT92210 LAN switch with HDLC
Contextual Info: MT92210 Carrier Class VoIP Processor Advance Datasheet DS5660 Introduction ISSUE 1.0 December 2001 Features The MT92210 is an assembly and disassembly engine that can convert up to 1023 full-duplex TDM voice channels to IP packets and back, according to the H.225 standard. The device communicates via

Contextual Info: MT92210 Carrier Class VoIP Processor Advance Datasheet DS5660 Introduction ISSUE 1.0 December 2001 Features The MT92210 is an assembly and disassembly engine that can convert up to 1023 full-duplex TDM voice channels to IP packets and back, according to the H.225 standard. The device communicates via

DIM200WLS17-A000

Abstract: 12v AC to DC CIRCUIT DIAGRAM transistor 9009
Contextual Info: DIM200WLS17-A000 Chopper Module - Lower Arm Control DS5698-1.2 July 2007 LN25358 FEATURES Non Punch Through Silicon Isolated Copper Baseplate 10 s Short Circuit Withstand Lead Free construction KEY PARAMETERS VCES VCE (sat)* (typ) IC (max) IC(PK) (max) 1700V

DIM200WKS17-A000

Abstract: transistor 9009
Contextual Info: DIM200WKS17-A000 Chopper Module - Upper Arm Control DS5699-1.2 July 2007 LN25361 FEATURES Non Punch Through Silicon Isolated Copper Baseplate 10 s Short Circuit Withstand Lead Free construction KEY PARAMETERS VCES VCE (sat)* (typ) IC (max) IC(PK) (max) 1700V

DIM400BSS12-A000

Contextual Info: DIM400BSS12-A000 Single Switch IGBT Module DS5672-4.1 June 2007 LN25349 FEATURES 10 s Short Circuit Withstand Non Punch Through Silicon Isolated Copper Baseplate KEY PARAMETERS VCES VCE (sat) * (typ) IC (max) IC(PK) (max) 1200V 2.2 V 400A 800A *(Measured at the power bus-bars and not the auxiliary

DIM600BBS17-A000

Contextual Info: DIM600BBS17-A000 Single Switch IGBT Module DS5692-1.3.0 June 2007 LN25344 FEATURES • 10 s Short Circuit Withstand • Non Punch Through Silicon • Isolated Copper Baseplate KEY PARAMETERS VCES (typ) VCE (sat) * IC (max) IC(PK) (max) 1200V 1.7 V 600A

DIM400BSS17-A000

Contextual Info: DIM400BSS17-A000 Single Switch IGBT Module DS5674-2.3 June 2007 LN25344 FEATURES 10 s Short Circuit Withstand Non Punch Through Silicon Isolated Copper Baseplate KEY PARAMETERS VCES VCE (sat) * (typ) IC (max) IC(PK) (max) 1700V 2.7 V 400A 800A *(Measured at the power bus-bars and not the auxiliary

DIM600BSS17-A000

Contextual Info: DIM600BSS17-A000 Single Switch IGBT Module DS5692-1.4.0 September 2007 LN25581 FEATURES 10 s Short Circuit Withstand Non Punch Through Silicon Isolated Copper Baseplate KEY PARAMETERS VCES VCE (sat) * (typ) IC (max) IC(PK) (max) 1700V 2.7 V 600A 1200A *(Measured at the power bus-bars and not the auxiliary

DIM200PHM33-F000

Abstract: ge traction motor DS5606-1
Contextual Info: DIM200PHM33-F000 DIM200PHM33-F000 Half Bridge IGBT Module Preliminary Information DS5606-1.2 June 2003 FEATURES • Soft Punch Through Silicon ■ 10µs Short Circuit Withstand ■ Isolated MMC Base with AlN Substrates ■ High Thermal Cycling Capability APPLICATIONS

DIM200WLS12-A000

Contextual Info: DIM200WLS12-A000 IGBT Chopper Module – Lower Arm Control DS5697-3.1 July 2007 LN25356 FEATURES Non Punch Through Silicon Isolated Copper Baseplate 10 s Short Circuit Withstand Lead Free construction KEY PARAMETERS VCES VCE (sat) * (typ) IC (max) IC(PK)

DIM400GCM33-A000

Contextual Info: DIM400GCM33-A000 DIM400GCM33-A000 IGBT Chopper Module DS5613-1.1 June 2003 FEATURES • Non Punch Through Silicon ■ 10µs Short Circuit Withstand ■ Isolated MMC Base with AlN Substrates ■ High Thermal Cycling Capability KEY PARAMETERS VCES VCE sat *

DIM1200DDM17-E000

Abstract: 5200A
Contextual Info: DIM1200DDM17-E000 Preliminary Information DIM1200DDM17-E000 Dual Switch IGBT Module Preliminary Information DS5603-1.4 June 2003 FEATURES • Trench Gate Field Stop Technology ■ Low Conduction Losses ■ Low Switching Losses KEY PARAMETERS VCES typ VCE(sat) *

LAN switch with HDLC

Contextual Info: MT92220 Carrier Class VoP Processor Data Sheet DS5659 Introduction ISSUE 1 December 2001 Features The MT92220 is an assembly and disassembly engine that can convert up to 1023 full-duplex TDM voice channels to IP packets or AAL2 cells, according to the H.225 and I.363.2 standards. The device